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公开(公告)号:CA1117653A
公开(公告)日:1982-02-02
申请号:CA292298
申请日:1977-12-02
Applicant: IBM
Inventor: VOGEL MARCEL J , VOGEL SIEGFRIED F
Abstract: WAFER INDEXING SYSTEM A wafer indexing and mapping system is useful for precisely locating artifacts, defects, and fabricated structural components on a wafer. A permanent micrometer grid pattern is applied to the backside of the wafer, for example, a transparent bubble wafer. The grid pattern forms an array of uniform size cells, for example, 40 unit cells wide by 40 unit cells long. Each unit cell is divided into smaller units on each side. Each cell contains a coding or indexing system to identify the row and column of the cell in the grid pattern. The grid pattern contains orientation bars which identify orientation with respect to particular wafer reference lines. The simultaneous viewing of the wafer and the grid pattern permits an accurate permanent mapping of the artifacts, defects, and fabricated structural components on the wafer, as well as on the individual small chips formed by dicing the wafer.
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公开(公告)号:FR2385103A1
公开(公告)日:1978-10-20
申请号:FR7804189
申请日:1978-02-08
Applicant: IBM
Inventor: VOGEL MARCEL J , VOGEL SIEGFRIED F
IPC: G11C11/14 , G01B3/02 , G01B11/30 , G01N27/04 , G01N27/20 , G03F7/20 , H01F10/00 , H01L23/544 , G01R31/26 , H01L21/66
Abstract: A wafer indexing and mapping system is useful for precisely locating artifacts, defects, and fabricated structural components on a wafer. A permanent micrometer grid pattern is applied to the backside of the wafer, for example, a transparent bubble wafer. The grid pattern forms an array of uniform size cells, for example, 40 unit cells wide by 40 unit cells long. Each unit cell is divided into smaller units on each side. Each cell contains a coding or indexing system to identify the row and column of the cell in the grid pattern. The grid pattern contains orientation bars which identify orientation with respect to particular wafer reference lines. The simultaneous viewing of the wafer and the grid pattern permits an accurate permanent mapping of the artifacts, defects, and fabricated structural components on the wafer, as well as on the individual small chips formed by dicing the wafer.
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公开(公告)号:CA757999A
公开(公告)日:1967-05-02
申请号:CA757999D
Applicant: IBM
Inventor: BROOKMAN JOHN W , VOGEL MARCEL J
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公开(公告)号:DE1159091B
公开(公告)日:1963-12-12
申请号:DEJ0018337
申请日:1960-06-25
Applicant: IBM
Inventor: VOGEL MARCEL J
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公开(公告)号:BE608004A
公开(公告)日:1962-01-02
申请号:BE608004
申请日:1961-09-08
Applicant: IBM
Inventor: VOGEL MARCEL J
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