OPTICAL SWITCHES INCLUDING A RING RESONATOR

    公开(公告)号:US20250116819A1

    公开(公告)日:2025-04-10

    申请号:US18376864

    申请日:2023-10-05

    Abstract: Structures for an optical switch and methods of forming such structures. The structure comprises a first waveguide core including a first portion and a second portion, a second waveguide core including a first portion and a second portion, a ring resonator having a first portion adjacent to the first portion of the first waveguide core and a second portion adjacent to the first portion of the second waveguide core, and an optical coupler coupled to the second portion of first waveguide core and the second portion of the second waveguide core. The first portion of the ring resonator is spaced from the first portion of the first waveguide core by a first gap over a first light coupling region, and the second portion of the ring resonator is spaced from the first portion of the second waveguide core by a second gap over a second light coupling region.

    Electro-absorption modulators with stacked waveguide tapers

    公开(公告)号:US12265255B2

    公开(公告)日:2025-04-01

    申请号:US17944252

    申请日:2022-09-14

    Abstract: Structures including an electro-absorption modulator and methods of forming such structures. The structure comprises a waveguide core including a first tapered section, a second tapered section, and a longitudinal axis. The first tapered section and the second tapered section are aligned along the longitudinal axis. The structure further comprises a first waveguide taper overlapping the first tapered section of the waveguide core, a second waveguide taper overlapping the second tapered section of the waveguide core, and a multiple-layer structure on the waveguide core between the first waveguide taper and the second waveguide taper.

    Light coupling between stacked photonics chips

    公开(公告)号:US12001056B2

    公开(公告)日:2024-06-04

    申请号:US17834375

    申请日:2022-06-07

    CPC classification number: G02B6/2934 G02B6/4215

    Abstract: Structures including stacked photonics chips and methods of fabricating a structure including stacked photonics chips. The structure comprises a first chip including a first waveguide core, a ring resonator adjacent to a portion of the first waveguide core, and a first dielectric layer over the first waveguide core and the ring resonator. The first dielectric layer has a first surface. The structure further comprises a second chip including a second waveguide core and a second dielectric layer over the second waveguide core. The second dielectric layer has a second surface adjacent to the first surface of the first dielectric layer, and the second waveguide core is positioned adjacent to the ring resonator.

    OPTICAL RING RESONATOR-BASED MICROFLUIDIC SENSOR

    公开(公告)号:US20230288321A1

    公开(公告)日:2023-09-14

    申请号:US17689120

    申请日:2022-03-08

    CPC classification number: G01N21/31 G02B6/29343 G02B6/2935

    Abstract: Disclosed is a structure (e.g., a lab-on-chip structure) including a substrate, an insulator layer on the substrate, and at least one optical ring resonator. Each ring resonator includes cladding material on the insulator layer and, embedded within the cladding material, a first waveguide core with an input and an output, and second waveguide core(s) (e.g., ring waveguide core(s)) positioned laterally adjacent to the first waveguide core. A reservoir is below the ring resonator within the insulator layer and substrate such that surfaces of the waveguide cores are exposed within the reservoir. During a sensing operation, the waveguide core surfaces contact with fluid within the reservoir and a light signal at the output of the first waveguide core is monitored (e.g., by a sensing circuit, which in some embodiments is also coupled to a reference optical ring resonator) and used, for example, for spectrum-based target identification and, optionally, characterization.

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