公开(公告)号：US08999765B2

公开(公告)日：2015-04-07

申请号：US13925967

申请日：2013-06-25

Applicant: Intel Corporation

Inventor： Manish Dubey ,  Rajendra C. Dias ,  Yonghao Xiu ,  Arjun Krishnan ,  Yiqun Bai ,  Purushotham Kaushik Muthur Srinath

IPC: H01L23/488 ,  H01L21/56

CPC classification number: H01L21/563 ,  H01L23/00 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of the present description include methods for attaching a microelectronic device to a microelectronic substrate with interconnection structures after disposing of an underfill material on the microelectronic device, wherein filler particles within the underfill material may be repelled away from the interconnection structures prior to connecting the microelectronic device to the microelectronic structure. These methods may include inducing a charge on the interconnection structures and may include placing the interconnection structures between opposing plates and producing a bias between the opposing plates after depositing the underfill material on the interconnection structures.

Abstract translation: 本说明书的实施例包括在微电子器件上处理底部填充材料之后，将微电子器件附着到具有互连结构的微电子衬底的方法，其中在将微电子器件连接到底部填充材料之前，底部填充材料内的填料颗粒可能被排除离开互连结构 器件到微电子结构。 这些方法可以包括在互连结构上引入电荷，并且可以包括将互连结构放置在相对的板之间，并且在将底部填充材料沉积在互连结构上之后在相对的板之间产生偏压。

公开(公告)号：US10115606B2

公开(公告)日：2018-10-30

申请号：US15139265

申请日：2016-04-26

Applicant: Intel Corporation

Inventor： Yiqun Bai ,  Yuying Wei ,  Arjun Krishnan ,  Suriyakala Ramalingam ,  Yonghao Xiu ,  Beverly J. Canham ,  Sivakumar Nagarajan ,  Saikumar Jayaraman ,  Nisha Ananthakrishnan

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/28 ,  H01L21/56 ,  H01L23/29 ,  H01L23/00

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.

公开(公告)号：US09793151B2

公开(公告)日：2017-10-17

申请号：US14568552

申请日：2014-12-12

Applicant: Intel Corporation

Inventor： Xavier Brun ,  Arjun Krishnan ,  Mohit Mamodia ,  Dingying Xu

IPC: H01L21/683 ,  H01L21/78 ,  H01L21/304 ,  H01L23/00

CPC classification number: H01L21/6836 ,  H01L21/304 ,  H01L21/78 ,  H01L23/562 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Some example forms relate to a stiffener tape for a wafer. The stiffener tape includes a mounting tape and a stiffener removably attached to the mounting tape. The stiffener tape further includes a die attach film attached to the stiffener. Other example forms relate to an electronic assembly that includes a wafer and a stiffener tape attached to the wafer. The stiffener tape includes a die attach film mounted to the wafer. A stiffener is attached to the die attach film and a mounting tape is removably attached to the stiffener. Still other example forms relate to a method that includes forming a stiffener tape which includes a mounting tape, a stiffener removably attached to the mounting tape and a die attach film attached to the stiffener.

公开(公告)号：US09704767B1

公开(公告)日：2017-07-11

申请号：US14998368

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Suriyakala Ramalingam ,  Yiqun Bai ,  Nisha Ananthakrishnan ,  Arjun Krishnan

IPC: H01L23/29 ,  H01L21/56 ,  H01L23/16 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L21/4853 ,  H01L23/15 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/3511

Abstract: Techniques and mechanisms for mitigating warpage of structures in a package. In an embodiment, a packaged integrated circuit device includes a mold compound disposed at least partially around an integrated circuit chip. The mold compound comprises fibers suspended in a media that is to aid in mechanical reinforcement of such fibers. The reinforced fibers contribute to mold compound properties that resist warping of the IC chip that might otherwise take place as a result of solder reflow or other processing. A modulus of elasticity of the mold compound is equal to or more than three GigePascals (3 GPa), where the modulus of elasticity corresponds to a temperature equal to two hundred and sixty degrees Celsius (260° C.). In another embodiment, a spiral flow value of the mold compound is equal to or more than sixty five centimeters (65 cm).

公开(公告)号：US09640415B2

公开(公告)日：2017-05-02

申请号：US14556994

申请日：2014-12-01

Applicant: Intel Corporation

Inventor： Randall D Lowe, Jr. ,  Suriyakala Suriya Ramalingam ,  Nisha Ananthakrishnan ,  James C. Matayabas, Jr. ,  Arjun Krishnan ,  Hitesh Arora

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/544 ,  C09D11/101 ,  C09D11/20

CPC classification number: H01L21/56 ,  C09D11/101 ,  C09D11/20 ,  H01L23/296 ,  H01L23/544 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.

公开(公告)号：US09230833B2

公开(公告)日：2016-01-05

申请号：US14638328

申请日：2015-03-04

Applicant: INTEL CORPORATION

Inventor： Manish Dubey ,  Rajendra C. Dias ,  Yonghao Xiu ,  Arjun Krishnan ,  Yiqun Bai ,  Purushotham Kaushik Muthur Srinath

IPC: H01L21/56 ,  H01L23/00

CPC classification number: H01L21/563 ,  H01L23/00 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of the present description include methods for attaching a microelectronic device to a microelectronic substrate with interconnection structures after disposing of an underfill material on the microelectronic device, wherein filler particless within the underfill material may be repelled away from the interconnection structures prior to connecting the microelectronic device to the microelectronic structure. These methods may include inducing a charge on the interconnection structures and may include placing the interconnection structures between opposing plates and producing a bias between the opposing plates after depositing the underfill material on the interconnection structures.

Abstract translation: 本说明书的实施例包括在微电子器件上处理底部填充材料之后将微电子器件附着到具有互连结构的微电子衬底的方法，其中，在将微电子器件连接到微电子器件之前，底部填充材料内的填料颗粒可能被排除离开互连结构 器件到微电子结构。 这些方法可以包括在互连结构上引入电荷，并且可以包括将互连结构放置在相对的板之间，并且在将底部填充材料沉积在互连结构上之后在相对的板之间产生偏压。

公开(公告)号：US08900919B2

公开(公告)日：2014-12-02

申请号：US13801059

申请日：2013-03-13

Applicant: Intel Corporation

Inventor： Randall D. Lowe, Jr. ,  Suriyakala Suriya Ramalingam ,  Nisha Ananthakrishnan ,  James C. Matayabas, Jr. ,  Arjun Krishnan ,  Hitesh Arora

IPC: H01L21/44 ,  H01L23/02 ,  H01L23/28 ,  C09D11/107

CPC classification number: H01L21/56 ,  C09D11/101 ,  C09D11/20 ,  H01L23/296 ,  H01L23/544 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.

Abstract translation: 本文公开了在光引发剂存在下使用UV诱导的聚合方法将聚丙烯酸酯聚合物共价且不可分割地锚定到氧化物表面的方法。 通过该方法制备的方法和组合物可用作用于微电子封装的不可擦除的标记材料，以及用作焊料和密封剂屏障以防止液体在微电子封装的氧化物表面上的过度扩散。 在通过连接剂与丙烯酸酯反应性基团键合的作为第一结构域的氧化物反应性甲硅烷基的粘合促进剂的印刷和UV固化过程中，聚丙烯酸酯聚合物共价连接到氧化物表面。