公开(公告)号：US20170162409A1

公开(公告)日：2017-06-08

申请号：US15372033

申请日：2016-12-07

Applicant: EBARA CORPORATION

Inventor： Naoki TOYOMURA ,  Mitsuru MIYAZAKI ,  Takuya INOUE

IPC: H01L21/67

CPC classification number: H01L21/67219 ,  H01L21/67196 ,  H01L21/6838 ,  H01L21/68742

Abstract: An object of the present invention is to detach a substrate from a table without damaging the substrate by lift pins.One embodiment of the present invention provides a substrate processing apparatus having a vacuum suction table adapted to have a substrate placed thereon, and a plurality of lift pins disposed along the outer periphery of the vacuum suction table. The lift pins each have a distal end portion including a substrate guide surface capable of guiding the outer peripheral end surface of the substrate, and a proximal end portion including a substrate holding surface extending from the substrate guide surface outwardly in a radial direction of the lift pin. The lift pins are stoppable in a lower end position where the substrate guide surface of each of the lift pins is disposed below a suction-holding surface of the vacuum suction table, an upper end position where the substrate holding surface of each of the lift pins is disposed above the suction-holding surface of the vacuum suction table, and an intermediate position between the lower end position and the upper end position. In the intermediate position, the substrate guide surface of each of the lift pins is disposed above the suction-holding surface of the vacuum suction table, and the substrate holding surface of each of the lift pins is disposed below the suction-holding surface of the vacuum suction table.

公开(公告)号：US20240413003A1

公开(公告)日：2024-12-12

申请号：US18809410

申请日：2024-08-20

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Takuya INOUE

IPC: H01L21/687 ,  H02K11/24

Abstract: Exemplary substrate supporting apparatus and method for attaching and/or detaching substrate are provided. In one aspect, substrate supporting apparatus has a plurality of supporting members 10 that contacts a circumferential part of a substrate W and rotate the substrate W; a pair of driven members 30 on which the plurality of supporting members 10 are provided; a connecting member 20 connecting one driven member 31 and another driven member 32; and a driving device 40 that brings the pair of driven members 30 close to each other or separates the pair of driven members 30 from each other, linearly along a first direction, by moving at least a part of the connecting member 20. Numerous other aspects are provided.

公开(公告)号：US20230352326A1

公开(公告)日：2023-11-02

申请号：US18349666

申请日：2023-07-10

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Toshio MIZUNO ,  Itsuki KOBATA ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC: H01L21/67 ,  B24B37/10 ,  B24B49/14 ,  B24B53/017 ,  B24B37/34 ,  H01L21/304 ,  H01L21/306 ,  H01L21/02

CPC classification number: H01L21/67248 ,  H01L21/67178 ,  H01L21/67109 ,  H01L21/67051 ,  H01L21/67046 ,  H01L21/67028 ,  H01L21/67219 ,  B24B37/105 ,  B24B49/14 ,  B24B53/017 ,  B24B37/345 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/6704 ,  H01L21/02065 ,  H01L21/02052

Abstract: A polishing apparatus is provided. The polishing apparatus includes:



a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.

公开(公告)号：US20200321237A1

公开(公告)日：2020-10-08

申请号：US16823448

申请日：2020-03-19

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Takuya INOUE

IPC: H01L21/687 ,  H02K11/24

Abstract: Exemplary substrate supporting apparatus and method for attaching and/or detaching substrate are provided. In one aspect, substrate supporting apparatus has a plurality of supporting members 10 that contacts a circumferential part of a substrate W and rotate the substrate W; a pair of driven members 30 on which the plurality of supporting members 10 are provided; a connecting member 20 connecting one driven member 31 and another driven member 32; and a driving device 40 that brings the pair of driven members 30 close to each other or separates the pair of driven members 30 from each other, linearly along a first direction, by moving at least a part of the connecting member 20. Numerous other aspects are provided.

公开(公告)号：US20190308223A1

公开(公告)日：2019-10-10

申请号：US16373004

申请日：2019-04-02

Applicant: Ebara Corporation

Inventor： Mitsuru MIYAZAKI ,  Akira IMAMURA ,  Takuya INOUE ,  Shozo TAKAHASHI

IPC: B08B3/04 ,  G05D16/20 ,  H01L21/67

Abstract: According to one embodiment, provided is a cleaning liquid supplying system including: a circulation line in which cleaning liquid flows, first end of the circulation line being connected to a supply port of a cleaning liquid supplying apparatus, second end of the circulation line being connected to a collection port of the cleaning liquid supplying apparatus; a branch pipe branched from the circulation line and connected to a substrate cleaning unit; a valve provided on the branch pipe and configured to control supply of cleaning liquid from the circulation line to the substrate cleaning unit; and a flow rate adjuster configured to adjust a flow rate of the cleaning liquid flowing in the circulation line.

公开(公告)号：US20160141201A1

公开(公告)日：2016-05-19

申请号：US14935893

申请日：2015-11-09

Applicant: Ebara Corporation

Inventor： Naoki TOYOMURA ,  Mitsuru MIYAZAKI ,  Takuya INOUE

IPC: H01L21/687 ,  B25B5/00 ,  B25B5/14

CPC classification number: H01L21/68728

Abstract: There is disclosed an improved substrate holding apparatus which can minimize deformation of a spring, which is provided to bias a support post for supporting a substrate, even when a large centrifugal force acts on the spring. The substrate holding apparatus includes: a support post movable in an axial direction thereof; a chuck provided on the support post and configured to hold a periphery of a substrate; a spring biasing the support post in the axial direction; a first structure configured to restrict a movement of an upper portion of the spring in a direction perpendicular to the axial direction of the support post; and a second structure configured to restrict a movement of a lower portion of the spring in a direction perpendicular to the axial direction of the support post.

Abstract translation: 公开了一种改进的基板保持装置，即使当大的离心力作用在弹簧上时，可以使弹簧的变形最小化，该弹簧被设置成偏置用于支撑基板的支撑柱。 基板保持装置包括：可沿其轴向移动的支撑柱; 设置在所述支撑柱上并被构造成保持基板的周边的卡盘; 弹簧沿轴向偏置支撑柱; 第一结构，其构造成限制弹簧的上部在与支撑柱的轴向方向垂直的方向上的运动; 以及第二结构，其构造成限制弹簧的下部在垂直于支撑柱的轴向的方向上的运动。

公开(公告)号：US20160059380A1

公开(公告)日：2016-03-03

申请号：US14832767

申请日：2015-08-21

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Itsuki KOBATA ,  Toshio MIZUNO ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC: B24B53/017 ,  B08B3/12 ,  B08B3/10 ,  B08B3/02 ,  H01L21/306 ,  B08B1/00

CPC classification number: B24B53/017 ,  B08B1/04 ,  B08B3/02 ,  B08B2203/0288 ,  H01L21/67046 ,  H01L21/67051

Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

Abstract translation: 本发明的实施例提供了一种buff处理模块。 抛光处理模块包括：抛光台，其上安装有加工对象物体; 保持用于将预定处理应用于处理目标对象的抛光垫的抛光头; 一个支撑和摆动buff头的抛光臂; 用于打磨抛光垫的梳妆台; 以及清洁机构，其布置在抛光台和修整器之间并且用于清洁抛光垫。