公开(公告)号：US20140233961A1

公开(公告)日：2014-08-21

申请号：US13570263

申请日：2012-08-09

Applicant: KAI-WEN WU

Inventor： KAI-WEN WU

IPC: H04B10/40

CPC classification number: H04B10/40

Abstract: An optical communication module includes a substrate, an optical signal receiving unit, an optical signal emitting unit and a coupler. The substrate includes a first surface and a second surface. The substrate defines through holes passing through the first and second surfaces. The optical signal receiving unit includes optical-electrical signal converters. The optical signal emitting unit includes optical signal generators. Each of the optical-electrical signal converters and the optical signal generators is mounted on the first surface and aligned with a corresponding one of the through holes. The coupler includes coupling lenses. The coupler is fixed to the second surface. Each of the optical-electrical signal converters and the optical signal generators is aligned with a corresponding coupling lens through the corresponding through hole.

Abstract translation: 光通信模块包括基板，光信号接收单元，光信号发射单元和耦合器。 基板包括第一表面和第二表面。 衬底限定通过第一和第二表面的通孔。 光信号接收单元包括光电信号转换器。 光信号发射单元包括光信号发生器。 光电信号转换器和光信号发生器中的每一个安装在第一表面上并且与对应的一个通孔对准。 耦合器包括耦合透镜。 耦合器固定到第二表面。 每个光电信号转换器和光信号发生器通过相应的通孔与相应的耦合透镜对准。

公开(公告)号：US20130308901A1

公开(公告)日：2013-11-21

申请号：US13660015

申请日：2012-10-25

Applicant: KAI-WEN WU

Inventor： KAI-WEN WU

IPC: G02B6/32

CPC classification number: G02B6/4206 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/1215

Abstract: A light transmission system includes a light guide support, a first convex lens, an optical waveguide member, and two second convex lenses. The light guide support includes a first surface, a second surface, a hollow space formed between the first surface and the second surface, and an inner reflecting surface forming an angle of 45 degrees relative to the first surface. The first convex lens is formed at the first surface, and configured for converging light to the inner reflecting surface. The optical waveguide member is located at the hollow space, and includes a main section parallel with the first surface, two first branch sections extending from and forming equal angles relative to the main section, and two second branch sections extending from the respective first branch sections. The two second convex lenses are formed at the second surface and aligned with the respective second branch sections.

Abstract translation: 光传输系统包括导光支架，第一凸透镜，光波导元件和两个第二凸透镜。 导光支架包括第一表面，第二表面，形成在第一表面和第二表面之间的中空空间，以及相对于第一表面形成45度角的内部反射表面。 第一凸透镜形成在第一表面处，并被配置用于将光会聚到内反射面。 光波导部件位于中空空间，并且包括与第一表面平行的主部分，相对于主部分延伸并形成相等角度的两个第一分支部分和从相应的第一分支部分延伸的两个第二分支部分 。 两个第二凸透镜形成在第二表面并且与相应的第二分支部对准。

公开(公告)号：US20130294779A1

公开(公告)日：2013-11-07

申请号：US13597232

申请日：2012-08-28

Applicant: KAI-WEN WU

Inventor： KAI-WEN WU

IPC: H04B10/14

CPC classification number: G02B6/4214 ,  G02B6/4246 ,  G02B6/428

Abstract: A circuit board assembly includes a first circuit board, an optical transceiver, a second circuit board, and a number of light wave guides. The first circuit board includes a lower surface. The optical transceiver is mounted on the lower surface for sending and receiving light beams. The second circuit board is electrically connected to the first circuit board and includes a top surface facing the lower surface. The light wave guides are mounted on the top surface and optically coupled with the optical transceiver for transmitting the light beams.

Abstract translation: 电路板组件包括第一电路板，光收发器，第二电路板和多个光波导。 第一电路板包括下表面。 光收发器安装在下表面用于发送和接收光束。 第二电路板电连接到第一电路板，并且包括面向下表面的顶表面。 光波导安装在顶表面上，并与光收发器光耦合以传输光束。

公开(公告)号：US20130287344A1

公开(公告)日：2013-10-31

申请号：US13592359

申请日：2012-08-23

Applicant: KAI-WEN WU

Inventor： KAI-WEN WU

IPC: G02B6/36

CPC classification number: G02B6/4214 ,  G02B6/4206 ,  G02B6/4245 ,  G02B6/43

Abstract: A circuit board assembly includes a substrate, a first optical connector, a second optical connector, and at least two planar light wave circuits. The first optical connector includes a first circuit board electrically connected to the substrate, at least one first laser diode, at least one first photodiode, and a first transparent shell. The second optical connector includes a second circuit board connected to the substrate, at least one second laser diode, at least one second photodiode, and a second transparent shell. The planar light wave circuits are arranged between the first and second transparent shells. Each first laser diode is optically coupled with a second photodiode through a first transparent shell, a planar light wave circuit, and a second transparent shell. Each second laser diode is optically coupled with a first photodiode through a second transparent shell, a planar light wave circuit, and a first transparent shell.

