公开(公告)号：US20200048420A1

公开(公告)日：2020-02-13

申请号：US16660895

申请日：2019-10-23

Applicant: AGC Inc.

Inventor： Tomoya HOSODA ,  Tatsuya TERADA ,  Atsumi YAMABE ,  Nobutaka KIDERA ,  Wataru KASAI

IPC: C08J5/18 ,  C08F214/26 ,  C08J5/24 ,  C08J5/12 ,  H05K3/02 ,  H05K1/03 ,  H05K1/02

Abstract: The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380° C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 μm2 of at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminate 1 has a layer A10 containing said fluororesin and a layer B12 made of another substrate, wherein the layer A10 has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 μm2 of a second surface 10b thereof is measured by an atomic force microscope.