中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

30 records (took 0.031 seconds)

    OPTOELECTRONIC PACKAGE
    11.
    发明公开
    OPTOELECTRONIC PACKAGE 审中-公开

    公开(公告)号：US20240019647A1

    公开(公告)日：2024-01-18

    申请号：US17866400

    申请日：2022-07-15

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Jr-Wei LIN ,  Mei-Ju LU

    IPC: G02B6/42

    CPC classification number: G02B6/4231 ,  G02B6/4206

    Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component, an optical component, and a connection element. The photonic component includes an optical transmission portion, which includes a plurality of first terminals exposed from a first surface of the photonic component. The optical component faces the first surface of the photonic component. The optical component is configured to transmit optical signals to or receive optical signals from the optical transmission portion. The connection element is disposed between the first surface of the photonic component and the optical component. The connection element is configured to reshape the optical signals.

    ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    12.
    发明申请
    ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20220084972A1

    公开(公告)日：2022-03-17

    申请号：US17534358

    申请日：2021-11-23

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Mei-Ju LU ,  Chi-Han CHEN ,  Chang-Yu LIN ,  Jr-Wei LIN ,  Chih-Pin HUNG

    IPC: H01L23/00

    Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

    ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    13.
    发明申请
    ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20210167016A1

    公开(公告)日：2021-06-03

    申请号：US16702213

    申请日：2019-12-03

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Mei-Ju LU ,  Jr-Wei LIN

    IPC: H01L23/538 ,  H01L23/31 ,  H01L23/367 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00

    Abstract: An electronic device package includes a substrate, a first semiconductor die, a second semiconductor die and an encapsulant. The substrate includes a first surface, and a second surface opposite to the first surface. The substrate defines a cavity recessed from the first surface. The first semiconductor die is disposed in the cavity. The second semiconductor die is disposed over and electrically connected to the first semiconductor die. The encapsulant is disposed in the cavity of the substrate. The encapsulant encapsulates a first sidewall of the first semiconductor die, and exposes a second sidewall of the first semiconductor die.

    ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    14.
    发明申请
    ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20210134751A1

    公开(公告)日：2021-05-06

    申请号：US16673699

    申请日：2019-11-04

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Mei-Ju LU ,  Chi-Han CHEN ,  Chang-Yu LIN ,  Jr-Wei LIN ,  Chih-Pin HUNG

    IPC: H01L23/00

    Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

    OPTICAL DEVICE
    18.
    发明公开
    OPTICAL DEVICE 审中-公开

    公开(公告)号：US20240219628A1

    公开(公告)日：2024-07-04

    申请号：US18092145

    申请日：2022-12-30

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Jr-Wei LIN ,  Mei-Ju LU ,  Sin-Yuan MU ,  Chia-Sheng CHENG

    IPC: G02B6/12

    CPC classification number: G02B6/12004

    Abstract: An optical device is provided. The optical device includes a first photonic component; a first electronic component at least partially over the first photonic component; and an optical connection element at least partially over the first photonic component, the optical connection element being separated from the first electronic component.

Patent Agency Ranking