Abstract:
An SiC ingot includes a bottom face having 4 sides; four side faces extending from the bottom face in a direction intersecting the direction of the bottom face; and a growth face connected with the side faces located at a side opposite to the bottom face. At least one of the bottom face, the side faces, and the growth face is the {0001} plane, {1-100} plane, {11-20} plane, or a plane having an inclination within 10° relative to these planes.
Abstract:
A semiconductor device including a nonvolatile memory cell in which a writing transistor which includes an oxide semiconductor, a reading transistor which includes a semiconductor material different from that of the writing transistor, and a capacitor are included is provided. Data is written to the memory cell by turning on the writing transistor and applying a potential to a node where a source electrode (or a drain electrode) of the writing transistor, one electrode of the capacitor, and a gate electrode of the reading transistor are electrically connected, and then turning off the writing transistor, so that the predetermined amount of charge is held in the node. Further, when a p-channel transistor is used as the reading transistor, a reading potential is a positive potential.
Abstract:
It is an object to provide a semiconductor device with a novel structure in which stored data can be held even when power is not supplied, and does not have a limitation on the number of writing operations. A semiconductor device includes a plurality of memory cells each including a transistor including a first semiconductor material, a transistor including a second semiconductor material that is different from the first semiconductor material, and a capacitor, and a potential switching circuit having a function of supplying a power supply potential to a source line in a writing period. Thus, power consumption of the semiconductor device can be sufficiently suppressed.
Abstract:
A supporting portion (30c) made of silicon carbide has irregularities at at least a portion of a main surface (FO). The supporting portion (30c) and at least one single crystal substrate (11) made of silicon carbide are stacked such that the backside surface (B1) of each at least one single crystal substrate (11) and the main surface (FO) of the supporting portion (30c) having irregularities formed contact each other. In order to connect the backside surface (B1) of each at least one single crystal substrate (11) to the supporting portion (30c), the supporting portion (30c) and at least one single crystal substrate (11) are heated such that the temperature of the supporting portion (30c) exceeds the sublimation temperature of silicon carbide, and the temperature of each at least one single crystal substrate (11) is below the temperature of the supporting portion (30c).
Abstract:
A method for manufacturing a silicon carbide substrate includes the steps of: preparing a SiC substrate made of single-crystal silicon carbide; disposing a base substrate in a crucible so as to face a main surface of the SiC substrate; and forming a base layer made of silicon carbide in contact with the main surface of the SiC substrate, by heating the base substrate in the crucible to fall within a range of temperature higher than a sublimation temperature of silicon carbide constituting the base substrate. In the step of forming the base layer, a gas containing silicon is introduced into the crucible.
Abstract:
A semiconductor device includes a first signal line, a second signal line, a memory cell, and a potential converter circuit. The memory cell includes a first transistor including a first gate electrode, a first source electrode, a first drain electrode, and a first channel formation region; a second transistor including a second gate electrode, a second source electrode, a second drain electrode, and a second channel formation region; and a capacitor. The first channel formation region and the second channel formation region include different semiconductor materials. The second drain electrode, one electrode of the capacitor, and the first gate electrode are electrically connected to one another. The second gate electrode is electrically connected to the potential converter circuit through the second signal line.
Abstract:
A regulator circuit stabilizes the input voltage applied to an input terminal before outputting the output voltage via an output terminal. An output transistor is provided between the input terminal and the output terminal. An error amplifier adjusts the voltage applied to the control terminal of the output transistor such that a voltage that corresponds to the output voltage approaches a predetermined reference voltage. A fluctuation detection capacitor is provided on a path from the input terminal to the grounded terminal. One terminal of the fluctuation detection capacitor is set to a fixed electric potential. In a case that the input voltage is lower than the voltage at the other terminal of the fluctuation detection capacitor, an undershoot suppressing circuit forcibly reduces the gate voltage of the output transistor.
Abstract:
The objective of this invention is to provide an oil-based cleansing composition which retains high performance capability for cleansing, is free from the occurrence of cloudiness in the appearance and does not cause the reduction of the performance capability for massaging, even when water is interfused therein, and further is reduced in the irritation to an eye and is of good safety.An oil-based cleansing composition of this invention is characterized in that comprising (A) a nonionic surfactant having a HLB of 6 to 14, and (B) an oil component, and said oil-based cleansing composition satisfies the following conditions (1) and (2): (1) the amount of water in the composition is less than 5% by mass, and (2) a micellar aqueous solution phase or a bicontinuous microemulsion phase is formed when said oil-based cleansing composition and water are mixed in the ratio of 4:6.
Abstract:
An output transistor is provided between an input terminal and an output terminal. An error amplifier adjusts the gate voltage of the output transistor such that the voltage that corresponds to the output voltage approaches a predetermined reference voltage. A fluctuation detection capacitor is provided on a path from the input terminal to a grounded terminal, which sets one terminal thereof to a fixed voltage. A current feedback circuit supplies, to the gate of the output transistor, the current that corresponds to the current that flows through the fluctuation detection capacitor. A clamp circuit clamps the gate voltage of the output transistor. The clamp circuit 30 clamps the gate voltage of the output transistor such that the voltage difference between the gate of the output transistor and the input terminal exhibits a predetermined clamp voltage or more.
Abstract:
An output transistor is provided between an input terminal and an output terminal. An error amplifier adjusts the gate voltage of the output transistor such that the voltage that corresponds to the output voltage approaches a predetermined reference voltage. A fluctuation detection capacitor is provided on a path from the input terminal to a grounded terminal, which sets one terminal thereof to a fixed voltage. A current feedback circuit supplies, to the gate of the output transistor, the current that corresponds to the current that flows through the fluctuation detection capacitor. A clamp circuit clamps the gate voltage of the output transistor. The clamp circuit 30 clamps the gate voltage of the output transistor such that the voltage difference between the gate of the output transistor and the input terminal exhibits a predetermined clamp voltage or more.