公开(公告)号：US20200235716A1

公开(公告)日：2020-07-23

申请号：US16648121

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Feras EID ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR ,  Johanna M. SWAN

IPC: H03H9/10 ,  H03H9/05 ,  H03H9/54

Abstract: Packaged RF front end systems including a hybrid filter and an active circuit in a single package are described. In an example, a package includes an active die comprising an acoustic wave resonator. A package substrate is electrically coupled to the active die. A seal frame surrounds the acoustic wave resonator and is attached to the active die and to the package substrate, the seal frame hermetically sealing the acoustic wave resonator in a cavity between the active die and the package substrate.

公开(公告)号：US20200168972A1

公开(公告)日：2020-05-28

申请号：US16613070

申请日：2017-07-01

Applicant: Intel Corporation

Inventor： Georgios DOGIAMIS ,  Sasha OSTER ,  Telesphor KAMGAING ,  Erich EWY ,  Kenneth SHOEMAKER ,  Adel ELSHERBINI ,  Johanna SWAN

IPC: H01P3/16 ,  B60W40/02 ,  B60R16/023 ,  B60R11/04

Abstract: Embodiments of the invention include autonomous vehicles and mm-wave systems for communication between components. In an embodiment the vehicle includes an electronic control unit (ECU). The ECU may include a printed circuit board (PCB) and a CPU die packaged on a CPU packaging substrate. In an embodiment, the CPU packaging substrate is electrically coupled to the PCB. The ECU may also include an external predefined interface electrically coupled to the CPU die. In an embodiment, an active mm-wave interconnect may include a dielectric waveguide, and a first connector coupled to a first end of the dielectric waveguide. In an embodiment, the first connector comprises a first mm-wave engine, and the first connector is electrically coupled to the external predefined interface. Embodiments may also include a second connector coupled to a second end of the dielectric waveguide, wherein the second connector comprises a second mm-wave engine.

公开(公告)号：US20200076040A1

公开(公告)日：2020-03-05

申请号：US16613386

申请日：2017-07-01

Applicant: Intel Corporation

Inventor： Georgios DOGIAMIS ,  Sasha OSTER ,  Telesphor KAMGAING ,  Erich EWY ,  Adel ELSHERBINI ,  Johanna SWAN

IPC: H01P5/02 ,  H01P3/16 ,  H05K5/02 ,  H05K5/00 ,  H05K1/18 ,  H01L25/18 ,  H01L23/66 ,  H01R13/646 ,  H01R13/622 ,  H01R13/631 ,  B60R16/023

Abstract: Embodiments of the invention include dielectric waveguides and connectors for dielectric waveguides. In an embodiment a dielectric waveguide connector may include an outer ring and one or more posts extending from the outer ring towards the center of the outer ring. In some embodiments, a first dielectric waveguide secured within the dielectric ring by the one or more posts. In another embodiment, an enclosure surrounding electronic components may include an enclosure wall having an interior surface and an exterior surface and a dielectric waveguide embedded within the enclosure wall. In an embodiment, a first end of the dielectric waveguide is substantially coplanar with the interior surface of the enclosure wall and a second end of the dielectric waveguide is substantially coplanar with the exterior surface of the enclosure wall.

公开(公告)号：US20200065263A1

公开(公告)日：2020-02-27

申请号：US15746792

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Shawna LIFF ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Sasha N. OSTER ,  Gaurav CHAWLA

IPC: G06F13/14 ,  G02B6/42 ,  H04M9/06 ,  H01P5/00 ,  H01Q13/10 ,  H04B1/40 ,  H04B7/00

Abstract: Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.

公开(公告)号：US20200052404A1

公开(公告)日：2020-02-13

申请号：US16345171

申请日：2016-12-14

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01Q9/04 ,  H01L23/552 ,  H01L21/56 ,  H01L23/31 ,  H01L23/66 ,  H01L23/495 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q1/22 ,  H01Q19/22

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US20190333882A1

公开(公告)日：2019-10-31

申请号：US16312904

申请日：2016-07-01

Applicant: INTEL CORPORATION

Inventor： Telesphor KAMGAING ,  Adel A. ELSHERBINI ,  Sasha N. OSTER

IPC: H01L23/66 ,  H01L23/498 ,  H01L21/48

Abstract: In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

公开(公告)号：US20180286687A1

公开(公告)日：2018-10-04

申请号：US15476842

申请日：2017-03-31

Applicant: INTEL CORPORATION

Inventor： Sasha N. OSTER ,  Fay HUA ,  Telesphor KAMGAING ,  Adel A. ELSHERBINI ,  Henning BRAUNISCH ,  Johanna M. SWAN

IPC: H01L21/285 ,  H01L21/768 ,  H01L21/033 ,  G03F7/16 ,  B82Y40/00

CPC classification number: H01L21/28562 ,  B82Y40/00 ,  H01L21/033 ,  H01L21/76822 ,  H01L21/76834

Abstract: Embodiments include devices and methods, including a method for processing a substrate. The method includes providing a substrate including a first portion and a second portion, the first portion including a feature, the feature including an electrically conductive region, the second portion including a dielectric surface region. The method also includes performing self-assembled monolayer (SAM) assisted structuring plating to form a structure comprising a metal on the dielectric surface region, the feature being formed using a process other than the SAM assisted structuring plating used to form the structure, and the structure being formed after the feature. Other embodiments are described and claimed.

公开(公告)号：US20180240762A1

公开(公告)日：2018-08-23

申请号：US15773033

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR ,  Javier A. FALCON ,  Shawna M. LIFF ,  Yoshihiro TOMITA

IPC: H01L23/66 ,  H01L25/16 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L23/48 ,  H01L23/49827 ,  H01L24/00 ,  H01L25/16 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15321 ,  H01L2924/18161 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104

Abstract: Embodiments of the invention include a microelectronic device that includes a first silicon based substrate having compound semiconductor components. The microelectronic device also includes a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20180227963A1

公开(公告)日：2018-08-09

申请号：US15748580

申请日：2015-11-23

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Rahul KHANNA

IPC: H04W76/10 ,  H05K7/14 ,  H04Q1/02

CPC classification number: H04W76/10 ,  H01L23/66 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2223/6688 ,  H01L2224/16221 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/19105 ,  H01Q1/2266 ,  H01Q1/2283 ,  H01Q3/30 ,  H04B1/38 ,  H04B1/48 ,  H04Q1/15 ,  H05K7/1487

Abstract: A blade computing system is described with a wireless communication between blades. In one embodiment, the system includes a first blade in the enclosure having a radio transceiver to communicate with a radio transceiver of a second blade in the enclosure. The second blade has a radio transceiver to communicate with the radio transceiver of the first blade. A switch in the enclosure communicates with the first blade and the second blade and establishes a connection through the respective radio transceivers between the first blade and the second blade.

公开(公告)号：US20180212306A1

公开(公告)日：2018-07-26

申请号：US15746364

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Sasha N. OSTER ,  Brandon M. RAWLINGS ,  Georgios C. DOGIAMIS

IPC: H01Q1/22 ,  H01Q9/04

CPC classification number: H01Q1/2283 ,  H01L2223/6677 ,  H01Q9/0457 ,  H01Q13/02

Abstract: Antennas are described for platform level wireless interconnects. In one example, a substantially flat package substrate has an attached radio. A conductive transmission line on the package substrate is electrically connected to the radio and an antenna is attached to the package substrate connected to the conductive transmission line, the antenna radiating to the side of the package.