-
公开(公告)号:MY155625A
公开(公告)日:2015-11-13
申请号:MYPI20112575
申请日:2009-12-10
Applicant: BASF SE
Inventor: MANORANJAN PRUSTY , PHILIPPE DESBOIS , MATTHIAS SCHEIBITZ , MARTIN BAUMERT
IPC: C08K3/08
Abstract: THERMOPLASTIC MOLDING COMPOSITIONS COMPRISING A FROM 10 TO 99.94% BY WEIGHT OF A POLYAMIDE, B) FROM 0.05 TO 5% BY WEIGHT OF A POLYETHYLENEIMINE HOMO- OR COPOLYMER, C) FROM 0.01 TO 20% BY WEIGHT OF IRON POWDER, AND D) FROM 0 TO 70% BY WEIGHT OF FURTHER ADDITIVES, WHERE THE TOTAL OF THE PERCENTAGES BY WEIGHT OF A) TO D) IS 100%.