公开(公告)号：JP2010018719A

公开(公告)日：2010-01-28

申请号：JP2008180913

申请日：2008-07-11

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SUEYOSHI TAKASHI ,  SAITO SEIICHI

IPC: C08L83/05 ,  C08L83/07 ,  H01L23/29 ,  H01L23/31 ,  H01L33/48

Abstract: PROBLEM TO BE SOLVED: To provide a silicon-containing curable composition which is hardly discolored due to light deterioration or thermal deterioration and is made hard, to which dust is hardly stuck and which is useful as electric/electronic materials, particularly as a sealing agent for a light emitting element. SOLUTION: The silicon-containing curable composition contains: as a component (A), a prepolymer which is obtained by subjecting a cyclic siloxane compound having two or more Si-H groups in one molecule thereof and a trivinylcyclohexane compound to a hydrosilylation reaction by such a ratio that two or more Si-H groups remains in one molecule of the prepolymer and which has two or more Si-H groups in one molecule thereof; as a component (B), a cyclic siloxane compound having two or more carbon-carbon double bonds, each of which has reactivity with the Si-H group, in one molecule thereof; and as a component (C), a hydrosilylation catalyst. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种由于光劣化或热劣化而几乎不变色并且难以粘附的灰尘几乎不粘附并且可用作电/电子材料的含硅可固化组合物，特别是作为电 用于发光元件的密封剂。 解决方案：含硅可固化组合物含有：作为组分（A），通过在一分子中使具有两个或更多个Si-H基团的环状硅氧烷化合物和三乙烯基环己烷化合物进行氢化硅烷化得到的预聚物 通过使一个分子内存在2个以上的Si-H基团而在1分子中具有两个以上的Si-H基的比例进行反应; 作为组分（B），在其一个分子中具有两个或更多个碳 - 碳双键的环硅氧烷化合物各自与Si-H基团具有反应性; 和作为组分（C）的氢化硅烷化催化剂。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009212342A

公开(公告)日：2009-09-17

申请号：JP2008054630

申请日：2008-03-05

Applicant: Adeka Corp ,  Kansai Electric Power Co Inc:The ,  株式会社Adeka ,  関西電力株式会社

Inventor： OKADA SHINICHI ,  SUGAWARA YOSHITAKA ,  KIMURA RYOJI ,  SAITO SEIICHI ,  SUEYOSHI TAKASHI

IPC: H01L23/29 ,  H01L23/31

CPC classification number: H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device can attain high heat resistance and high voltage resistance and improve tight adhesiveness between a cover part for a semiconductor element and a support. SOLUTION: In a semiconductor device, a cover part 15 covering a GTO thyristor element 1 contains a silicon-containing polymer, including a bridged structure using siloxane (Si-O-Si binder) in one or more parts and is formed from a first silicon-containing curable composition containing a patina catalyst, that is a hardening reactive catalyst, and an iron group containing rust. Furthermore, the cover part 15 and a cover part 16, that covers an anode terminal 5 and a gate terminal 8 on a support 11, are formed from a second silicon-containing curable composition, in which alumina fine particles having a grain size of 20 μm are blended as insulated ceramics in the first silicon-containing curable composition at a volume filling factor of 50%. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供半导体器件可以获得高耐热性和高耐压性，并且改善用于半导体元件的盖部件和支撑件之间的紧密粘合性。 解决方案：在半导体器件中，覆盖GTO晶闸管元件1的覆盖部分15包含含硅聚合物，其包含使用硅氧烷（Si-O-Si粘合剂）的一个或多个部分的桥接结构，并由 含有铜绿色催化剂的第一种含硅固化性组合物，即硬化反应催化剂和含有铁锈的铁基团。 此外，覆盖部分15和覆盖阳极端子5和支撑体11上的栅极端子8的覆盖部分16由第二含硅可固化组合物形成，其中粒径为20微米的氧化铝细颗粒 以50％的体积填充系数将μm作为绝缘陶瓷混合在第一含硅可固化组合物中。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008266485A

公开(公告)日：2008-11-06

申请号：JP2007112742

申请日：2007-04-23

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SUEYOSHI TAKASHI ,  HARA KENJI ,  SAITO SEIICHI

IPC: C08G77/14 ,  C08G59/20

CPC classification number: C08G77/50 ,  C08G59/306 ,  C08G59/3254 ,  C08L63/00 ,  C08L83/14

Abstract: PROBLEM TO BE SOLVED: To provide a curable composition in which an obtained cured article is excellent in heat-resistance and flexibility. SOLUTION: The curable composition comprises a silicon-containing compound represented by general formula (0), and 0.01-20 pts.mass of an epoxy-curable compound based on 100 pts.mass of the compound. In general formula (0), Z is a group represented by any one of the formulae (2)-(6). COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 待解决的问题：提供一种固化性组合物，其中得到的固化物的耐热性和柔软性优异。 解决方案：可固化组合物包含由通式（0）表示的含硅化合物和基于100重量份化合物的0.01-20重量份的可环氧固化的化合物。 在通式（0）中，Z为由式（2） - （6）中的任一个表示的基团。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2012067286A

