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公开(公告)号：DE3485758T2
公开(公告)日：1993-02-04
申请号：DE3485758
申请日：1984-10-19
Applicant: IBM DEUTSCHLAND
Inventor： ARAPS CONSTANCE JOAN , KANDETZKE STEVEN MICHAEL , TAKACS MARK ANTHONY
IPC: H01L23/29 , C08F290/00 , C08F299/02 , C08G73/10 , H01L21/312 , H01L23/31
Abstract: Thin dielectric films are formed on an electronic component by in situ curing a polymerizable oligomer which is end capped with vinyl and/or acetylenic end groups. An electronic component comprising the cured product is also disclosed.
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