Abstract:
Light-emitting diode assembly housing comprising high temperature polyamide compositions containing titanium dioxide and, optionally, one or more fillers and/or reinforcing agents and one or more oxidative stabilizers.
Abstract:
The invention discloses a portable electronic device cover comprising renewable thermoplastic polyamide compositions having a carbon content, wherein the carbon content comprises at least 50 percent modern carbon, as determined with ASTM-D6866 method.
Abstract:
Disclosed is a thermoplastic composition including: a) 20 to 35 weight percent poly(decamethylene decanediamide), b) 50 to 65 weight percent poly(hexamethylene decanediamide), and c) 8 to 15 weight percent of sulfonamide plasticizer. wherein the sulfonamide plasticizer is one or more sulfonamides selected from the group consisting of N-butylbenzenesulfonamide, N-(2-hydroxypropyl)benzenesulfonamide, N-ethyl-o-toluenesulfonamide, N-ethyl-p-toluenesulfonamide, o-toluenesulfonamide, and p-toluenesulfonamideone.
Abstract:
The present invention relates to polyamide compositions having improved crystallization rates for blow molding articles having complex shapes. The use of tripentaerythritol in polyamide compositions slows down the crystallization rate of the polyamide compositions so that they can be used to blow mold large parts having an excellent surface appearance. Due to the longer crystallization times, these polyamide compositions can be used to blow mold very large and intricate parts.
Abstract:
Thermoplastic compositions which are painted (coated) have improved adhesion to the paint when these compositions comprise a hydrophilic polyether or polyester modified siloxane. These thermoplastic compositions are particularly suited for use with aqueous based paints, in uses such as automobile and appliance bodies and parts.
Abstract:
High temperature polyamide resin compositions for blow molding and articles blow molded from such compositions are provided. The blow molded articles exhibit excellent heat resistance, chemical resistance, and dimensional stability. The composition has a melting point of at least 275° C. and a glass transition temperature of at least 60° C. The composition comprises an aromatic polyamide, an impact modifier, and a stabilizer. The aromatic polyamide is a polymer or copolymer having repeating units derived from a carboxylic acid component and an aliphatic diamine component, the carboxylic component being terephthalic acid or a mixture of terephthalic acid and one or more other carboxylic acids, and the aliphatic diamine component being hexamethylene diamine or a mixture of hexamethylene diamine and 2-methyl pentamethylene diamine or 2-ethyltetramethylene diamine. The impact modifier is selected from the group of (i) ethylene polymers and copolymers grafted with carboxylic acid, an anhydride thereof, maleimide or an epoxy compound; (ii) olefin/arcylic acid/anhydride terpolymers and ionomers; and (iii) styrenic thermoplastic elastomers grafted with an anhydride of a carboxylic acid. The stabilizer is selected from the group of (i) phosphite and phosphonite stabilizers; (ii) hindered phenol stabilizers; (iii) hindered amine stabilizers; and (iv) aromatic amine stabilizers.
Abstract:
Multi-layered co-extruded tubes are provided that include an outer layer including a first semiaromatic semicrystalline polyamide having a melt temperature of about 240° C. to 280° C., and a thermal stabilizer; and an inner layer including a second semiaromatic semicrystalline polyamide having a glass transition equal to or greater than 100° C.
Abstract:
Disclosed is a thermoplastic composition including:a) 20 to 35 weight percent poly(decamethylene decanediamide),b) 50 to 65 weight percent poly(hexamethylene decanediamide), andc) 8 to 15 weight percent of sulfonamide plasticizer. wherein the sulfonamide plasticizer is one or more sulfonamides selected from the group consisting of N-butylbenzenesulfonamide, N-(2-hydroxypropyl)benzenesulfonamide, N-ethyl-o-toluenesulfonamide, N-ethyl-p-toluenesulfonamide, o-toluenesulfonamide, and p-toluenesulfonamideone.