公开(公告)号：US20200161509A1

公开(公告)日：2020-05-21

申请号：US16627464

申请日：2018-06-29

Applicant: CORNING INCORPORATED

Inventor： Leonard Charles Dabich, II ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  William Allen Wood

IPC: H01L33/50 ,  H01L33/06 ,  H01L33/54

Abstract: The QD LED module (10) disclosed herein includes a support assembly (40), a circuit board (20), an LED (30) operably supported by the circuit board, wherein the LED emits blue light (36G). The QD LED module also has a QD structure (60) supported by the support assembly and axially spaced apart from the LED surface. The QD structure has an active area (AR) that includes a first region (R1) of QD material and a second region (R2) that has no QD material. A first portion of the blue light passes through the first region and is converted to red light (36R) and green light (36G). A second portion of the blue light passes through the second region. The QD material has a CIE color point that is shifted toward the yellow portion of the color space.

公开(公告)号：US20190271814A1

公开(公告)日：2019-09-05

申请号：US16410903

申请日：2019-05-13

Applicant: CORNING INCORPORATED

Inventor： Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov ,  Douglas Llewellyn Butler ,  James Scott Sutherland

IPC: G02B6/38 ,  G02B6/36 ,  G02B6/02

Abstract: Assemblies, optical connectors, and methods for bonding optical fibers to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate includes directing a laser beam into the optical fiber disposed on a surface of the substrate, wherein the optical fiber has a curved surface and the curved surface of the optical fiber focuses the laser beam to a diameter that is smaller than a diameter of the laser beam as it enters the optical fiber. The method further includes melting, using the laser beam, a material of the substrate at a bond area between the optical fiber and the surface of the substrate such that the optical fiber is bonded to the surface of the substrate.

公开(公告)号：US20190022782A1

公开(公告)日：2019-01-24

申请号：US15755715

申请日：2016-08-30

Applicant: Corning Incorporated

Inventor： Matthew John Dejneka ,  Indrajit Dutta ,  Shari Elizabeth Koval ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada

IPC: B23K1/005 ,  B32B17/06 ,  B32B9/00 ,  C09K11/08

Abstract: Disclosed herein are methods for making a sealed device (200), the methods comprising positioning a sealing layer comprising at least one metal between a first glass substrate (201a) and a second substrate (201b) to form a sealing interface; and directing a laser beam operating at a predetermined wavelength onto the sealing interface to form at least one seal (207) between the first and second substrates and to convert the at least one metal to metal nanoparticles. Sealed devices having a seal comprising metal nanoparticles having a particles size of less than about 50 nm are also disclosed herein, as well as display devices comprising such sealed devices.

公开(公告)号：US20180351130A1

公开(公告)日：2018-12-06

申请号：US15778333

申请日：2016-11-22

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Theresa Chang ,  Leonard Charles Dabich ,  Mark Alan Lewis ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Wageesha Senaratne ,  Alexander Mikhailovich Streltsov

IPC: H01L51/52 ,  H01L51/56 ,  B23K26/24 ,  C03C8/24 ,  C03C8/02

CPC classification number: H01L51/5246 ,  H01L51/56

Abstract: A laser weldable device housing substrate, device housing and related method are provided. The substrate includes a first surface, a second surface opposite the first surface, and a thin inorganic particle layer supported by the first surface. The inorganic particle layer includes a plurality of particles arranged in a layer on the first surface. The particles have an average diameter of less than or equal to 1.0 μm, and the inorganic particle layer has an average thickness of less than or equal to 5 μm.

公开(公告)号：US20170254930A1

公开(公告)日：2017-09-07

申请号：US15448022

申请日：2017-03-02

Applicant: Corning Incorporated

Inventor： Shandon Dee Hart ,  Karl William Koch, III ,  Jen-Chieh Lin ,  Mark Alejandro Quesada ,  James Andrew West

IPC: G02B5/02 ,  H01L51/52 ,  C03C17/00

CPC classification number: G02B5/0221 ,  C03C17/007 ,  C03C19/00 ,  G02B5/0236 ,  G02B5/0278

Abstract: Disclosed herein are methods for forming light-transmitting articles comprising depositing a layer comprising a second material on a substrate comprising a first material, and forming a patterned surface on the second material. The first and second materials can have different glass transition temperatures Tg and/or refractive indices n. Additional layers comprising a third material can also be formed over the patterned surface, the third material having a glass transition temperature Tg and refractive index n that may be the same or different from those of the first and second material. Light-transmitting articles formed by such methods, as well as display devices comprising such light-transmitting articles are also disclosed herein.

公开(公告)号：US20170190609A1

公开(公告)日：2017-07-06

申请号：US15467494

申请日：2017-03-23

Applicant: CORNING INCORPORATED

Inventor： Bruce Gardiner Aitken ,  Michael Edward Badding ,  Nicholas Francis Borrelli ,  Nadja Teresia Lonnroth ,  Mark Alejandro Quesada

IPC: C03C14/00 ,  C03C3/19 ,  C03C3/145 ,  C03C3/15 ,  C03C17/00 ,  C03C3/066 ,  C03C3/23 ,  C03C8/24 ,  C03B19/02 ,  C03B19/06 ,  C03C3/14 ,  C03C3/068

CPC classification number: C03C14/006 ,  C03B19/02 ,  C03B19/06 ,  C03B2201/62 ,  C03C3/066 ,  C03C3/068 ,  C03C3/14 ,  C03C3/145 ,  C03C3/15 ,  C03C3/19 ,  C03C3/23 ,  C03C3/247 ,  C03C4/12 ,  C03C8/24 ,  C03C17/007 ,  C03C2204/00 ,  C03C2214/04 ,  C03C2214/16 ,  C03C2217/452 ,  C03C2217/47 ,  C03C2217/48 ,  C09K11/02 ,  C09K11/7774 ,  H01L33/50 ,  H01L33/501 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Embodiments are directed to glass frits containing phosphors that can be used in LED lighting devices and for methods associated therewith for making the phosphor containing glass frit and their use in glass articles, for example, LED devices.

