HEAT AGING RESISTANT POLYAMIDES
    11.
    发明专利

    公开(公告)号:MY155625A

    公开(公告)日:2015-11-13

    申请号:MYPI20112575

    申请日:2009-12-10

    Applicant: BASF SE

    Abstract: THERMOPLASTIC MOLDING COMPOSITIONS COMPRISING A FROM 10 TO 99.94% BY WEIGHT OF A POLYAMIDE, B) FROM 0.05 TO 5% BY WEIGHT OF A POLYETHYLENEIMINE HOMO- OR COPOLYMER, C) FROM 0.01 TO 20% BY WEIGHT OF IRON POWDER, AND D) FROM 0 TO 70% BY WEIGHT OF FURTHER ADDITIVES, WHERE THE TOTAL OF THE PERCENTAGES BY WEIGHT OF A) TO D) IS 100%.

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