Abstract:
An activable electronic component destruction device includes a heater and a heat-activated expandable material arranged on top of the heater. Heating of the heater causes the heat-activated expandable material to expand. The device further includes activation electronics coupled to the heater. The activation electronics are configured to control supply of power to the heater, which causes the heater to heat the heat-activated expandable material, which breaks a semiconductor substrate arranged on top of the heat-activated expandable material.
Abstract:
A system (600) that connects a user to a cleanroom facility, the system including a computing device (410) configured to receive a command from a user; and a platform (100) remotely located from the computing device (100). The platform (100) is configured to communicate with the computing device (410) and with a cleanroom (650), the platform (100) including a training module (110), an assessment module (112), and a manufacturing module (114). The platform (100) is configured to, in response to receiving the command from the computing device (410), activate one of the training module (110), the assessment module (112), and the manufacturing module (114) to take control over the cleanroom (650).
Abstract:
A physically compliant, 3-dimensional, heterogeneously integrated system (200) includes electronics (250, 252, 254) that have a metal-oxide-semiconductor structure; plural graphene-based sensors (270); interconnects (208) configured to electrically connect the electronics (250, 252, 254) to the plural graphene-based sensors (270); and a first polymer layer (204) that extends between the electronics (250, 252, 254) and the plural graphene-based sensors (270) so that the electronics (250, 252, 254) are prevented from directly contacting the plural graphene-based sensors (270). The electronics, the plural graphene-based sensors, the interconnects, and the first polymer layer are configured to have a thickness that allow the entire system to bend to have a bending radius less than 10 mm.
Abstract:
A flexible three-dimensional electronic device includes a polymer layer having a first side and a second side that is opposite of the first side. A first flexible substrate carrying a first electronic component is arranged on the first side of the polymer layer. A second flexible substrate carries a second electronic component. The second flexible substrate is a flexible silicon substrate arranged on the second side of the polymer layer. An electrically conductive via passes through the polymer layer to electrically connect the first and second electronic components.
Abstract:
A monolithic electronic device includes a plurality of rigid portions arranged in a polyhedron shape and a plurality of in-plane and out-of-plane deformable portions connecting the plurality of rigid portions to each other. Each of the plurality of rigid portions has an outer side and an opposing inner side. The inner of each of the plurality of rigid portions face an inside of the polyhedron shape. At least some of the plurality of rigid portions include semiconductor devices on both the outer and inner sides. The plurality of rigid portions and the plurality of in-plane and out-of-plane deformable portions are monolithic.
Abstract:
A flexible and stretchable imager includes a first rigid substrate carrying at least one first photodetector, a second rigid substrate carrying at least one second photodetector, and a flexible and stretchable arm connected to the first and second rigid substrates. The first rigid substrate, the second rigid substrate, and the flexible and stretchable arm are made of a same material.
Abstract:
A method for producing a thin-film-transistor involves forming a flexible substrate on a rigid substrate, forming a plurality of fins and trenches in a structural layer arranged on the flexible substrate, forming a wavy gate layer, channel layer, source contact layer, and drain contact layer on each of the plurality of fins and each of a plurality of trenches of the structural layer, and removing the plurality of fins and trenches having the wavy gate, channel, source contact, and drain contact layers from the rigid substrate.
Abstract:
A method of fabricating a thermal management device. The method includes depositing a seed layer, using a seed layer depositing technique, on a side of a support base; growing a heat sink base layer on a side of the seed layer; depositing a hard mask on a side of the support base directly opposite that containing the seed and heat sink base layers; patterning the hard mask with a photoresist mask; etching the patterned hard mask with an etching technique, wherein the etching creates trenches in the underlying support base, exposing the seed layer; removing the hard mask with a hard mask removal technique; depositing a layer of photoresist on the heat sink base layer; growing heat sinks using a heat sink growth technique on the exposed seed layer; removing the photoresist layer with a photoresist layer removal technique; and removing the support base with a support base removal technique.
Abstract:
Various examples are related to parking management, including identifying and reserving empty parking spaces. In one example, a smart parking space system includes a parking controller located at a parking space. The parking controller can identify a vehicle located at the parking space via an input sensor or a transceiver that initiates wireless communication with an electronic tag associated with the vehicle; and communicate a parking vacancy associated with the parking space to a remote computing device based at least in part on the identification of the vehicle. In another example, a computing device can receive parking vacancy data associated with a parking space from a parking controller; determine a parking vacancy associated with the parking space using the parking vacancy data; and encode for display on a client device a network page that includes an indication of the parking vacancy associated with the parking space.
Abstract:
A three-dimensional (3D) solar cell (100) includes an active, rigid, and flat material (404) configured to transform solar energy into electrical energy, wherein the active, rigid, and flat material (404) is shaped as first and second petals (412), each petal (412) having plural sides (415), plural electrodes (406) formed on a backside of the active, rigid, and flat material (404), a flexible transparent substrate (402) coating the backside of the active, rigid, and flat material (404) and the plural electrodes (406), plural trenches (407) formed in the active, rigid, and flat material (404), to partially expose the plural electrodes (406) and the substrate (402), and a transparent polymer (444) configured to attach a side (415) from the first petal (412) to a side (415) from the second petal (412).