公开(公告)日：2012-04-05

申请号：JP2011180344

申请日：2011-08-22

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SUEYOSHI TAKASHI ,  SAITO SEIICHI

IPC: C08L83/05 ,  C08G77/20 ,  C08L83/07

Abstract: PROBLEM TO BE SOLVED: To provide a curable composition which has excellent heat resistance, toughness and adhesion.SOLUTION: The curable composition contains: (A) a compound having at least two vinyl groups in the molecule; (B) a compound having at least two Si-H groups in the molecule; and (C) a hydrosilylating catalyst, and the compound in the (A) component and/or the compound in the (B) component is the compound having groups expressed by general formula (1) (in the formula, Xdenotes a residue obtained by removing two hydroxyl groups from a 2 to 25C dihydroxyl compound).

Abstract translation: 待解决的问题：提供耐热性，韧性和粘合性优异的固化性组合物。 解决方案：可固化组合物包含：（A）在分子中具有至少两个乙烯基的化合物; （B）分子中具有至少两个Si-H基团的化合物; 和（C）氢化硅烷化催化剂，（A）成分和/或（B）成分中的化合物中的化合物是具有通式（1）表示的基团的化合物（式中，X 1 表示通过从2至25℃的二羟基化合物除去两个羟基而获得的残基）。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2014205823A

公开(公告)日：2014-10-30

申请号：JP2014054840

申请日：2014-03-18

Applicant: 株式会社Adeka ,  Adeka Corp ,  株式会社Adeka

Inventor： SUEYOSHI TAKASHI ,  YOKOTA HIROO ,  SEKINE IZUMI ,  NAGASAKA KAZUKI ,  MATSUMOTO TAKUYA

IPC: C08L83/05 ,  C08L83/07

Abstract: 【課題】耐熱性や耐光性に優れ、酸素や水分の透過性が小さく、電気・電子材料、特に発光素子用封止剤として有用な硬化性組成物を提供すること。【解決手段】一般式(1)で表わされる基同士、又は一般式(1)で表わされる基及び一般式(2)で表わされる基が、一般式(3)〜(7)の何れかで表わされる化合物からビニル基を除いた残基で連結されたシロキサン化合物、(B)成分として、一般式(8)で表わされるシロキサン化合物、及び(C)成分として、ヒドロシリル化触媒を含有し、前記(B)成分の含有量が10質量%以上である硬化性組成物。尚、一般式(1)〜(8)は、本明細書に記載の通りである。【選択図】なし

Abstract translation: 要解决的问题：提供耐热性和耐光性优异的固化组合物，氧或水分的渗透性小，并且可用作电气和电子材料，特别是用于发光体的密封剂。解决方案：提供可固化的 含有由通式（1）表示的基团或由通式（1）表示的基团和由通式（2）表示的基团的硅氧烷化合物的化合物通过其中乙烯基为 不含由通式（3）〜（7）表示的化合物，作为（B）成分的通式（8）表示的硅氧烷化合物，作为（C）成分的氢化硅烷化催化剂， （B）成分为10质量％以上。 式（1）〜（8）如说明书所述。

公开(公告)号：JP2014047181A

公开(公告)日：2014-03-17

申请号：JP2012192456

申请日：2012-08-31

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SUEYOSHI TAKASHI

IPC: C07F7/18

Abstract: PROBLEM TO BE SOLVED: To provide a production method by which a divinyl siloxane compound such as a divinyltrisiloxane is obtained in a high yield without using dimethyl vinyl chlorosilane.SOLUTION: A method of producing a divinyl siloxane compound represented by general formula (3) includes reacting of a silane diol compound with a divinyl siloxane compound by using an alkali metal catalyst. In the general formula(3), Ris an aryl group having 6 to 10 carbon atoms, Ris an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkyl group or a cycloalkenyl group having 5 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an aralkyl group having 7 to 10 carbon atoms, and Rand Rare each independently an alkyl group having 1 to 4 carbon atoms.

Abstract translation: 要解决的问题：提供一种不用二甲基乙烯基氯硅烷可以高产率得到二乙烯基硅氧烷等二乙烯基硅氧烷化合物的制造方法。溶液：由通式（3）表示的二乙烯基硅氧烷化合物的制造方法包括 通过使用碱金属催化剂使硅烷二醇化合物与二乙烯基硅氧烷化合物反应。 在通式（3）中，R 1为具有6至10个碳原子的芳基，R 1为具有1至10个碳原子的烷基，具有2至10个碳原子的烯基，环烷基或环烯基具有5至 10个碳原子，具有6至10个碳原子的芳基或具有7至10个碳原子的芳烷基，Rand Rare各自独立地为具有1至4个碳原子的烷基。

公开(公告)号：JP2013057732A

公开(公告)日：2013-03-28

申请号：JP2011194856

申请日：2011-09-07

Applicant: Adeka Corp ,  株式会社Adeka ,  Sumitomo Electric Ind Ltd ,  住友電気工業株式会社

Inventor： SOMA KAZUYUKI ,  HATTORI TOMOYUKI ,  SUEYOSHI TAKASHI ,  SAITO SEIICHI

IPC: G02B6/44

Abstract: PROBLEM TO BE SOLVED: To provide an optical fiber in which excellent heat resistance and productivity are provided and a microbend loss is suppressed even in a high temperature environment.SOLUTION: An optical fiber 1 has a covering layer 5 formed by crosslinking an energy curable resin composition containing a silicon compound on the outer periphery of a glass fiber 4 made of a core part 2 and a cladding part 3. The silicon compound contains a compound (A) represented by a specific general formula and a compound (B) represented by another specific general formula, and the content of the compound (B) relative to 100 parts by mass of the total amount of the compound (A) and compound (B) is in a range of 10-30 parts by mass.

