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公开(公告)号:US20180361618A1
公开(公告)日:2018-12-20
申请号:US15771561
申请日:2016-02-26
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: James Elmer Abbott, Jr. , Vladek Kasperchik , David A. Champion
IPC: B28B1/00 , B29C64/165 , B29C64/291 , B29C64/112 , B33Y10/00 , B33Y30/00 , B33Y70/00
Abstract: In a three-dimensional printing method example, a build material is applied. A first liquid functional material is applied on at least a portion of the build material. The first liquid functional material includes ferromagnetic nanoparticles that are selected from the group consisting of an iron oxide, a ferrite, a combination of the iron oxide and a ferromagnetic metal oxide, and combinations thereof. The build material is exposed to electromagnetic radiation having a frequency ranging from about 5 kHz to about 300 GHz to sinter the portion of the build material in contact with the first liquid functional material.
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公开(公告)号:US20180272561A1
公开(公告)日:2018-09-27
申请号:US15763193
申请日:2015-11-20
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Vladek Kasperchik , Michael G. Monroe , Pavel Kornilovich , David A. Champion
IPC: B28B1/00 , C04B35/64 , C04B35/63 , C04B35/636 , C04B35/638
CPC classification number: B28B1/001 , B28B7/465 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y70/00 , C04B35/6316 , C04B35/634 , C04B35/636 , C04B35/638 , C04B35/64
Abstract: In a three-dimensional printing method example, build material granules are applied. Each of the build material granules includes uncoated, primary ceramic particles agglomerated together by a binder that is soluble in a primary solvent of a fusing agent. The fusing agent is selectively applied on at least a portion of the build material granules. The binder dissolves and a green body including a slurry of the uncoated, ceramic particles is created.
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公开(公告)号:US20180178447A1
公开(公告)日:2018-06-28
申请号:US15735934
申请日:2015-07-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: James Elmer Abbott, JR. , Raymond Adamic , David A. Champion
IPC: B29C64/165 , B33Y10/00 , B33Y70/00 , B28B1/00 , C09D11/52 , C09D11/101 , C09D11/037 , C09D11/322
CPC classification number: B29C64/165 , B22F3/008 , B22F2999/00 , B28B1/001 , B29K2101/12 , B29K2995/004 , B33Y10/00 , B33Y30/00 , B33Y70/00 , C09D11/037 , C09D11/101 , C09D11/322 , C09D11/52 , G03G15/224 , G03G15/225 , B22F3/1003
Abstract: A stabilizing liquid functional material (SLFM) for 3D printing includes ceramic nanoparticles in an amount ranging from about 0.25% to about 5% by weight based on a total SLFM weight and silica nanoparticles present in an amount ranging from about 0.1% to about 10% by weight based on the total SLFM weight. The ceramic nanoparticles have a particle size ranging from about 5 nm to about 50 nm. The silica nanoparticles have a particle size ranging from about 10 nm to about 50 nm. The ceramic nanoparticles and the silica nanoparticles are different in composition and/or morphology. An electromagnetic radiation absorber is present in an amount ranging from about 1% to about 10% by weight based on the total SLFM weight. An organic solvent is present in an amount from about 5% to about 50% by weight based on the total SLFM weight. The SLFM includes a balance of water.
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公开(公告)号:US20180147777A1
公开(公告)日:2018-05-31
申请号:US15568969
申请日:2015-07-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: James Elmer Abbott, Jr. , Raymond Adamic , David A. Champion
IPC: B29C64/135 , B29C64/112 , B29C64/165 , B33Y10/00 , B33Y30/00 , B33Y70/00
CPC classification number: B29C64/135 , B22F3/008 , B22F2999/00 , B29C64/112 , B29C64/165 , B33Y10/00 , B33Y30/00 , B33Y70/00 , C09D11/322 , G03G15/224 , G03G15/225 , B22F3/1003
Abstract: In a 3D printing method, a first layer of a build material is applied. A part layer is patterned by selectively applying a penetrating liquid functional material (PLFM) on at least a portion of the first layer. The PLFM includes (in amounts by weight based on total wt % of the PLFM): from about 5%-15% of a first metal oxide nanoparticle having a particle size ranging from about 0.5 nm up to 10 nm, from about 0.25%-10% of a second metal oxide nanoparticle having at least one dimension greater than 10 nm, from about 1%-10% of an electromagnetic radiation absorber, from about 5%-50% of an organic solvent, a surfactant, and a balance of water. The first layer having the PLFM applied thereon is exposed to electromagnetic radiation, whereby the portion of the first layer at least partially fuses to form the part layer.
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公开(公告)号:US20170246761A1
公开(公告)日:2017-08-31
申请号:US15512422
申请日:2014-10-08
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: David A. Champion , James Elmer Abbott, JR.
CPC classification number: B28B1/001 , B28B11/241 , B28B17/0081 , B29C64/165 , B29C64/209 , B29C64/291 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y70/00
Abstract: In one example, a method of fabricating a three-dimensional object includes depositing a layer of build material, depositing a coalescing agent onto the layer of build material according to a slice of three-dimensional model data, irradiating the coalescing agent with microwave radiation such that the coalescing agent converts the microwave radiation into heat to coalesce the build material in which the coalescing agent was deposited.
