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11.发明授权SCHMELZKLEBSTOFF, ENTHALTEND STRAHLUNGSVERNETZBARES POLY(METH)ACRYLAT UND OLIGO(METH)ACRYLAT MIT NICHT-ACRYLISCHEN C-C-DOPPELBINDUNGEN 有权熔胶含可辐射固化的聚（甲基）丙烯酸酯和寡（甲基）丙烯酸酯非丙烯酸C-C双键
公开(公告)号：EP2718385B1
公开(公告)日：2015-03-11
申请号：EP12725456.3
申请日：2012-06-05
Applicant: BASF SE
Inventor： LICHT, Ulrike , WULFF, Dirk , CHRIST, Thomas , FILGES, Ulrich
IPC: C09J133/00
CPC classification number: C09J133/10 , C08L2312/06
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12.发明公开SCHMELZKLEBSTOFF, ENTHALTEND STRAHLUNGSVERNETZBARES POLY(METH)ACRYLAT UND OLIGO(METH)ACRYLAT MIT NICHT-ACRYLISCHEN C-C-DOPPELBINDUNGEN 有权熔胶含可辐射固化的聚（甲基）丙烯酸酯和寡（甲基）丙烯酸酯非丙烯酸C-C双键
公开(公告)号：EP2718385A1
公开(公告)日：2014-04-16
申请号：EP12725456.3
申请日：2012-06-05
Applicant: BASF SE
Inventor： LICHT, Ulrike , WULFF, Dirk , CHRIST, Thomas , FILGES, Ulrich
IPC: C09J133/00
CPC classification number: C09J133/10 , C08L2312/06
Abstract: The invention relates to a radiation cross-linkable hot-melt adhesive, containing at least one poly(meth)acrylate, which can be radiation cross-linked and which is formed from C1 to C10 alkyl(meth)acrylates to at least 60 wt%, and at least one oligo(meth)acrylate, which contains non-acrylic C-C double bonds and has a K value of less than or equal to 20. The hot-melt adhesive contains a photoinitiator, which can be present as an additive not bonded to the poly(meth)acrylate and/or not bonded to the oligo(meth)acrylate, can be polymerized into the poly(meth)acrylate, and/or can be bonded to the oligo(meth)acrylate. The hot-melt adhesive can be used to produce adhesive tapes.
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