公开(公告)号：US20110195459A1

公开(公告)日：2011-08-11

申请号：US13029664

申请日：2011-02-17

Applicant: Wolfgang HINZ ,  John Leamon ,  David Light ,  Jonathan Rothberg

Inventor： Wolfgang HINZ ,  John Leamon ,  David Light ,  Jonathan Rothberg

IPC: C12P19/34

CPC classification number: C12N15/1093 ,  B01J19/0046 ,  B01J2219/00466 ,  B01J2219/005 ,  B01J2219/00596 ,  B01J2219/00722 ,  C12Q1/6874 ,  C40B40/08 ,  C40B50/06 ,  Y10T428/2982

Abstract: The invention provides particle compositions having applications in nucleic acid analysis. Nucleic acid polymer particles of the invention allow polynucleotides to be attached throughout their volumes for higher loading capacities than those achievable solely with surface attachment. In one aspect, nucleic acid polymer particles of the invention comprise polyacrylamide particles with uniform size distributions having low coefficients of variations, which result in reduced particle-to-particle variation in analytical assays. Such particle compositions are used in various amplification reactions to make amplicon libraries from nucleic acid fragment libraries.

Abstract translation: 本发明提供了在核酸分析中具有应用的颗粒组合物。 本发明的核酸聚合物颗粒允许多核苷酸在其整个体积中被连接，以便比仅通过表面附着可实现的更高的负载能力。 在一个方面，本发明的核酸聚合物颗粒包含具有低变异系数的具有均匀尺寸分布的聚丙烯酰胺颗粒，这导致分析测定中粒子与粒子变化的减少。 这种颗粒组合物用于各种扩增反应以制备来自核酸片段文库的扩增子文库。

公开(公告)号：US20110104058A1

公开(公告)日：2011-05-05

申请号：US12302283

申请日：2007-05-24

Applicant: Tara Heitner ,  David Light ,  Kirk McLean ,  Renate Parry ,  Noboru Satozawa ,  Douglas Schneider ,  Marian Seto

Inventor： Tara Heitner ,  David Light ,  Kirk McLean ,  Renate Parry ,  Noboru Satozawa ,  Douglas Schneider ,  Marian Seto

IPC: A61K39/395 ,  C07K19/00 ,  C12N9/96 ,  C07H21/04 ,  C12N5/10 ,  A61K49/16 ,  A61P35/00

CPC classification number: C07K16/00 ,  C07K16/3069 ,  C07K2317/52 ,  C07K2317/53 ,  C07K2317/55 ,  C07K2317/622 ,  C07K2319/30

Abstract: Dimeric molecular complexes comprising an IgE CH4 dimerization domain useful for diagnostics and therapeutics.

Abstract translation: 包含可用于诊断和治疗的IgE CH4二聚化结构域的二聚体分子复合物。

公开(公告)号：US07579000B2

公开(公告)日：2009-08-25

申请号：US10512215

申请日：2004-04-30

Applicant: David Light ,  Kirk McLean

Inventor： David Light ,  Kirk McLean

IPC: A61K39/395

CPC classification number: G01N33/86 ,  A61K2039/505 ,  C07K16/36 ,  C07K16/40 ,  C07K2317/622 ,  G01N2800/224

Abstract: This invention relates to novel antibodies that bind with greater affinity to the factor VIIa/tissue factor (FVIIa/TF) complex than to tissue factor (TF) alone, do not compete for binding to TF with FVII and FX, an inhibit FX activation. The antibodies bind at the site of injury and prevent the initiation of thrombosis. The antibodies can be used to treat a variety of thrombotic conditions including but not limited to deep vein thrombosis, disseminated intravascular coagulation, and acute coronary syndrome.

