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公开(公告)号:EP3768686A1
公开(公告)日:2021-01-27
申请号:EP19714949.5
申请日:2019-03-18
Applicant: Dow Global Technologies, LLC
Inventor: SUN, Lixin , HUSTAD, Phillip D.
IPC: C07F7/08
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12.
公开(公告)号:EP1963383B1
公开(公告)日:2019-06-19
申请号:EP06840153.8
申请日:2006-12-07
Applicant: Dow Global Technologies LLC
Inventor: HUSTAD, Phillip D. , KUHLMAN, Roger L. , FROESE, Robert D. J. , WENZEL, Timothy T. , COALTER, Joseph N., III
IPC: C08F210/16 , C08F4/659 , C07F7/00
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13.
公开(公告)号:EP2914648A1
公开(公告)日:2015-09-09
申请号:EP13783189.7
申请日:2013-10-14
Applicant: Dow Global Technologies LLC
Inventor: HUSTAD, Phillip D. , POTISEK, Stephanie L. , FEIST, Rebekah K. , STEVENS, James C. , MILLS, Michael E. , RAO, Yuanqiao , GARCIA-MEITIN, Eddy I.
CPC classification number: C08K3/22 , B82Y40/00 , C08F287/00 , C08J5/005 , C08J2351/00 , C08J2353/00 , C08K2003/2241 , C08K2201/011 , C08L51/006 , G02B1/04 , G02B1/08 , G02B1/111 , G03F7/0002 , H01L31/02168 , H01L31/055 , C08F230/08 , C08L53/00
Abstract: A composition comprising a phase separated block copolymer and an inorganic dielectric nanoparticle, wherein the nanoparticle is dispersed in the copolymer and is present primarily in one phase. For example, a Ti0
2 nanocomposite can be created via the in situ formation of Ti0
2 within a silane-grafted OBC. Taking advantage of the phase morphology of the OBC and the differential swelling of the hard and soft segments, due to their inherent crystallinity, enables the selective incorporation of Ti0
2 nanoparticles into the soft segments of the OBC.-
14.
公开(公告)号:EP4263629A1
公开(公告)日:2023-10-25
申请号:EP21854771.9
申请日:2021-12-16
Applicant: Dow Global Technologies LLC , Northwestern University
Inventor: AUYEUNG, Evelyn , BAILLIE, Rhett A. , KARJALA, Thomas Wesley, Jr. , ZHOU, Zhe , MUNRO, Jeffrey C. , LI PI SHAN, Colin , HUSTAD, Phillip D. , MARKS, Tobin J. , GAO, Yanshan
IPC: C08F2/38 , C08F210/02 , C08F212/08 , C08F4/52 , C08F4/64 , C08F297/08 , C08F2/06
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公开(公告)号:EP3894215A1
公开(公告)日:2021-10-20
申请号:EP19828523.1
申请日:2019-12-10
Applicant: Dow Global Technologies LLC
Inventor: SHARMA, Rahul , WEINHOLD, Jeffrey D. , HUSTAD, Phillip D. , DONALDSON, Megan E. , LI, Xiaoyong , NEUMAN, Joseph C. , YANG, Yang
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16.
公开(公告)号:EP3768733A1
公开(公告)日:2021-01-27
申请号:EP19718478.1
申请日:2019-03-18
Applicant: Dow Global Technologies LLC , Rohm and Haas Electronic Materials LLC , Dow Silicones Corporation
Inventor: CHOI, Jongwook , DEVORE, David D. , GRIGG, Robert David , HUSTAD, Phillip D. , MURPHY, Jaclyn , ONDARI, Mark E. , REDDEL, Jordan , SUN, Lixin
IPC: C08F8/42 , C08F10/00 , C08G77/442 , C08K5/54 , C08K5/34 , B01J31/02 , C08L23/00 , C08L53/00 , C08F2/38 , C08F4/64 , C08F110/02 , C08F210/16 , C08F210/14 , C08F297/08 , C08F295/00 , C08F8/12 , C08L23/08 , C07F3/06 , C07F3/02 , C07F3/04 , C07F5/06
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公开(公告)号:EP3768687A1
公开(公告)日:2021-01-27
申请号:EP19717997.1
申请日:2019-03-18
Applicant: Dow Global Technologies LLC
Inventor: SUN, Lixin , HUSTAD, Phillip D.
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