公开(公告)号：DE10342980B3

公开(公告)日：2005-01-05

申请号：DE10342980

申请日：2003-09-17

Applicant: DISCO HI TEC EUROP GMBH ,  INFINEON TECHNOLOGIES AG

Inventor： PRIEWASSER KARL HEINZ ,  WINTER SYLVIA

IPC: H01L21/68 ,  H01L21/78 ,  H01L25/065 ,  H01L21/50 ,  H01L21/66

Abstract: The method uses chips (1) formed on a semiconductor wafer (2) and separated from one another, with function testing of the chips in a first step and application of an adhesive material to acceptable chips (1a), the adhesive material not applied to unacceptable chips (1b), which are removed subsequently for replacement by acceptable chips.