公开(公告)号：US20190041922A1

公开(公告)日：2019-02-07

申请号：US16052590

申请日：2018-08-01

Applicant: Intel Corporation

Inventor： Prakash Kurma Raju ,  Babu Triplicane Gopikrishnan ,  Bijendra Singh ,  Prasanna Pichumani ,  Doddi Raghavendra ,  Harish Jagadish ,  Gopinath Kandasamy ,  David Pidwerbecki

IPC: G06F1/20 ,  G06F1/16 ,  H05K7/20

Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.