Abstract:
Portable electronic devices having I/O assemblies that can include optical and audio components are described. An exemplary I/O assembly can include a first camera module and a second camera module that can be carried within a camera module housing. A flex connector can carry a strobe that can be positioned between the first camera module and the second camera module. A trim can enclose the first camera, the second camera and the strobe and optically isolates the optical components. An exemplary portable electronic device can include a side wall retainer that defines its perimeter, a front cover glass and a rear cover glass that cooperate to form an enclosure. The I/O assembly can be secured to the enclosure both from inside and outside of the rear cover glass. I/O assembly can also include an audio transducer that can record sound when the camera module are recording videos.
Abstract:
Electronic device housing structures and other structures may be formed from molded plastic. Plastic structures such as injection molding housing structures and other structures may be provided with openings. An opening may have sidewall surfaces. Machining operations and other techniques may be used in forming the openings. Openings may be processed to enhance resistance to stress-induced cracking of the plastic structures along the sidewall surfaces. Cracking resistance may be obtained by activating the surface using heat or laser treatment and by electroplating the activated surface to form a metal liner structure. Surface treatments using applied liquid chemicals or heat may form a treated layer on the surface of an opening with enhanced cracking resistance. A plastic sleeve or other insert may form a liner structure in an opening that resists cracking. Liner structures may also be formed by applying heat or light to a coating in an opening.
Abstract:
Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.
Abstract:
A housing for a personal electronic device is described herein. The housing may include at least one modular subassembly configured to be arranged within an internal cavity of the housing. The at least one modular subassembly is aligned with a feature external to the housing, is affixed to an interior surface of the internal cavity, and is configured to function both as an antenna and as an internal support member of the housing.
Abstract:
A housing for a personal electronic device is described herein. The housing may include at least one modular subassembly configured to be arranged within an internal cavity of the housing. The at least one modular subassembly is aligned with a feature external to the housing, is affixed to an interior surface of the internal cavity, and is configured to function both as an antenna and as an internal support member of the housing. A hybrid antenna is also described herein. The hybrid antenna can include first and second flexible members capable of facilitating wireless communication, where the first and second flexible members are affixed to one another via a metal member.
Abstract:
An electronic device having a cover glass secured with a frame is disclosed. The electronic device includes a masking layer positioned between the cover glass and the frame. The masking layer may include several ink layers. The pigment composition of one of the ink layers may be altered in order to improve an adhesive bond between the ink layer and the cover glass. The frame can be modified to enhance an adhesive bond between the masking layer and the frame. For example, the frame can be altered to include a porous region to increase the surface area of the frame such that the adhesive can bond to the additional surface area. The frame may also include an extension, or rib, that may increase the surface area of the frame that receives an adhesive. The frame may include an opening or a cavity that assists in assembly between an insert-molded feature.
Abstract:
Methods and systems for manufacturing composite parts that include anodizable portions and non-anodizable portions such that an interface between the anodizable portions and non-anodizable portions are free of visible defects are described. The non-anodizable portions can be made of anodizable metals such as aluminum or aluminum alloy. The non-anodizable portions are made of material that do not generally form an anodic film, such as plastic, ceramic or glass materials. In particular, the methods described relate to manufacturing methods that are compatible with anodizing processes and avoid defects related to anodizing processes. In particular embodiments, the methods involve avoiding trapping of anodizing chemicals within a gap between an anodizable portion and a non-anodizable portion, which prevents the anodizing chemicals from disrupting the uptake of dye in a post-anodizing dyeing process.
Abstract:
Flexible battery packs for use in electronic devices are disclosed. In one embodiment of the present disclosure, the flexible battery pack may include a plurality of cells, such as galvanic or photovoltaic cells. The battery pack also may include a plurality of laminate layers coupled to the cells that include a top laminate layer and a bottom laminate layer. An adhesive may be used to couple the top and bottom laminate layers together such that each of the plurality of cells is isolated from each other. This arrangement may allow the battery to be shaped to fit a form factor of the electronic device. This arrangement also may allow one or more of the cells to be selectively removed from the plurality, which may be desirable from a manufacturing perspective.