公开(公告)号：US20230266533A1

公开(公告)日：2023-08-24

申请号：US17679431

申请日：2022-02-24

Applicant: GlobalFoundries U.S. Inc.

Inventor： Theodore Letavic ,  Yusheng Bian ,  Hemant Dixit

IPC: G02B6/122

CPC classification number: G02B6/1228 ,  G02B2006/12135

Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes a substrate, an optical component including a waveguide core, and a back-end-of-line stack including a heat spreader layer. The optical component is positioned in a vertical direction between the substrate and the back-end-of-line stack. The waveguide core contains a first material having a first thermal conductivity, and the heat spreader layer contains a second material having a second thermal conductivity that is greater than the first thermal conductivity of the first material.

公开(公告)号：US20230266529A1

公开(公告)日：2023-08-24

申请号：US17679405

申请日：2022-02-24

Applicant: GlobalFoundries U.S. Inc.

Inventor： Hemant Dixit ,  Yusheng Bian ,  Theodore Letavic

IPC: G02B6/122 ,  G02B6/43 ,  F21V8/00

CPC classification number: G02B6/122 ,  G02B6/43 ,  G02B6/0026

Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes a waveguide core and a back-end-of-line stack including a first metallization level, a second metallization level, and a heat sink having a metal feature in the second metallization level. The heat sink is positioned adjacent to a section of the waveguide core. The first metallization level including a dielectric layer positioned between the metal feature and the section of the waveguide core.