公开(公告)号：US5563470A

公开(公告)日：1996-10-08

申请号：US297958

申请日：1994-08-31

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: G09F9/33 ,  H01J9/18 ,  H01J29/02 ,  H01J29/92 ,  H01J31/12 ,  H01L27/32 ,  H01J1/62

CPC classification number: H01J9/185 ,  G09F9/33 ,  H01J29/028 ,  H01J29/92 ,  H01J31/125 ,  H01J2201/304 ,  H01J2329/863 ,  H01L27/3293 ,  Y10T156/1092 ,  Y10T29/49002

Abstract: A panel display includes a common substrate on which a plurality of small display tiles are mounted in an array and electrically interconnected to replicate a large area panel. Each tile includes a plurality of contact pads which are aligned with corresponding contact pads on the substrate. Solder joints between corresponding contact pads mechanically align and secure the tiles on the substrate, and provide electrical connections therebetween. Selected substrate contact pads are electrically interconnected to provide electrical connections between adjacent tiles.

Abstract translation: 面板显示器包括公共基板，多个小显示瓦片安装在阵列上并电互连以复制大面板。 每个瓦片包括与衬底上的相应接触焊盘对准的多个接触焊盘。 相应接触垫之间的焊接接头将衬垫上的瓷砖机械地对准和固定，并在其间提供电连接。 所选择的衬底接触垫电互连以提供相邻瓷砖之间的电连接。

公开(公告)号：US07527502B2

公开(公告)日：2009-05-05

申请号：US11264803

申请日：2005-11-01

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01R12/00

CPC classification number: H01R13/2421 ,  H01R12/714

Abstract: A connector system is provided including a housing defining a plurality of through openings. A plurality of electrical contact assemblies, each including at least one torsion spring supported upon a conductive mandrel are arranged so that one electrical contact assembly is positioned within a corresponding one through opening such that each of the mandrels is lodged within a respective one of the through openings with portions of the torsion springs standing proud of the housing.

Abstract translation: 提供一种连接器系统，其包括限定多个通孔的壳体。 多个电接触组件，每个包括支撑在导电心轴上的至少一个扭力弹簧，其中一个电接触组件被安置在相应的一个通孔内，使得每个心轴都被放置在通孔 开口，扭转弹簧的一部分朝向壳体骄傲。

公开(公告)号：US20070099445A1

公开(公告)日：2007-05-03

申请号：US11264803

申请日：2005-11-01

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01R12/00

CPC classification number: H01R13/2421 ,  H01R12/714

Abstract: A connector system is provided including a housing defining a plurality of through openings. A plurality of electrical contact assemblies, each including at least one torsion spring supported upon a conductive mandrel are arranged so that one electrical contact assembly is positioned within a corresponding one through opening such that each of the mandrels is lodged within a respective one of the through openings with portions of the torsion springs standing proud of the housing.

Abstract translation: 提供一种连接器系统，其包括限定多个通孔的壳体。 多个电接触组件，每个包括支撑在导电心轴上的至少一个扭力弹簧，其中一个电接触组件被安置在相应的一个通孔内，使得每个心轴都被放置在通孔 开口，扭转弹簧的一部分朝向壳体骄傲。

公开(公告)号：US20060141815A1

公开(公告)日：2006-06-29

申请号：US11359934

申请日：2006-02-21

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01R12/00

CPC classification number: H01R13/2407 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L2224/451 ,  H01L2224/45147 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R4/58 ,  H01R12/52 ,  H01R12/714 ,  H01R12/716 ,  H01R13/24 ,  H01R13/2464 ,  H01R13/33 ,  H05K3/325 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A connector system including first housing having a first header, the first header including one or more conductive pads that are in electrical communication with a conductor. A second housing that is mateable with the first housing and includes a second header positioned on a mating face. The second header includes one or more conductive pad that are electrically engaged with a conductor and positioned in confronting relation with the one or more conductive pads of the first header. An interposer located between the first header and the second header, with a woven contact that extends continuously through the interposer toward conductive pads on the first and second headers. The interposer is movable between a first position where the woven contact is spaced away from the at least one of the conductive pads, and a second position where woven contact electrically engages one of the conductive pads.

