公开(公告)号：US11476085B2

公开(公告)日：2022-10-18

申请号：US16648385

申请日：2018-09-14

Applicant: ASML Netherlands B.V.

Inventor： Yongxin Wang ,  Zhonghua Dong ,  Rui-Ling Lai

IPC: G01J1/00 ,  H01J37/244 ,  H01L27/146

Abstract: Systems and methods for implementing a detector array are disclosed. According to certain embodiments, a substrate comprises a plurality of sensing elements including a first element and a second element. The detector comprises a switching element configured to connect the first element and the second element. The switching region may be controlled based on signals generated in response to the sensing elements receiving electrons with a predetermined amount of energy.

公开(公告)号：US11175248B2

公开(公告)日：2021-11-16

申请号：US16574970

申请日：2019-09-18

Applicant: ASML Netherlands B.V.

Inventor： Long Ma ,  Chih-Yu Jen ,  Zhonghua Dong ,  Peilei Zhang ,  Wei Fang ,  Chuan Li

IPC: G01N23/2251 ,  H01J37/28

Abstract: An improved charged particle beam inspection apparatus, and more particularly, a particle beam apparatus for inspecting a wafer including an improved scanning mechanism for detecting fast-charging defects is disclosed. An improved charged particle beam inspection apparatus may include a charged particle beam source that delivers charged particles to an area of the wafer and scans the area. The improved charged particle beam apparatus may further include a controller including a circuitry to produce multiple images of the area over a time sequence, which are compared to detect fast-charging defects.