Abstract translation: 本发明涉及与单独的组织因子（TF）相比，与因子VIIa /组织因子（FVIIa / TF）复合物具有更高亲和力结合的新型抗体，不竞争与FVII和FX的结合，抑制FX激活。 抗体在损伤部位结合并防止血栓形成的发生。 抗体可用于治疗各种血栓形成病症，包括但不限于深静脉血栓形成，弥散性血管内凝血和急性冠状动脉综合征。

公开(公告)号：US20080093108A1

公开(公告)日：2008-04-24

申请号：US11801336

申请日：2007-05-09

Applicant: David Light

Inventor： David Light

IPC: H01B5/00 ,  H01R43/00

CPC classification number: H05K3/062 ,  H05K3/202 ,  H05K2201/0361 ,  H05K2203/0384 ,  Y10T29/49224

Abstract: A layered metal structure is provided in accordance with an aspect of the invention. The structure can be used, for example, to fabricate a conductive interconnect element for conductively interconnecting one or more microelectronic elements. The layered structure includes first and second metal layers each of which may include one or more of copper or aluminum, for example. An intervening layer, may include for example, chromium between the first and second metal layers, chromium being resistant to an etchant usable to pattern the first and second metal layers selectively to the intervening layer. An etchant such as cupric chloride, ferric chloride (FeCl3), a peroxysulfuric composition, or a persulfate composition may be used to pattern the first and second metal layers in such case.

Abstract translation: 根据本发明的一个方面提供了层状金属结构。 该结构可以用于例如制造导电互连一个或多个微电子元件的导电互连元件。 层状结构包括例如可以包括铜或铝中的一种或多种的第一和第二金属层。 中间层可以包括例如在第一和第二金属层之间的铬，铬耐腐蚀剂可以选择性地将第一和第二金属层图案化成中间层。 在这种情况下，可以使用诸如氯化铜，氯化铁（FeCl 3 N 3），过氧化硫组合物或过硫酸盐组合物的蚀刻剂来图案化第一和第二金属层。

公开(公告)号：US07309447B2

公开(公告)日：2007-12-18

申请号：US10771252

申请日：2004-02-03

Applicant: David Light ,  Masud Beroz

Inventor： David Light ,  Masud Beroz

IPC: B44C1/22

CPC classification number: H01L21/568 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/85001 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for making a reusable mold for forming a microelectronic element package. The method including the steps of removing material from portions of a base to form recesses in the base and then depositing a mask material on at least some portions of the base.

Abstract translation: 一种制造用于形成微电子元件封装的可重复使用的模具的方法。 该方法包括以下步骤：从基底的部分去除材料以在基底中形成凹部，然后在基底的至少一些部分上沉积掩模材料。

公开(公告)号：US20050064626A1

公开(公告)日：2005-03-24

申请号：US10994695

申请日：2004-11-22

Applicant: David Light ,  Paula Lagattuta Tostado ,  Michael Warner

Inventor： David Light ,  Paula Lagattuta Tostado ,  Michael Warner

IPC: H01L23/498 ,  H01R13/24 ,  H01R43/00 ,  H01L21/44 ,  H01L21/48 ,  H01L23/34

CPC classification number: H01R13/2414 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01R43/007 ,  H01L2924/00

Abstract: A connection component for a microelectronic element includes a body of dielectric material having opposing first and second surfaces. A plurality of elongated leads extend through the body between the first and second surfaces. The leads have a first end accessible at the first surface and a second end accessible at the second surface. A layer of anisotropic conductive material overlies the first ends and the first surface of the body for electrical connection of the leads to a microelectronic element.

Abstract translation: 用于微电子元件的连接部件包括具有相对的第一和第二表面的绝缘材料体。 多个细长的引线在第一和第二表面之间延伸通过本体。 引线具有在第一表面可接近的第一端和在第二表面可接近的第二端。 一层各向异性导电材料覆盖在主体的第一端和第一表面上，用于将引线电连接到微电子元件。

公开(公告)号：US06632791B1

公开(公告)日：2003-10-14

申请号：US09880484

申请日：2001-06-12

Applicant: David Light ,  Michael John Morser ,  Mariko Nagashima

Inventor： David Light ,  Michael John Morser ,  Mariko Nagashima

IPC: A61K3800

CPC classification number: C07K14/7455 ,  A61K38/00

Abstract: The present invention relates to the design, production and use of analogs of thrombomodulin (TM) that have the ability to enhance the thrombin-mediated activation of protein C but which have a significantly reduced ability to promote activation of thrombin-activatable fibrinolysis inhibitor (TAFI). These analogs are useful in, for example, antithrombotic therapy.