Abstract translation: 要解决的问题：提供一种提供优异的耐热性和生产率并且即使在高温环境中也能抑制微弯损耗的光纤。 解决方案：光纤1具有通过在由芯部2和包层部3构成的玻璃纤维4的外周交联含有硅化合物的能量固化树脂组合物形成的覆盖层5.硅化合物 含有由特定通式表示的化合物（A）和由另一具体通式表示的化合物（B），化合物（B）的含量相对于化合物（A）的总量100质量份， 化合物（B）的浓度范围为10〜30质量份。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2012144678A

公开(公告)日：2012-08-02

申请号：JP2011006116

申请日：2011-01-14

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SUEYOSHI TAKASHI ,  SAITO SEIICHI

IPC: C08G59/20

CPC classification number: C08G77/38 ,  C08G77/12

Abstract: PROBLEM TO BE SOLVED: To provide a curable composition capable of providing a cured film which is free from surface tackiness, is excellent in heat resistance, and hardly causes crack even when used at high temperature for a long time.SOLUTION: The silicon-containing curable resin composition includes: an epoxysiloxane compound having at least two epoxy-containing groups and a group represented by general formula (1) in one molecule as a component (A); an epoxy siloxane compound having 1-10 silicon atoms and at least two epoxy-containing group in one molecule as a component (B); and an epoxy curable compound as a component (C). In general formula (1), R-R, which may be the same or different, each represent 1-4C alkyl or 6-10C aryl, and a represents an integer of 20-10,000.

Abstract translation: 解决的问题：为了提供能够提供无表面粘性的固化膜的固化性组合物，耐热性优异，即使长时间在高温下使用也难以引起龟裂。 解决方案：含硅可固化树脂组合物包括：具有至少两个含环氧基团的环氧硅氧烷化合物和在一个分子中由通式（1）表示的基团作为组分（A）; 在一个分子中具有1-10个硅原子和至少两个含环氧基团的环氧硅氧烷化合物作为组分（B）; 和作为（C）成分的环氧固化性化合物。 在通式（1）中，可以相同或不同的R 1 -R 4 分别表示1-4C 烷基或6-10C芳基，和a表示20-10,000的整数。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2006283012A

公开(公告)日：2006-10-19

申请号：JP2006061798

申请日：2006-03-07

Applicant: Adeka Corp ,  Kansai Electric Power Co Inc:The ,  株式会社Adeka ,  関西電力株式会社

Inventor： HIWATARI KENICHIRO ,  SUEYOSHI TAKASHI ,  SHANADO TADASHI ,  SHOJI YOSHIKAZU ,  SUGAWARA YOSHITAKA

IPC: C08L83/07 ,  C08L83/05

Abstract: PROBLEM TO BE SOLVED: To provide a silicon-containing curable composition, which is excellent in stability, transparency and curability, and can be used for forming a cured product excellent in various properties such as crack resistance, heat resistance, solvent resistance and alkali resistance. SOLUTION: The silicon-containing curable composition includes at least one silicon-containing polymer among component (A), component (B) and component (C). The component (A) is a silicon-containing polymer having one or more reactive groups selected from the group consisting of Si-CH=CH 2 , Si-R 1 -CH=CH 2 and Si-R 1 -OCOC(R 2 )=CH 2 and having at least one bridging structure by an Si-O-Si bond. The component (B) is a silicon-containing polymer having Si-H group and having at least one bridging structure by an Si-O-Si bond. The component (C) is a silicon-containing polymer having one or more above reactive groups and further an Si-H group and having at least one bridging structure by an Si-O-Si bond. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供稳定性，透明性和固化性优异的含硅可固化组合物，并且可用于形成各种性能如抗裂性，耐热性，耐溶剂性优异的固化产物 和耐碱性。 解决方案：含硅可固化组合物包含组分（A），组分（B）和组分（C）中的至少一种含硅聚合物。 组分（A）是具有一个或多个反应性基团的含硅聚合物，所述反应性基团选自Si-CH = CH ，Si-R 1 = CH 2 和Si-R 1 -OCOC（R SP SP 2）= CH 2 ，并且具有至少一个 通过Si-O-Si键的桥连结构。 组分（B）是具有Si-H基并通过Si-O-Si键具有至少一个桥连结构的含硅聚合物。 组分（C）是具有一个或多个上述反应性基团并且还含有Si-H基并且通过Si-O-Si键具有至少一个桥连结构的含硅聚合物。 版权所有（C）2007，JPO＆INPIT