Abstract translation: 电路板组件包括衬底，第一光学连接器，第二光学连接器以及至少两个平面光波形电路。 第一光学连接器包括电连接到基板的第一电路板，至少一个第一激光二极管，至少一个第一光电二极管和第一透明外壳。 第二光连接器包括连接到基板的第二电路板，至少一个第二激光二极管，至少一个第二光电二极管和第二透明外壳。 平面光波电路布置在第一和第二透明壳之间。 每个第一激光二极管通过第一透明外壳，平面光波电路和第二透明外壳与第二光电二极管光耦合。 每个第二激光二极管通过第二透明壳，平面光波电路和第一透明壳与第一光电二极管光学耦合。

公开(公告)号：US20130277847A1

公开(公告)日：2013-10-24

申请号：US13534247

申请日：2012-06-27

Applicant: KAI-WEN WU

Inventor： KAI-WEN WU

IPC: H01L23/488 ,  H01L21/60

CPC classification number: H01L24/29 ,  H01L23/12 ,  H01L23/3185 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L2224/2745 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33183 ,  H01L2224/33505 ,  H01L2224/83193 ,  H01L2224/83805 ,  H01L2224/83874 ,  H01L2224/83951 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01029 ,  H01L2924/00

Abstract: A chip package includes a PCB, a connecting pad fixed on a surface of the PCB and a chip fixed on the connecting pad. The connecting pad includes a first metal film on its surface facing away from the PCB. The chip includes a second metal film formed on its surface opposite to the PCB. The first and the second metal are connected to each other via a eutectic manner.

Abstract translation: 芯片封装包括PCB，固定在PCB的表面上的连接焊盘和固定在连接焊盘上的芯片。 连接焊盘包括在其背离PCB的表面上的第一金属膜。 芯片包括在其与PCB相对的表面上形成的第二金属膜。 第一和第二金属通过共晶方式彼此连接。

公开(公告)号：US20130142486A1

公开(公告)日：2013-06-06

申请号：US13445942

申请日：2012-04-13

Applicant: KAI-WEN WU

Inventor： KAI-WEN WU

IPC: G02B6/38

CPC classification number: G02B6/3853 ,  G02B6/3885

Abstract: An optical fiber coupling assembly includes a first optical fiber connector, a second optical fiber connector, and a cable. The first optical fiber connector defines a number of first blind holes receiving first focus lenses, and first through holes respectively communicating with the first blind holes. The second optical fiber connector defines a number of second blind holes receiving second focus lenses, and second through holes respectively communicating with the second blind holes. The cable includes a number of optical fibers. Each optical fiber includes a first end and a second end, and the first end is received in a corresponding one of the first through holes and aligned with the a corresponding one of the first focus lenses, and the second end is received in a corresponding one of the second through holes and aligned with a corresponding one of the second focus lenses.

Abstract translation: 光纤耦合组件包括第一光纤连接器，第二光纤连接器和电缆。 第一光纤连接器限定了多个接收第一聚焦透镜的第一盲孔和分别与第一盲孔连通的第一通孔。 第二光纤连接器限定多个接收第二聚焦透镜的第二盲孔和分别与第二盲孔连通的第二通孔。 电缆包括许多光纤。 每个光纤包括第一端和第二端，并且第一端被接收在相应的一个第一通孔中并且与相应的一个第一聚焦透镜对准，并且第二端被接收在相应的一个 的第二通孔并与第二聚焦透镜中的对应的一个对准。

公开(公告)号：US20130021767A1

公开(公告)日：2013-01-24

申请号：US13239287

申请日：2011-09-21

Applicant: KAI-WEN WU

Inventor： KAI-WEN WU

IPC: H05K7/00

CPC classification number: H05K1/181 ,  H01L23/16 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/16195 ,  H01L2924/16788 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/4611 ,  H05K2201/10545 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A double-sided PCB includes a circuit plate, a first chip, and a second chip. The circuit plate includes a spacer layer having a first surface and an opposing second surface, a first multilayer structure, and a second multilayer structure. The first multilayer structure includes a first wire layer, a first middle layer, and a second wire layer having a first grounding portion and first conductive pattern portions, that are stacked on each other on the first surface. The second multilayer structure on the second surface is either a mirror image of the first multilayer structure, or is very similar thereto. The first and second chips are each arranged on a grounding portion and are each electrically connected to their respective conductive pattern portions.