公开(公告)号：US09050622B2

公开(公告)日：2015-06-09

申请号：US14223380

申请日：2014-03-24

Applicant: CORNING INCORPORATED

Inventor： Bruce Gardiner Aitken ,  Mark Alan Lewis ,  Mark Alejandro Quesada

IPC: B05D5/00 ,  C03C3/12 ,  C03C3/14 ,  C03C3/247 ,  H01L51/52

CPC classification number: B05D5/00 ,  C03C3/122 ,  C03C3/14 ,  C03C3/247 ,  H01L51/5253

Abstract: A method for inhibiting oxygen and moisture degradation of a device and the resulting device are described herein. To inhibit the oxygen and moisture degradation of the device, a low liquidus temperature (LLT) material which typically has a low low liquidus temperature (or in specific embodiments a low glass transition temperature) is used to form a barrier layer on the device. The LLT material can be, for example, tin fluorophosphate glass, chalcogenide glass, tellurite glass and borate glass. The LLT material can be deposited onto the device by, for example, sputtering, evaporation, laser-ablation, spraying, pouring, frit-deposition, vapor-deposition, dip-coating, painting or rolling, spin-coating or any combination thereof. Defects in the LLT material from the deposition step can be removed by a consolidation step (heat treatment), to produce a pore-free, gas and moisture impenetrable protective coating on the device. Although many of the deposition methods are possible with common glasses (i.e. high melting temperature glasses like borate silicate, silica, etc.), the consolidation step is only practical with the LLT material where the consolidation temperature is sufficiently low so as to not damage the inner layers in the device.

Abstract translation: 本文描述了一种用于抑制装置和所得装置的氧气和水分降解的方法。 为了抑制器件的氧气和水分降解，通常使用通常具有低液相线温度（或在特定实施方案中为低玻璃化转变温度）的低液相线温度（LLT）材料以在器件上形成阻挡层。 LLT材料可以是例如氟磷酸铁玻璃，硫族化物玻璃，碲化物玻璃和硼酸盐玻璃。 通过例如溅射，蒸发，激光烧蚀，喷涂，浇注，玻璃料沉积，气相沉积，浸涂，喷涂或轧制，旋涂或其任何组合，可将LLT材料沉积到器件上。 来自沉积步骤的LLT材料的缺陷可以通过固结步骤（热处理）去除，以在器件上产生无孔隙的气体和湿气不透明的保护涂层。 虽然许多沉积方法可以用普通玻璃（即，高熔点玻璃像硼酸硅酸盐，二氧化硅等）进行，但是固结步骤仅适用于LLT材料，其中固结温度足够低以免损坏 设备内层。

公开(公告)号：US20250019300A1

公开(公告)日：2025-01-16

申请号：US18714377

申请日：2022-11-29

Applicant: CORNING INCORPORATED

Inventor： Stephan Lvovich Logunov ,  Mark Alejandro Quesada

IPC: C03C27/02

Abstract: A method of bonding glass to metal foil comprising contacting a glass substrate and a metal foil to create an interface therebetween; and directing a laser beam operating at a predetermined wavelength onto the interface to form an interfacial weld between the glass substrate and the metal foil, wherein the metal foil has a thickness greater than or equal to 5 μm and less than or equal to 200 μm, and wherein the laser beam comprises a pulsed laser having a pulse width greater than or equal to 1 nanosecond and less than or equal to 200 nanoseconds. In other embodiments, the metal foil has a thickness greater than 100 nm and less than or equal to 10 mm.

公开(公告)号：US20230329033A1

公开(公告)日：2023-10-12

申请号：US18204789

申请日：2023-06-01

Applicant: CORNING INCORPORATED

Inventor： Leonard Charles Dabich, II ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: H10K50/842 ,  C03C3/12 ,  C03C23/00 ,  C03C27/06 ,  C03C27/08 ,  H10K71/50 ,  C03B23/203 ,  B23K26/20 ,  B32B37/06 ,  B32B7/04 ,  B32B17/06 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C4/00 ,  C03C8/24

CPC classification number: H10K50/8426 ,  H10K2102/00 ,  C03C23/0025 ,  C03C27/06 ,  C03C27/08 ,  H10K71/50 ,  C03B23/203 ,  B23K26/206 ,  B32B37/06 ,  B32B7/04 ,  B32B17/06 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C4/0071 ,  C03C8/24 ,  C03C2218/32 ,  C03C3/12

Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

公开(公告)号：US11186518B2

公开(公告)日：2021-11-30

申请号：US16486562

申请日：2018-02-15

Applicant: CORNING INCORPORATED

Inventor： Tracie Lynne Carleton ,  Leonard Charles Dabich, II ,  David Alan Deneka ,  Mandakini Kanungo ,  Shenping Li ,  Xiang-Dong Mi ,  Mark Alejandro Quesada ,  Wageesha Senaratne ,  John Charles Speeckaert ,  Louis Joseph Stempin, Jr. ,  Wanda Janina Walczak ,  Haregewine Tadesse Woldegiworgis

IPC: C03C19/00 ,  C03C3/083 ,  C03C15/02 ,  F21V8/00

Abstract: A method of making a glass article, for example a glass light guide plate comprising at least one structured surface including a plurality of channels and peaks. The glass article may be suitable for enabling one dimensional dimming when used in a backlight unit for use as an illuminator for liquid crystal display devices.