Abstract translation: 本发明涉及血栓调节蛋白（TM）类似物的设计，生产和使用，其具有增强凝血酶介导的蛋白质C活化但能显着降低促凝血酶激活性纤维蛋白溶解抑制剂（TAFI）活化能力的能力 ）。 这些类似物可用于例如抗血栓治疗。

公开(公告)号：US06333207B1

公开(公告)日：2001-12-25

申请号：US09577474

申请日：2000-05-24

Applicant: David Light ,  John W. Smith

Inventor： David Light ,  John W. Smith

IPC: H01L2144

CPC classification number: H01L24/80 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/3025

Abstract: A microelectronic component connection is made by providing a lead, extending along the surface of a first element such as a semiconductor chip or wafer, such that at least a part of the lead adheres to the surface of the first element. The adhesion between this part of the lead and the surface of the first element is released by altering the temperature of at least this part of the lead. This part of the lead can then be peeled away from the surface of the first element. This part of the lead may be connected to a second element such as a microelectronic connection component, and the lead may be deformed by moving the elements relative to one another.

Abstract translation: 通过提供沿着诸如半导体芯片或晶片的第一元件的表面延伸的引线来制造微电子部件连接，使得至少一部分引线粘附到第一元件的表面。 引线的这一部分与第一元件的表面之间的粘附通过改变至少该部分引线的温度来释放。 然后可以将该部分引线从第一元件的表面剥离。 引线的这一部分可以连接到诸如微电子连接部件的第二元件，并且引线可以通过相对于彼此移动元件而变形。

公开(公告)号：US06274822B1

公开(公告)日：2001-08-14

申请号：US09110001

申请日：1998-07-02

Applicant: David Light ,  Belgacem Haba ,  Thomas H. Distefano ,  Konstantine Karavakis

Inventor： David Light ,  Belgacem Haba ,  Thomas H. Distefano ,  Konstantine Karavakis

IPC: H05K330

CPC classification number: H01L23/4985 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/0293 ,  H05K3/4092 ,  H01L2924/00

Abstract: A semiconductor chip connection component having numerous leads extending side-by-side across a gap in a support structure, each lead having a frangible section to permit detachment of one end of the lead from the support structure in a bonding process. The frangible sections are formed by treating the lead-forming material in an elongated treatment zone extending across the regions occupied by numerous leads to provide a step defining a fracture point of the lead during a wire bonding process.

Abstract translation: 一种半导体芯片连接部件，其具有多个引线，跨越支撑结构中的间隙并排延伸，每个引线具有易碎部分，以允许引线的一端在接合过程中从支撑结构脱离。 通过在延伸的处理区域中处理引线形成材料来形成脆性部分，该处理区域延伸穿过由许多引线占据的区域，以提供在引线接合过程期间限定引线的断裂点的步骤。

公开(公告)号：US06248656B1

公开(公告)日：2001-06-19

申请号：US09374394

申请日：1999-08-13

Applicant: David R. Baker ,  John Grange ,  David Light ,  Hung-Ming Wang

Inventor： David R. Baker ,  John Grange ,  David Light ,  Hung-Ming Wang

IPC: H01L2144

CPC classification number: H01L21/4857 ,  H01L21/486

Abstract: Metal leads are formed on a copper conductive layer by applying a first resist and a main resist over the first resist, and forming aligned openings in these resist. A bottom layer of cover metal such as gold is plated onto the copper conductive layer in these openings, followed by a principal metal such as copper. The main resist is then removed so as to expose edges of the principal metal layer. A jacket of cover metal is plated onto the exposed edges and surfaces of the principal metal layer. During this stage, the first resist prevents deposition of the cover metal except on the leads. The jacket merges with the bottom layer of cover material, so as to form a continuous coating extending around the perimeters of the leads. The first resist is removed, and the conductive layer is etched away. The cover metal protects the principal metal during the etching stage.

Abstract translation: 通过在第一抗蚀剂上施加第一抗蚀剂和主抗蚀剂，在铜导电层上形成金属引线，并在这些抗蚀剂中形成对准的开口。 覆盖金属如金的底层被镀在这些开口中的铜导电层上，随后是诸如铜的主要金属。 然后去除主抗蚀剂以暴露主金属层的边缘。 将覆盖金属的护套电镀在主金属层的暴露的边缘和表面上。 在这个阶段，第一个抗蚀剂防止除了引线之外的覆盖金属的沉积。 护套与覆盖材料的底层合并，以形成围绕引线周边延伸的连续涂层。 去除第一抗蚀剂，并且蚀刻掉导电层。 覆盖金属在蚀刻阶段保护主要金属。