公开(公告)号：US20180143662A1

公开(公告)日：2018-05-24

申请号：US15577214

申请日：2015-06-27

Applicant: Intel Corporation

Inventor： Ralph V. Miele ,  Amin Mohammed Godil ,  Andrew Larson ,  Shantanu D. Kulkarni ,  Dan H. Gerbus ,  Andrew C. Dausman ,  David A. Rittenhouse

IPC: G06F1/16

CPC classification number: G06F1/16 ,  G06F1/1675 ,  G06F1/1686 ,  H04N13/204

Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). The electronic device may also include a first housing and a structurally sensitive module. The structurally sensitive module can include a structurally sensitive component and a structurally sensitive attachment. The structurally sensitive attachment includes one or more mounting tabs to structurally isolate the structurally sensitive component from the first housing.

公开(公告)号：US20170314871A1

公开(公告)日：2017-11-02

申请号：US15393251

申请日：2016-12-29

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: F28D15/02 ,  F28D15/04 ,  F28F13/16 ,  F28D21/00

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in heat sinks are disclosed. An example embodiment includes: a base; and a plurality of fins in thermal coupling with the base, each fin of the plurality of fins having a wickless capillary driven constrained vapor bubble heat pipe embedded in the fin, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

公开(公告)号：US12081952B2

公开(公告)日：2024-09-03

申请号：US17111130

申请日：2020-12-03

Applicant: Intel Corporation

Inventor： Shantanu D. Kulkarni ,  Jeff Ku ,  Sumod Cherukkate ,  Tongyan Zhai ,  Srikanth Potluri ,  Jordan E. Maslov

IPC: H04R3/04 ,  G10K11/175 ,  H04R1/22 ,  H05K7/20

CPC classification number: H04R3/04 ,  G10K11/175 ,  G10K11/1752 ,  H04R1/222 ,  H05K7/20

Abstract: Systems, apparatus, articles of manufacture, methods are disclosed to reshape fan noise of a fan of an electronic device. An example system includes a microphone to detect a first acoustic signal including fan noise. The example system also includes a processor to: identify a tone in the first acoustic signal; and determine a gain to add to the first acoustic signal to mask the tone. In addition, the example system includes a sound transducer to present a second acoustic signal including the gain.

公开(公告)号：US11313998B2

公开(公告)日：2022-04-26

申请号：US16728872

申请日：2019-12-27

Applicant: Intel Corporation

Inventor： Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Michael Daniel Rosenzweig ,  Denica N. Larsen

IPC: G02B5/02 ,  G06K9/22

Abstract: An embodiment of a method of manufacturing a cover lens for an electronic display includes etching a first surface geometry on a first surface of the cover lens. In the embodiment, the method includes determining a plurality of angles of refraction at the first surface from light generated from the electronic display based on the first surface geometry. In the embodiment, the method includes determining a second surface geometry for a second surface of the cover lens based on the plurality of angles of refraction at the first surface. In the embodiment, the method includes etching the second surface geometry on the second surface of the cover lens.

公开(公告)号：US11237643B2

公开(公告)日：2022-02-01

申请号：US16713605

申请日：2019-12-13

Applicant: Intel Corporation

Inventor： Shantanu D. Kulkarni ,  Jeff Ku ,  James Okuley

IPC: G06F3/02 ,  G06F1/16

Abstract: Apparatus, devices, systems, methods, and articles of manufacture are disclosed for physical keyboards with multi-display computing devices. An example computing device includes a support plate, a first display hingedly coupled to the support plate, and a physical keyboard hingedly coupled to the support plate.

公开(公告)号：US20200266252A1

公开(公告)日：2020-08-20

申请号：US16866515

申请日：2020-05-04

Applicant: Intel Corporation

Inventor： Ramon C. Cancel Olmo ,  Evrim Binboga ,  Vivek Paranjape ,  Satish Prathaban ,  Shantanu D. Kulkarni ,  Kunjal S. Parikh ,  Siddhartha Saxena

IPC: H01L27/32 ,  H04N5/89

Abstract: Cameras are located within the display area of a display. In-display cameras allow for thinner display bezels. In-display cameras allow for the creation of ultra-high resolution images. The ability to capture an object from multiple perspectives allows for holographic image recording and playback. Multiple views of an image can be captured with varying depths of focus, allowing an image's depth of field to be adjusted during post processing. In-display cameras can also be used for user authentication, touch detection and three-dimensional gesture recognition. Thermal sensors located within the display area allow for control of the display temperature, improved control over system performance, and compensation for micro-LED degradation that can occur due to aging or increased temperature. Microlens assemblies located above pixels can adjust the viewing cone angle of the display or a portion of the display and microassemblies located under individual pixels or pixel arrays can adjust a viewing angle.

公开(公告)号：US10694641B2

公开(公告)日：2020-06-23

申请号：US15392589

申请日：2016-12-28

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: H05K7/20 ,  F28D15/02 ,  H05K1/02 ,  H01L23/427 ,  F28D15/04 ,  G06F1/20 ,  H01L21/48 ,  H01L23/538 ,  H05K1/18 ,  H05K3/00 ,  F28F13/16 ,  F28C3/08 ,  G06F1/16 ,  H05K5/00 ,  F28D21/00 ,  F21V8/00 ,  G02F1/1333

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

公开(公告)号：US20200019217A1

公开(公告)日：2020-01-16

申请号：US16582932

申请日：2019-09-25

Applicant: Intel Corporation

Inventor： Denica N. Larsen ,  Prosenjit Ghosh ,  Shantanu D. Kulkarni

IPC: G06F1/16

Abstract: An electronic device has a body with a first portion (e.g., a lid) and a second portion (e.g., a base). The first portion includes magnets, while the second portion includes attractive elements that the magnets are attracted to. The first and second portions may be coupled together with hinges. The force of magnetic attraction between the magnets and the attractive elements maintain the body in a closed configuration at certain orientations of the body (e.g., at certain angles that the body is tilted relative to an axis in the direction of the Earth's gravity). When the body is positioned at a threshold angle with respect to the axis in the direction of the Earth's gravity, a separating force acting on the (first or second) portion of the body that is closer to the Earth becomes greater than the force of magnetic attraction, causing the portions to separate and the body to be in an open configuration.

公开(公告)号：US20250113460A1

公开(公告)日：2025-04-03

申请号：US18979203

申请日：2024-12-12

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Smit Kapila ,  Min Suet Lim ,  Surya Pratap Mishra ,  Kari Mansukoski ,  Shantanu D. Kulkarni

IPC: H05K7/20 ,  G06F1/20

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for foldable thermal ground planes for electronic devices. An example an apparatus to cool an electronic device includes a first plate; a second plate; a plurality of first pillars extending between the first plate and the second plate, the plurality of first pillars having a first shape; a plurality of second pillars extending between the first plate and the second plate, the plurality of second pillars having a second shape, the second shape different than the first shape; and a hinge separating the apparatus into a first section and a second section, the plurality of second pillars in the hinge.

公开(公告)号：US11726579B2

公开(公告)日：2023-08-15

申请号：US17553294

申请日：2021-12-16

Applicant: Intel Corporation

Inventor： Shantanu D. Kulkarni ,  Jeff Ku ,  James Okuley

IPC: G06F3/02 ,  G06F1/16

CPC classification number: G06F3/0227 ,  G06F1/166 ,  G06F1/1666

Abstract: Apparatus, devices, systems, methods, and articles of manufacture are disclosed for physical keyboards with multi-display computing devices. An example computing device includes a first display, a second display, and a keyboard.