-
Patent Agency Ranking
公开(公告)号：CA892278A
公开(公告)日：1972-02-01
申请号：CA892278D
Applicant: IBM
Inventor： FEINBERG IRVING , SITLER CARL L , LANGDON JACK L
-
-
公开(公告)号：CA783281A
公开(公告)日：1968-04-16
申请号：CA783281D
Applicant: IBM
Inventor： PECORARO RAYMOND P , LANGDON JACK L
-
14.发明专利
公开(公告)号：CA1137647A
公开(公告)日：1982-12-14
申请号：CA349746
申请日：1980-04-14
Applicant: IBM
Inventor： FEINBERG IRVING , LANGDON JACK L
IPC: H01L23/12 , H01L23/433 , H01L23/473 , H01L23/50 , H01L23/538 , H05K1/00 , H05K1/03 , H05K7/20
Abstract: IMPROVED PACKAGE FOR MOUNTING AND INTERCONNECTING A PLURALITY OF LARGE SCALE INTEGRATED SEMICONDUCTOR DEVICES A package for mounting interconnecting, and cooling a large number of integrated circuit semiconductor devices having a sintered multilayer ceramic substrate provided with an internal metallurgy network made up of voltage planes, X and Y signal planes, and fan-out planes, with I/O pins on the bottom surface and a plurality of asymmetrical solder pad clusters for flip chip bonding to a plurality of integrated circuit devices on the top surface, a plurality of integrated circuit devices bonded to the solder pad clusters, at least one row elongated engineering change pads surrounding each pad cluster, each pad provided with a severable surface link, the I/O pins connected to the internal network of the substrate and arranged in clusters with the powering voltages of each device located directly beneath the device thereby minimizing voltage drop, and signal voltages inputted through the I/O pins interspersed between the clusters of power pins, a cap for forming an enclosure over at least the top surface of the ceramic substrate, and a liquid cooling means associated with the cap for removing heat from the devices. FI 9-79-045
-
公开(公告)号：CA769335A
公开(公告)日：1967-10-10
申请号：CA769335D
Applicant: IBM
Inventor： LANGDON JACK L , PECORARO RAYMOND P , HARDING WILLIAM E
-
-
-
-
Search Results
15
records
(took 0.017 seconds)