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公开(公告)号:US11987006B2
公开(公告)日:2024-05-21
申请号:US17417745
申请日:2019-07-19
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Daniel Mosher , Jennifer Wu , Vladek Kasperchik , David A. Champion
IPC: B29C64/393 , B33Y50/02 , G05B19/4099 , B29C64/153 , B29C64/165
CPC classification number: B29C64/393 , B33Y50/02 , G05B19/4099 , B29C64/153 , B29C64/165
Abstract: According to examples, an apparatus may include a processor and a memory on which are stored machine-readable instructions that when executed by the processor, cause the processor to determine physical characteristics of a build layer of build material particles. The instructions may also cause the processor to determine an adjustment to forming data based on the determined physical characteristics, the forming data to be used informing a subsequent build layer. The instructions may further cause the processor to apply the determined adjustment to the forming data for use in forming the subsequent build layer, in which portions of a three-dimensional (3D) object are to be formed in the build layer and the subsequent build layer.
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公开(公告)号:US11872757B2
公开(公告)日:2024-01-16
申请号:US17052087
申请日:2018-10-30
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: David A. Champion , Douglas Pederson
IPC: B29C64/264 , B33Y30/00 , B29C64/393 , B22F10/85 , B28B1/00 , B28B17/00 , B22F12/41 , B22F10/14 , B22F10/73 , B22F12/10 , B22F12/60 , B33Y50/02
CPC classification number: B29C64/264 , B22F10/85 , B28B1/001 , B28B17/0081 , B29C64/393 , B33Y30/00 , B33Y50/02 , B22F10/14 , B22F10/73 , B22F12/10 , B22F12/41 , B22F12/60 , B22F2998/10 , B22F10/14 , B22F3/10
Abstract: According to examples, an apparatus may include an agent delivery device to deliver a coalescing agent to selected locations of a build material layer and a plurality of microwave energy emitters, each of the microwave energy emitters including a tip to generate a focused microwave energy field onto a respective area near the tip, in which the tip is to be positioned to place a portion of the build material layer within the focused microwave energy field. The apparatus may also include a controller that may control the microwave energy emitters to direct microwave energy onto the build material layer.
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公开(公告)号:US11801638B2
公开(公告)日:2023-10-31
申请号:US16608416
申请日:2017-08-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Daniel Mosher , Brian Bay , David A. Champion
IPC: B29C67/00 , B29C64/343 , B33Y50/02 , B29C64/393 , B22F10/31 , B22F10/28 , B22F12/90
CPC classification number: B29C64/343 , B22F10/31 , B29C64/393 , B33Y50/02 , B22F10/28 , B22F12/90
Abstract: Printers are disclosed. An example printer includes a build controller to access metrics of a layer on a work area and to select a dosing profile from a plurality of dosing profiles to fuse the layer based on the metrics.
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公开(公告)号:US11745260B2
公开(公告)日:2023-09-05
申请号:US15734400
申请日:2018-10-30
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: James P. Shields , David A. Champion
CPC classification number: B22F3/003 , B22F3/10 , B22F10/10 , B33Y40/20 , B22F10/14 , B22F2003/1042 , B22F2998/10 , B22F2998/10 , B22F10/10 , B22F3/10
Abstract: Techniques for using a pin array to support a 3D printed object during sintering are disclosed. An example method includes adjusting pins of a pin array to provide support for a bottom surface of the 3D printed object, and placing the 3D printed object on the pin array. The method also includes placing the 3D printed object and pin array in a sintering oven, and heating the 3D printed object in the sintering oven to sinter the 3D printed object while being supported by the pin array.
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公开(公告)号:US11701830B2
公开(公告)日:2023-07-18
申请号:US17141616
申请日:2021-01-05
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: James Elmer Abbott, Jr. , David A. Champion , Fernando Juan
IPC: B29C64/20 , B29C64/379 , B33Y10/00 , B29C64/165 , C04B35/584 , C04B35/185 , C04B35/553 , B32B18/00 , C04B35/46 , C04B35/486 , C04B35/14 , C04B35/053 , C04B35/111 , C04B35/583 , C04B35/653 , C04B35/495 , C04B35/505 , B33Y30/00 , B33Y50/02 , B33Y70/00 , B29C64/393 , B29C71/02 , B29C35/08 , B22F3/105 , B29C64/291
CPC classification number: B29C64/379 , B29C64/165 , B29C64/393 , B32B18/00 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y70/00 , C04B35/053 , C04B35/111 , C04B35/14 , C04B35/185 , C04B35/46 , C04B35/486 , C04B35/495 , C04B35/505 , C04B35/553 , C04B35/583 , C04B35/584 , C04B35/653 , B22F3/105 , B29C35/0805 , B29C64/291 , B29C71/02 , B29C2035/0855 , C04B2235/5436 , C04B2235/6025
Abstract: In example implementations, a method for extracting layers of build material into a carrier. The method includes providing a layer of build material onto a bed. Portions of the layer of build material on the bed are digitally printed with a liquid functional material (LFM). The method repeats providing the layer of build material and digitally printing without applying energy to the LFM to define a structure in layers of build material on the bed. The layers of build material are extracted into a carrier and the carrier is removed.
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