Abstract:
PROBLEM TO BE SOLVED: To provide a nickel compound which can be transported in a liquid state because of its low melting point, is easily vaporized because of its high vapor pressure, and is suitable as a raw material for depositing a thin film used in a method such as CVD which deposits a thin film by vaporizing a compound (precursor).SOLUTION: The nickel compound is an alkoxide compound represented by general formula (I), wherein Rrepresents a 2-4C linear or branched alkyl group; and Rrepresents a 1-4C linear or branched alkyl group.
Abstract:
PROBLEM TO BE SOLVED: To provide a metal complex having properties suitable for precursors of CVD method and ALD method, especially, excellent melting point, heat resistance and solubility in organic solvents.SOLUTION: The metal complex of a β-ketoimine compound represented by formula (1) (wherein Rand Rare each methyl or ethyl), preferably a metal complex in which a metal atom in the metal complex represented by formula (1) is a metal element of the group 2, especially strontium and the valence of the metal atom is 2, is provided.
Abstract:
PROBLEM TO BE SOLVED: To provide a metal compound that gives a good metal-containing thin film containing little residual carbon and allows a process exhibiting a stable film formation speed and stable controllability of the thin film composition. SOLUTION: The metal compound is represented by general formula (1) (wherein M is titanium, zirconium or hafnium; X is a halogen atom; and m is 1 or 2). COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a process suitable for producing an aluminum thin film by using a vapor evaporated from diisobutyl aluminum hydride; the aluminum thin film obtained by the production method; and a raw material for forming the thin film to be used in the method for producing the aluminum thin film. SOLUTION: The production method comprises the steps of: preparing a vapor containing diisobutyl aluminum hydride obtained by evaporating a raw material containing diisobutyl aluminum hydride for forming the thin film; introducing the vapor onto a substrate in a system to form a thin layer containing aluminum on the substrate; then, discharging a gas remaining in a system; introducing a reductive gas into the system; and exerting the reductive gas and heat on the thin layer containing aluminum to form the aluminum thin film from the previously formed thin film containing aluminum. COPYRIGHT: (C)2007,JPO&INPIT