Abstract translation: 双面PCB包括电路板，第一芯片和第二芯片。 电路板包括具有第一表面和相对的第二表面的间隔层，第一多层结构和第二多层结构。 第一多层结构包括第一线层，第一中间层和具有第一接地部分和第一导电图案部分的第二导线层，第一接地部分和第一导电图案部分在第一表面上彼此堆叠。 第二表面上的第二多层结构是第一多层结构的镜像，或与其非常相似。 第一和第二芯片各自布置在接地部分上，并且各自电连接到它们各自的导电图案部分。

公开(公告)号：US20130306846A1

公开(公告)日：2013-11-21

申请号：US13527937

申请日：2012-06-20

Applicant: KAI-WEN WU

Inventor： KAI-WEN WU

IPC: G01J1/04

CPC classification number: G02B6/4292 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/425

Abstract: An optical fiber connector is positioned on a printed circuit board (PCB) and includes a main body, a number of slots, and a number of optical fibers. The main body includes a number of light transceivers. Each of the light transceivers includes a light transmitting module and a light receiving module adjacent to the light transmitting module. One end of each of the optical fibers is optically coupled to a respective one of the light emitting modules and the light receiving modules, and the other end of each of the optical fibers is mounted on a respective one of the slots.

Abstract translation: 光纤连接器位于印刷电路板（PCB）上，并且包括主体，多个槽和多个光纤。 主体包括多个光收发器。 每个光收发器包括光传输模块和与光发射模块相邻的光接收模块。 每个光纤的一端光耦合到相应的一个发光模块和光接收模块，并且每个光纤的另一端安装在相应的一个槽上。

公开(公告)号：US20130279859A1

公开(公告)日：2013-10-24

申请号：US13559566

申请日：2012-07-26

Applicant: KAI-WEN WU

Inventor： KAI-WEN WU

IPC: G02B6/36

CPC classification number: G02B6/4246 ,  G02B6/4203 ,  G02B6/4214 ,  G02B6/425 ,  G02B6/4257 ,  G02B6/43

Abstract: A circuit board assembly includes a circuit board, a first optical transceiver electrically connected to the circuit board, a first transparent shell optically coupled with the first optical transceiver, a second optical transceiver electrically connected to the circuit board, a second transparent shell optically coupled with the second optical transceiver, and a plurality of light wave guides optically coupled with the first transparent shell and the second transparent shell. The first optical transceiver sends first light signals. The first light signals are transmitted through the first transparent shell, the light wave guides, and the second transparent shell and are received by the second optical transceiver. The second optical transceiver sends second light signals. The second light signals are transmitted through the second transparent shell, the light wave guides, and the first transparent shell and are received by first optical transceiver.

Abstract translation: 电路板组件包括电路板，电连接到电路板的第一光收发器，与第一光收发器光耦合的第一透明外壳，与电路板电连接的第二光收发器，第二透明外壳，光耦合 第二光收发器和与第一透明壳和第二透明壳光学耦合的多个光波导。 第一个光收发器发送第一个光信号。 第一光信号通过第一透明壳体，光波导件和第二透明壳体传输并被第二光收发器接收。 第二个光收发器发送第二个光信号。 第二光信号通过第二透明壳体，光波导和第一透明壳体传输并被第一光收发器接收。

公开(公告)号：US20130259432A1

公开(公告)日：2013-10-03

申请号：US13555173

申请日：2012-07-22

Applicant: KAI-WEN WU

Inventor： KAI-WEN WU

IPC: G02B6/36

CPC classification number: G02B6/4246 ,  G02B6/4268 ,  G02B6/4274

Abstract: An optical connector package includes a substrate and a casing positioned on the substrate and comprising a positioning pin. The casing and the substrate cooperatively define a receiving space. The positioning pin defines a vent functioning as a sole channel communicating the receiving space with the outside of the casing. The vent is sealed after the optical connector package subjects to all required heating processes.

Abstract translation: 光学连接器封装包括基板和位于基板上并包括定位销的壳体。 壳体和衬底协同地限定接收空间。 定位销限定用作将容纳空间与壳体的外部连通的唯一通道的通气口。 在光学连接器封装之后，通风口被密封处理所有需要的加热过程。