公开(公告)号：US20140133737A1

公开(公告)日：2014-05-15

申请号：US13793709

申请日：2013-03-11

Applicant: KLA-TENCOR CORPORATION

Inventor： Martin Plihal ,  Vidyasagar Anantha ,  Saravanan Paramasivam ,  Chris W. Lee

IPC: G06T7/00

CPC classification number: G06T7/0008 ,  F04C2270/0421 ,  G06T5/50 ,  G06T7/0004 ,  G06T2207/30148

Abstract: Methods and systems for generating unbiased wafer defect samples are provided. One method includes selecting the defects detected by each of multiple scans performed on a wafer that have the most diversity in one or more defect attributes such that a diverse set of defects are selected across each scan. In addition, the method may include selecting the defects such that any defect that is selected and is common to two or more of the scans is not selected twice and any defects that are selected are diverse with respect to the common, selected defect. Furthermore, no sampling, binning, or classifying of the defects may be performed prior to selection of the defects such that the sampled defects are unbiased by any sampling, binning, or classifying method.

Abstract translation: 提供了用于产生无偏置晶片缺陷样品的方法和系统。 一种方法包括选择通过在一个或多个缺陷属性中具有最多分集的晶片上执行的多次扫描中检测到的缺陷，从而跨越每个扫描选择不同的缺陷集。 此外，该方法可以包括选择缺陷，使得两个或更多个扫描选择并且是共同的任何缺陷不被选择两次，并且所选择的任何缺陷相对于共同的所选择的缺陷是多种多样的。 此外，在选择缺陷之前，可以不进行采样，分类或缺陷分类，以便通过任何采样，合并或分类方法对采样缺陷进行不偏见。

公开(公告)号：US10267748B2

公开(公告)日：2019-04-23

申请号：US15782820

申请日：2017-10-12

Applicant: KLA-Tencor Corporation

Inventor： Martin Plihal ,  Erfan Soltanmohammadi ,  Saravanan Paramasivam ,  Sairam Ravu ,  Ankit Jain ,  Sarath Shekkizhar ,  Prasanti Uppaluri

IPC: G06N5/00 ,  G01N21/55 ,  G01N21/88 ,  G01N21/95 ,  G06N99/00 ,  G01N21/956

Abstract: Methods and systems for training an inspection-related algorithm are provided. One system includes one or more computer subsystems configured for performing an initial training of an inspection-related algorithm with a labeled set of defects thereby generating an initial version of the inspection-related algorithm and applying the initial version of the inspection-related algorithm to an unlabeled set of defects. The computer subsystem(s) are also configured for altering the labeled set of defects based on results of the applying. The computer subsystem(s) may then iteratively re-train the inspection-related algorithm and alter the labeled set of defects until one or more differences between results produced by a most recent version and a previous version of the algorithm meet one or more criteria. When the one or more differences meet the one or more criteria, the most recent version of the inspection-related algorithm is outputted as the trained algorithm.

公开(公告)号：US20180277337A1

公开(公告)日：2018-09-27

申请号：US15639311

申请日：2017-06-30

Applicant: KLA-Tencor Corporation

Inventor： Vidyasagar Anantha ,  Arpit Yati ,  Saravanan Paramasivam ,  Martin Plihal ,  Jincheng Lin

IPC: H01J37/244 ,  H01J37/28 ,  H01J37/20

Abstract: Use of care areas in scanning electron microscopes or other review tools can provide improved sensitivity and throughput. A care area is received at a controller of a scanning electron microscope from, for example, an inspector tool. The inspector tool may be a broad band plasma tool. The care area is applied to a field of view of a scanning electron microscope image to identify at least one area of interest. Defects are detected only within the area of interest using the scanning electron microscope. The care areas can be design-based or some other type of care area. Use of care areas in SEM tools can provide improved sensitivity and throughput.

公开(公告)号：US20160377552A1

公开(公告)日：2016-12-29

申请号：US15166819

申请日：2016-05-27

Applicant: KLA-Tencor Corporation

Inventor： Saravanan Paramasivam ,  Martin Plihal

IPC: G01N21/95 ,  H01L21/67 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/8851 ,  G01N2021/8858 ,  G05B19/00 ,  G05B23/0227 ,  G05B23/0275 ,  G05B2219/45031 ,  H01L21/67253 ,  H01L22/12 ,  H01L22/20

Abstract: A method for production line monitoring during semiconductor device fabrication includes acquiring a plurality of inspection results from a plurality of reference samples with an inspection sub-system. The method includes storing the acquired inspection results and geometric pattern codes for each of the reference samples in a database. The method includes acquiring an additional inspection result from an additional sample, where the additional inspection result includes an additional set of geometric pattern codes for identifying each defect identified within the additional inspection result from the additional sample. The method also includes correlating the set of geometric pattern codes of the additional sample with the geometric pattern codes from the reference set of samples to identify at least one of one or more new patterns or one or more patterns displaying a frequency of occurrence above a selected threshold.

Abstract translation: 一种在半导体器件制造期间的生产线监测的方法包括从具有检查子系统的多个参考样本获取多个检查结果。 该方法包括将获取的检查结果和每个参考样本的几何图案代码存储在数据库中。 该方法包括从另外的样本获取额外的检查结果，其中附加检查结果包括用于识别来自附加样本的附加检查结果中识别的每个缺陷的附加组的几何图案代码。 该方法还包括将附加样本的几何模式代码集合与来自参考样本集的几何模式代码进行关联，以识别一个或多个新模式中的至少一个或者显示出所选出的上述发生频率的一个或多个模式 阈。