公开(公告)号：EP4155788A1

公开(公告)日：2023-03-29

申请号：EP22191139.9

申请日：2022-08-19

Applicant: INTEL Corporation

Inventor： NIE, Bai ,  TADAYON, Pooya ,  ARANA, Leonel ,  LI, Yonggang ,  LIU, Changhua ,  DARMAWIKARTA, Kristof Kuwawi ,  PIETAMBARAM, Srinivas V. ,  IBRAHIM, Tarek A. ,  MAHALINGAM, Hari ,  DUONG, Benjamin

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/30 ,  G02B6/42

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a photonic integrated circuit and an in situ formed waveguide. In selected examples, the electronic device includes a photonic integrated circuit coupled to an electronic integrated circuit, in a glass layer, where a waveguide is formed in the glass layer.

公开(公告)号：EP4152060A1

公开(公告)日：2023-03-22

申请号：EP22189557.6

申请日：2022-08-09

Applicant: INTEL Corporation

Inventor： DARMAWIKARTA, Kristof ,  PIETAMBARAM, Srinivas V. ,  IBRAHIM, Tarek A. ,  MAHALINGAM, Hari ,  DUONG, Benjamin ,  NIE, Bai

IPC: G02B6/122 ,  G02B6/132 ,  G02B6/136

Abstract: Embodiments disclosed herein include electronic packages with photonics integrated circuits (PICs). In an embodiment, an electronic package comprises a glass substrate with a first recess and a second recess. In an embodiment, a PIC is in the first recess. In an embodiment, an optics module is in the second recess, and an optical waveguide is embedded in the glass substrate between the first recess and the second recess. In an embodiment, the optical waveguide optically couples the PIC to the optics module.