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    Screen printer for microelectronic chips - uses metal foil stencils peeled from work after printing and returned to container
    14.
    发明专利
    Screen printer for microelectronic chips - uses metal foil stencils peeled from work after printing and returned to container 未知

    公开(公告)号：FR2336258A1

    公开(公告)日：1977-07-22

    申请号：FR7634525

    申请日：1976-11-08

    Applicant: IBM

    Inventor： MILLER LEWIS F

    IPC: B41M1/12 ,  B41M1/34 ,  H05K3/12 ,  G03F9/00 ,  H01L21/72

    Abstract: The screen print method is esp, for printing circuits on microelectronic chips and has flexible metal foil stencils (42) stored in a container from which they are individually withdrawn and placed in registered position, eg as determined by locating dowels (58), on a chip (56) to be printed. The stencil is held down electromagnetically, eg by a series of electromagnets (70). After printing the stencil is peeled off and returned to the container which pref contains a cleaning fluid. During peeling the electromagnets may be de-energised progressively in accordance with the peeling action. Transport of the stencils to and from the printing station may be by magnetic grippers (84).

    16.
    发明专利
    未知

    公开(公告)号：FR2340288A1

    公开(公告)日：1977-09-02

    申请号：FR7639690

    申请日：1976-12-23

    Applicant: IBM

    Inventor： BLAZICK LINDA A ,  MILLER LEWIS F

    IPC: H05K3/46 ,  C04B41/51 ,  C04B41/88 ,  H01L21/48 ,  H01L23/15 ,  H01L23/538 ,  H05K1/09 ,  C04B41/38 ,  B28D5/06 ,  H01L21/70

    Abstract: A method for manufacturing a multilayer ceramic which is particularly suitable for carrying semiconductor chips. In order to join a semiconductor chip to a multilayer ceramic substrate, it is necessary that the projected site for the semiconductor chip be substantially flat. If there is a bulge, it becomes difficult to make a good joint thereto. The method involves depositing a particulate mixture containing a metal and the metal's oxide in a ratio of between 1:1 to 9:1 in a pattern on at least a portion of the plurality of ceramic layers. The patterns are then dried. The plurality of substrates or layers of ceramic are then laminated under substantial pressure and fired at an elevated temperature. The addition of the metal oxide to the metal powder allows the shrinkage of the metallization compound so that it may more nearly match that of the ceramic it is coated upon during the firing step. This matching of the shrinkage during firing prevents cracking of the ceramic.

    METHOD FOR PREPARING A MULTILAYER CERAMIC
    20.
    发明专利
    METHOD FOR PREPARING A MULTILAYER CERAMIC 未知

    公开(公告)号：CA1078079A

    公开(公告)日：1980-05-20

    申请号：CA271025

    申请日：1977-02-03

    Applicant: IBM

    Inventor： BLAZICK LINDA A ,  MILLER LEWIS F

    IPC: H05K3/46 ,  C04B41/51 ,  C04B41/88 ,  H01L21/48 ,  H01L23/15 ,  H01L23/538 ,  H05K1/09 ,  H05K1/04 ,  H05K3/10

    Abstract: A METHOD FOR PREPARING A MULTILAYER CERAMIC A method for manufacturing a multilayer ceramic which is particularly suitable for carrying semiconductor chips. In order to join a semiconductor chip to a multilayer ceramic substrate, it is necessary that the projected site for the semiconductor chip be substantially flat. If there is a bulge, it becomes difficult to make a good joint thereto. The method involves depositing a particulate mixture containing a metal and the metal's oxide in a ratio of between 1:1 to 9:1 in a pattern on at least a portion of the plurality of ceramic layers. The patterns are then dried. The plurality of substrates or layers of ceramic are then laminated under substantial pressure and fired at an elevated temperature. The addition of the metal oxide to the metal powder allows the shrinkage of the metallization compound so that it may more nearly match that of the ceramic it is coated upon during the firing step. This matching of the shrinkage during firing prevents cracking of the ceramic.

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