Laser diode
    11.
    发明申请
    Laser diode 审中-公开
    激光二极管

    公开(公告)号:US20080075135A1

    公开(公告)日:2008-03-27

    申请号:US11526231

    申请日:2006-09-25

    CPC classification number: H01S5/02244 H01L2224/48247 H01S5/02212 H01S5/0683

    Abstract: A laser diode is disclosed. The laser diode generally has a support frame having a large-area coupling part and at least two pins on both ends, respectively, wherein one pin is integrally formed with the support frame. A laser diode chip and a photo-diode chip are attached to the large-area coupling part individually, and connected to other pins via two bonding wires, respectively. A transparent adhesive is formed on the photo-diode chip. The aforesaid components are integrated into a unity by a cover that has an opening on the top. Accordingly, the photo-diode chip can receive the laser light for utilizing the light feedback by an external circuit. Besides, the photo-diode chip and the laser diode chip are attached to the support frame directly so the laser diode offers good heat dissipation capability, extended lifetime, and increased reliability.

    Abstract translation: 公开了一种激光二极管。 激光二极管通常具有分别具有大面积耦合部分和至少两个引脚的支撑框架,其中一个销与支撑框架一体地形成。 激光二极管芯片和光电二极管芯片分别附接到大面积耦合部分,并通过两个接合线分别连接到其它引脚。 在光电二极管芯片上形成透明粘合剂。 上述组件通过在顶部具有开口的盖子集成为一体。 因此,光电二极管芯片可以接收用于利用外部电路的光反馈的激光。 此外,光电二极管芯片和激光二极管芯片直接连接到支撑框架,因此激光二极管提供良好的散热能力,延长的寿命和增加的可靠性。

    Structure of thermopile sensor
    12.
    发明申请
    Structure of thermopile sensor 审中-公开
    热电堆传感器的结构

    公开(公告)号:US20050034749A1

    公开(公告)日:2005-02-17

    申请号:US10638348

    申请日:2003-08-12

    CPC classification number: G01J5/02 G01J5/024 G01J5/12 G01K7/021

    Abstract: The invention relates to an improved structure of a thermopile sensor, which is to employ a membrane to cover a substrate that has a cavity. Besides, a plurality of thermoelectric elements is formed on the membrane extending outwards from the central side of the membrane and is composed of two different materials connected in series. The material of the element can be a composite of metal material and semiconductor material, and an insulation layer partitions the two materials; therefore, the two materials are connected in series through a contact hole. In addition, the contact hole formed at the central side of the membrane is called hot junction, whereas the contact hole formed at the side of the substrate is called cold junction. Moreover, to enhance the sensing performance of the thermopile sensor, a heat-conducting layer is formed at the center of the membrane, and after the heat-conducting layer is covered with another insulation layer, an absorption film is formed. The invention changes the temperature difference distribution by adding in a heat-conducting layer so as to enhance the sensing performance.

    Abstract translation: 本发明涉及一种热电堆传感器的改进结构,该结构是采用膜来覆盖具有空腔的衬底。 此外,在从膜的中心侧向外延伸的膜上形成多个热电元件,由串联连接的两种不同材料构成。 元件的材料可以是金属材料和半导体材料的复合材料,并且隔离层分隔两种材料; 因此,两种材料通过接触孔串联连接。 此外,形成在膜的中心侧的接触孔被称为热接点,而形成在基板一侧的接触孔称为冷接点。 此外,为了提高热电堆传感器的检测性能,在膜的中心形成导热层,在导热层被另一绝缘层覆盖之后,形成吸收膜。 本发明通过添加导热层来改变温度差分布,从而提高感测性能。

    Thermal isolation structure for a micro thermopile and method for making the same
    13.
    发明授权
    Thermal isolation structure for a micro thermopile and method for making the same 有权
    微型热电堆的隔热结构及其制造方法

    公开(公告)号:US06342667B1

    公开(公告)日:2002-01-29

    申请号:US09432696

    申请日:1999-11-02

    Abstract: A method for forming thermal isolation for a micro thermopile device comprises steps of forming a narrow etching window on the membrane and forming a plurality of micro connection structures each crossing the narrow etching window and connecting the edge portion of the membrane on both sides of the narrow etching window, and etching the silicon substrate through the narrow etching window to form a pit between the silicon substrate and the membrane, whereby the membrane becomes a floating membrane and has thermal isolation with the silicon substrate. By this method, the area of the floating membrane is increased and the strain of the floating membrane is reduced.

    Abstract translation: 一种用于形成微热电堆装置的热隔离的方法包括以下步骤:在膜上形成窄的蚀刻窗口,并形成多个微连接结构,每个微连接结构与窄蚀刻窗口交叉,并将薄膜的边缘部分连接在狭窄的两侧 蚀刻窗口,并且通过窄蚀刻窗蚀刻硅衬底,以在硅衬底和膜之间形成凹坑,由此膜变成浮动膜并与硅衬底进行热隔离。 通过该方法,浮膜的面积增加,浮膜的应变减小。

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