Abstract translation: 一种连接器系统，包括具有第一集管的第一壳体，所述第一集管包括与导体电连通的一个或多个导电焊盘。 第二壳体，其可与第一壳体配合并且包括位于配合面上的第二头部。 第二标头包括一个或多个导电焊盘，其与导体电接合并且与第一集管的一个或多个导电焊盘相对定位。 位于第一集管和第二集管之间的插入件，其具有连接穿过插入件的编织接触件朝向第一和第二集管上的导电焊盘。 所述插入件可在第一位置和第二位置之间移动，所述第一位置与所述至少一个所述导电焊盘间隔开所述编织接触部，以及第二位置，其中编织接触件电接合所述导电焊盘之一。

公开(公告)号：US20060141814A1

公开(公告)日：2006-06-29

申请号：US11355451

申请日：2006-02-16

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01R12/00

CPC classification number: H01L23/49827 ,  G01R1/0466 ,  G01R1/06755 ,  H01L21/486 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R4/58 ,  H01R12/52 ,  H01R12/714 ,  H01R12/716 ,  H01R13/24 ,  H01R13/2407 ,  H01R13/33 ,  H05K3/325 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An electrical contact (2) and method of making the electrical contact (2), and a connector (11) and method making the connector (11), wherein the electrical contact (2) is an electrically conducting, interlaced mesh (40), with edges of the mesh providing multiple contact points for edgewise electrical connection of the electrical contact (2), wherein the mesh (40) is annealed while restrained in the form of the electrical contact (2) wherein the mesh (40) is free of internal elastic strain, or the mesh (40) is hardened, and wherein the connector (11) retains the electrical contact (2) for edgewise connection.

公开(公告)号：US07014479B2

公开(公告)日：2006-03-21

申请号：US10940207

申请日：2004-09-14

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01R4/58

CPC classification number: H01R13/2407 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L2224/451 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R12/714 ,  H01R12/716 ,  H01R13/03 ,  H01R13/33 ,  H05K3/325 ,  H01L2924/00 ,  H01L2224/45099

Abstract: An electrical contact (2) and method of making the electrical contact (2), and a connector (11) and method making the connector (11), wherein the electrical contact (2) is an electrically conducting, nonwoven mesh (60), with edges of the mesh providing multiple contact points for edgewise electrical connection of the electrical contact (2), wherein the mesh (60) is annealed while restrained in the form of the electrical contact (2) wherein the mesh (60) is free of internal elastic strain, and wherein the connector (11) retains the electrical contact (2) for edgewise connection.

Abstract translation: 电触头（2）和制造电触点（2）的方法以及制造连接器（11）的连接器（11）和方法，其中电触头（2）是导电的非织造网（60）， 所述网格的边缘为所述电触点（2）的沿边电连接提供多个接触点，其中所述网格（60）被退火，同时以所述电触点（2）的形式被约束，其中所述网格（60）不含 内部弹性应变，并且其中连接器（11）保持用于沿边连接的电触点（2）。

公开(公告)号：US20060009055A1

公开(公告)日：2006-01-12

申请号：US11082365

申请日：2005-03-17

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01R4/66

CPC classification number: H01R13/2435 ,  H01R12/7052 ,  H01R12/714 ,  H01R12/89

Abstract: A connector system including first housing having a first header, the first header including one or more conductive pads that are in electrical communication with a conductor. A second housing that is mateable with the first housing and includes a second header positioned on a mating face. The second header includes one or more conductive pad that are electrically engaged with a conductor and positioned in confronting relation with the one or more conductive pads of the first header. An interposer located between the first header and the second header, with an electrical contact that extends continuously through the interposer toward conductive pads on the first and second headers. The interposer is movable between a first position where the electrical contact is spaced away from the at least one of the conductive pads, and a second position where the electrical contact electrically engages one of the conductive pads.

公开(公告)号：US06722893B2

公开(公告)日：2004-04-20

申请号：US10307640

申请日：2002-12-02

Applicant: Che-Yu Li ,  Zhineng Fan ,  Linh Van

Inventor： Che-Yu Li ,  Zhineng Fan ,  Linh Van

IPC: H01R1200

CPC classification number: G01R1/0466 ,  H01R13/2421 ,  H01R2201/20 ,  H05K3/325 ,  Y10S439/931

Abstract: An interconnection device is provided for temporary connection of a first electronic system to a second electronic system having a support substrate that includes an ordered array of conductive solder pads. A plurality of coil signal contacts are mounted to the conductive solder pads. Each one of the coil signal contacts comprises a central longitudinal axis, a top turn and a bottom turn that are arranged in spaced relation to one another. In this way, the bottom turn of one of the plurality of coil signal contacts is fastened to each of the conductive pads such that the top turns are spaced away from the support substrate.

