公开(公告)号：US20230256440A1

公开(公告)日：2023-08-17

申请号：US18011502

申请日：2020-06-26

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Roberto A. Pugliese ,  Kathryn H. Cyr ,  Michael J. Day ,  Diane R. Hammerstad

IPC: B01L3/00 ,  G01N1/34

CPC classification number: B01L3/502761 ,  G01N1/34 ,  B01L2200/0652 ,  B01L2300/0636 ,  B01L2300/088 ,  G01N2015/1081

Abstract: In one example in accordance with the present disclosure, am ejection system is described. The ejection system includes a fluid feed slot to supply fluid to a number of fluid ejection channels where each fluid ejection channel is a recirculating channel. Each fluid ejection channel includes a sensor to detect, in the fluid, a target particle to be ejected and a fluid ejector to eject the target particle from the fluid ejection channel. The ejection system also includes a controller to selectively activate the fluid ejector when the target particle presence is detected. Non-target particles are returned to the fluid feed slot past the fluid ejector.

公开(公告)号：US20180001636A1

公开(公告)日：2018-01-04

申请号：US15544999

申请日：2015-03-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Zhizhang Chen ,  James Elmer Abbott, JR. ,  Michael W. Cumbie ,  Roberto A. Pugliese

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14129 ,  B41J2/14024 ,  B41J2/1603 ,  B41J2/1642 ,  B41J2/1646

Abstract: In one example, a printhead structure includes an ejector element, a multi-layer insulator covering the ejector element, and an amorphous metal on the insulator.

公开(公告)号：US12280594B2

公开(公告)日：2025-04-22

申请号：US17603475

申请日：2019-09-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Jeffrey A. Nielsen ,  Matthew David Smith ,  Roberto A. Pugliese

IPC: B41J2/045

Abstract: In one example in accordance with the present disclosure, a fluid ejection system is described. The fluid ejection system includes a frame to retain a number of fluid ejection devices. Each fluid ejection device includes a reservoir disposed on a first side of the frame and a fluid ejection die disposed on an opposite side of the frame. Each fluid ejection die includes 1) a fluid feed slot formed in a substrate to receive fluid from the reservoir, 2) an array of nozzles formed in the substrate to eject fluid, and 3) an ejection adjustment system to selectively adjust an amount of fluid ejected from the fluid ejection devices.

公开(公告)号：US20230241609A1

公开(公告)日：2023-08-03

申请号：US18010794

申请日：2020-06-17

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Jeffrey A. Nielsen ,  Viktor Shkolnikov ,  Erica Squires ,  Roberto A. Pugliese ,  Matthew D. Smith ,  Michael J. Day ,  Diane R. Hammerstad

IPC: B01L3/00 ,  G01N15/10

CPC classification number: B01L3/502746 ,  G01N15/1031 ,  G01N15/1056 ,  B01L2300/0663 ,  B01L2400/08 ,  B01L2200/061 ,  B01L2200/027 ,  B01L2300/0867 ,  B01L2200/0647

Abstract: A method of detecting passage of a particle into a target location includes receiving a sample on a die including a microfluidic chamber, the microfluidic chamber including a microfluidic path coupling a reservoir to a foyer, and moving the sample from the reservoir to the foyer by firing a nozzle fluidically coupled to the foyer. The method further includes detecting passage of a particle of the sample from the reservoir to the foyer via a first sensor disposed within the microfluidic path, and detecting passage of the particle into the target location via a second sensor disposed between the first sensor and the nozzle. The method includes recording in a dispense map, an indication of whether the target location includes a single particle or multiple particles based on signals measured by the first sensor and the second sensor.

公开(公告)号：US20220194078A1

公开(公告)日：2022-06-23

申请号：US17603475

申请日：2019-09-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Jeffrey A. Nielsen ,  Matthew David Smith ,  Roberto A. Pugliese

IPC: B41J2/045

Abstract: In one example in accordance with the present disclosure, a fluid ejection system is described. The fluid ejection system includes a frame to retain a number of fluid ejection devices. Each fluid ejection device includes a reservoir disposed on a first side of the frame and a fluid ejection die disposed on an opposite side of the frame. Each fluid ejection die includes 1) a fluid feed slot formed in a substrate to receive fluid from the reservoir, 2) an array of nozzles formed in the substrate to eject fluid, and 3) an ejection adjustment system to selectively adjust an amount of fluid ejected from the fluid ejection devices.

公开(公告)号：US09469107B2

公开(公告)日：2016-10-18

申请号：US14787729

申请日：2013-07-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： James Elmer Abbott, Jr. ,  Roberto A. Pugliese ,  Greg Scott Long

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14129 ,  B41J2/14016 ,  B41J2/14088 ,  B41J2/14112 ,  B41J2/1601 ,  B41J2/164 ,  B41J2/1642 ,  B41J2/1646 ,  B41J2202/03 ,  B41J2202/11 ,  H01C1/148 ,  H01C7/006 ,  H01C17/0652 ,  H01C17/06526 ,  H01L27/11582 ,  H01L28/00

Abstract: The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous metal resistor, including an insulated substrate and a resistor applied to the insulated substrate. The resistor can include from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron; and from 5 atomic % to 90 atomic % each of a first and second metal of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, where the second metal is different than the first metal. The metalloid, the first metal, and the second metal can account for at least 70 atomic % of the amorphous thin metal film.

Abstract translation: 本公开涉及具有非晶金属电阻器的热喷墨打印头堆叠，其包括绝缘基板和施加到绝缘基板的电阻器。 电阻器可以包括5原子％至90原子％的碳，硅或硼准金属; 和钛，钒，铬，钴，镍，锆，铌，钼，铑，钯，铪，钽，钨，铱或铂的第一和第二金属的5原子％至90原子％ 第二金属与第一金属不同。 准金属，第一金属和第二金属可以占非晶金属薄膜的至少70原子％。