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公开(公告)号：US20180018001A1
公开(公告)日：2018-01-18
申请号：US15546070
申请日：2015-01-31
Applicant: Hewlett Packard Enterprise Development LP
Inventor： John P. Franz , Thomas R. Bowden , Richard A. Bargerhuff , Sammy L. Zimmerman , Tahir Cader
Abstract: In one implementation, a system for a memory cooling pad includes a first thermal interface material coupled to a second thermal interface material by a liner material configured to position the first thermal interface material on a first side of a memory unit and to position the second thermal interface material on a second side of the memory unit.
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公开(公告)号：US12104618B2
公开(公告)日：2024-10-01
申请号：US17977200
申请日：2022-10-31
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John P. Franz , Steven J. Dean , Ernesto J. Ferrer
IPC: F04D29/042 , F04D29/64 , H05K7/20
CPC classification number: F04D29/648 , F04D29/042 , F04D29/642 , H05K7/20254 , H05K7/20272
Abstract: An example axial pump for delivering liquid coolant to cool an electronic device comprises a conduit defining a flow path from an inlet of the conduit to an outlet of the conduit and an impeller in the conduit. The impeller is rotatable about an axis of rotation parallel to the flow path. The pump also has a motor stator configured to drive rotation of the impeller body about the axis of rotation. In addition, the pump comprises an adjustment mechanism coupling the impeller to the conduit. The adjustment mechanism is actuatable to cause translation of the impeller relative to the conduit. This may allow for adjustment of a clearance between a blade tip of a blade of the impeller and a wall of the conduit.
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公开(公告)号：US20240324148A1
公开(公告)日：2024-09-26
申请号：US18732869
申请日：2024-06-04
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John P. Franz , Tahir Cader , Matthew Richard Slaby
CPC classification number: H05K7/20836 , G05B15/02 , H05K7/20772 , H05K7/20781 , G01L13/00
Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.
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公开(公告)号：US20180094875A1
公开(公告)日：2018-04-05
申请号：US15819463
申请日：2017-11-21
Applicant: Hewlett Packard Enterprise Development LP
Inventor： John P. Franz , Tahir Cader , Michael Sabotta , David A. Moore
IPC: F28F1/40 , H05K7/20 , H01L23/473
CPC classification number: F28F1/40 , H01L23/473 , H01L2924/0002 , H05K7/20254 , H05K7/20781 , H01L2924/00
Abstract: An assembly for liquid cooling is provided herein. The assembly 8includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.
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公开(公告)号：US20180018000A1
公开(公告)日：2018-01-18
申请号：US15546050
申请日：2015-01-30
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Tahir Cader , John P. Franz , David A. Moore
IPC: G06F1/20 , G05B19/4099 , H05K7/20
CPC classification number: G06F1/20 , B29C64/393 , B33Y50/02 , B33Y80/00 , G05B19/4099 , G05B2219/35134 , G05B2219/49007 , G06F2200/201 , H05K7/20272 , H05K7/20772
Abstract: Example implementations relate to an integrated liquid cooling of a server system. For example, a method for integrated liquid cooling of a server system can include creating a liquid cooling component that includes creating a three dimensional (3D) design based on a server system, where the 3D design includes customized angle geometry. Further, the method for integrated liquid cooling of a server system can include forming the liquid cooling component based on the 3D design, where the liquid cooling component includes a plurality of liquid flow passages for delivering cooling resources to the server system, and delivering the cooling resources to the server system via the liquid cooling component.
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Patent Agency Ranking
公开(公告)号：US12029016B2
公开(公告)日：2024-07-02
申请号：US16945395
申请日：2020-07-31
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John P. Franz , Tahir Cader , Matthew Richard Slaby
CPC classification number: H05K7/20836 , G05B15/02 , H05K7/20772 , H05K7/20781 , G01L13/00
Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.
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公开(公告)号：USD951259S1
公开(公告)日：2022-05-10
申请号：US29819178
申请日：2021-12-13
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Designer： Yinggang Du , Keith J. Kuehn , John P. Franz , Alan B. Doerr
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公开(公告)号：US10765040B2
公开(公告)日：2020-09-01
申请号：US15665334
申请日：2017-07-31
Applicant: Hewlett Packard Enterprise Development LP
Inventor： John P. Franz , Tahir Cader , Matthew Richard Slaby
Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.
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公开(公告)号：US10734760B2
公开(公告)日：2020-08-04
申请号：US16533723
申请日：2019-08-06
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John P. Franz , Tahir Cader
Abstract: Example implementations relate to a magnetic fluid connector. For example, a magnetic fluid connector can include a magnet, an internal fluid path defined by a first portion and a second portion when the first portion and the second portion are coupled together, and a movable member that is movable to seal the internal fluid path, where the magnet provides at least a portion of a force sufficient to seal the internal fluid path.
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公开(公告)号：US10672683B2
公开(公告)日：2020-06-02
申请号：US15774293
申请日：2016-01-28
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John P. Franz , Charles R. Hanna , Brian T. Purcell
IPC: H01L23/40 , H05K1/02 , H05K7/20 , H01L23/427 , H01L23/36
Abstract: Example implementations relate to a heat transfer adapter plate. For example, a heat transfer adapter plate can comprise a first retention mechanism to couple a heat transfer device to the heat transfer adapter plate and a second retention mechanism to couple the heat transfer adapter plate to an electronic component. The heat transfer adapter plate can accept a plurality of heat transfer device types, including but not limited to, a passive heat exchanger, an active heat exchanger, and a heat pipe.
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