公开(公告)号：EP2693475A1

公开(公告)日：2014-02-05

申请号：EP11862688.6

申请日：2011-03-31

Applicant: Fujitsu Limited

Inventor： MIZUNO, Yoshihiro ,  KOUMA, Norinao ,  TSUBOI, Osamu

IPC: H01L25/065 ,  H01L23/473 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L23/46 ,  H01L23/473 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06551 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A three-dimensional mounting semiconductor device includes a layer structure including a plurality of first substrates with a trench-shaped concavity formed in and a plurality of second substrates with semiconductor elements formed in, which are alternately stacked, wherein an unevenness defined by a size difference between the first substrate and the second substrate is formed on a side surface, and a first through-hole are defined by an inside surface of the trench-shaped concavity and a surface of the first substrate, and a third substrate jointed to the side surface of the layer structure and having an unevenness formed on a surface jointed to the layer structure which are engaged with the unevenness formed on the side surface of the layer structure.

Abstract translation: 三维安装半导体器件包括：层结构，其包括形成有沟槽状凹部的多个第一基板和形成有交替层叠的半导体元件的多个第二基板，其中由尺寸差异 第一基板和第二基板之间形成在侧面上，并且第一通孔由沟槽状凹部的内表面和第一基板的表面界定，第三基板与侧面 并且具有形成在与形成在层结构的侧表面上的凹凸接合的层结构的表面上形成的凹凸。

公开(公告)号：EP2680429A1

公开(公告)日：2014-01-01

申请号：EP11859296.3

申请日：2011-02-23

Applicant: Fujitsu Limited

Inventor： TSUBOI, Osamu ,  MIZUNO, Yoshihiro ,  KOUMA, Norinao

IPC: H02N10/00 ,  B81B3/00 ,  H01F1/00 ,  H01H37/58

CPC classification number: F04B43/043 ,  F03G7/06 ,  F04B19/006 ,  H01H37/58 ,  H02N10/00

Abstract: An actuator includes a first part having a magnetomotive means and configured to absorb heat up to at least a first temperature; a second part arranged so as to face the first part; a temperature-sensitive magnetic body provided between the first part and the second part and configured to move between a first position for contact with the first part and a second position for contact with the second part, the temperature-sensitive magnetic body having a Curie point lower than the first temperature and higher than a temperature of the second part; and a restoring part configured to restore the temperature-sensitive magnetic body from the first position to the second position.