Abstract translation: 提供一种互连装置，用于将第一电子系统临时连接到具有支撑衬底的第二电子系统，该支撑衬底包括导电焊盘的有序阵列。 多个线圈信号触点安装到导电焊盘。 线圈信号触点中的每一个包括以彼此间隔开的关系布置的中心纵向轴线，顶部转弯和底部转弯。 以这种方式，多个线圈信号触头之一的底部转弯被固定到每个导电焊盘，使得顶部匝与支撑衬底间隔开。

公开(公告)号：US06540525B1

公开(公告)日：2003-04-01

申请号：US09932525

申请日：2001-08-17

Applicant: Che-Yu Li ,  David A. Lysack ,  Brian D. Harry ,  John J. Kresse

Inventor： Che-Yu Li ,  David A. Lysack ,  Brian D. Harry ,  John J. Kresse

IPC: H01R1200

CPC classification number: H01R12/523 ,  H05K1/144 ,  H05K3/325

Abstract: The present invention is a cost effective module that provides high performance, high density and highly reliability interconnections needed between the various circuit devices that form a functional system or a part of a larger system. It includes circuit members having high speed, impedance-controlled transmission line signal paths, short land grid array interconnections between circuit members and, optionally, driver line terminators built into one of the circuit members, for maintaining high electrical performance. Suitable applications include mainframe computers, workstations, telecommunications networks, or other electronic equipment. The circuit members may be formed on conventional printed circuit cards with unpacked or packed circuit devices attached directly to the circuit members. Thermal control structures may be included to maintain the circuit devices within a reliable range of operating temperatures. A clamp is also included.

Abstract translation: 本发明是一种成本有效的模块，其提供在形成功能系统或较大系统的一部分的各种电路装置之间所需的高性能，高密度和高可靠性的互连。 它包括具有高速，阻抗控制的传输线路信号路径，电路构件之间的短接地栅格阵列互连以及可选地内置在电路构件之一中的驱动器线路终端器，用于维持高电气性能的电路构件。 合适的应用包括大型计算机，工作站，电信网络或其他电子设备。 电路构件可以形成在传统的印刷电路卡上，其具有直接附接到电路构件的未封装或封装的电路器件。 可以包括热控制结构以将电路器件保持在可靠的操作温度范围内。 还包括夹具。

公开(公告)号：US5563449A

公开(公告)日：1996-10-08

申请号：US374059

申请日：1995-01-19

Applicant: John Dion ,  Che-Yu Li ,  Peter Borgesen

Inventor： John Dion ,  Che-Yu Li ,  Peter Borgesen

IPC: H01L23/532 ,  H01L29/40

CPC classification number: H01L23/53242 ,  H01L23/53252 ,  H01L2924/0002

Abstract: A multiple layer interconnect structure for a semiconductor chip includes a graded transition layer of tungsten and a Group VIII metal, such as palladium, platinum or nickel (Pd, Pt or Ni) which allows formation of a Group VIII metal interconnect on a conventional pad of Al or Al alloy. The graded transition layer is interfaced between a thin adhesion layer on the pad and the Group VIII metal interconnect, and is approximately 100% tungsten where it interfaces the adhesion layer and approximately 100% Group VIII metal where it interfaces the interconnect layer. The tungsten in the graded transition layer acts as a solder barrier and the Group VIII metal interconnect is compatible with the silicon substrate so that packaging processing steps, including lead soldering, can be carried out, and the chip electrically tested, in the semiconductor fabrication facility.

Abstract translation: 用于半导体芯片的多层互连结构包括钨的渐变过渡层和诸如钯，铂或镍（Pd，Pt或Ni）的第VIII族金属，其允许在常规的焊盘上形成第VIII族金属互连 Al或Al合金。 梯度过渡层接合在焊盘上的薄粘合层和第VIII族金属互连之间，并且是大约100％的钨，其中它粘合粘合层和大约100％的VIII族金属，其中它连接互连层。 渐变过渡层中的钨作为焊料阻挡层，第VIII族金属互连与硅衬底兼容，从而可以在半导体制造设备中进行包括铅焊接在内的包装处理步骤，并进行电路测试。 。