STABILIZED POLYAMIDES
    12.
    发明专利

    公开(公告)号:MY156724A

    公开(公告)日:2016-03-15

    申请号:MYPI20111921

    申请日:2009-10-29

    Applicant: BASF SE

    Abstract: THE INVENTION RELATES TO THERMOPLASTIC MOLDING COMPOUNDS CONTAINING A) 10 TO 98.7 WT % OF AT LEAST ONE THERMOPLASTIC POLYAMIDE HAVING A VISCOSITY NUMBER (VN) ACCORDING TO ISO 307 OF AT LEAST 150 ML/G, B) 1 PPM TO 0.95 WT % OF AT LEAST ONE POLYETHYLENEIMINE HOMOPOLYMER OR COPOLYMER, C) 0.05 TO 3 WT % OF A LUBRICANT, D) 0.05 TO 3 WT% OF A STABILIZER CONTAINING COPPER E) 1 TO 50 WT % OF A FIBROUS OR PARTICULATE FILLER OR MIXTURES THEREOF, F) 0.1 TO 5 WT % OF A NIGROSINE, G) 0 TO 30 WT OF FURTHER ADDITIVES, WHEREIN THE TOTAL OF THE COMPONENTS A) TO G) IS 100%.

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