公开(公告)号：US20170004991A1

公开(公告)日：2017-01-05

申请号：US15113561

申请日：2015-01-21

Applicant: LINTEC CORPORATION

Inventor： Daisuke Yamamoto ,  Hiroyuki Yoneyama

IPC: H01L21/683 ,  H01L21/56 ,  H01L21/78 ,  H01L21/268 ,  C09J7/02 ,  C09J133/10

CPC classification number: H01L21/6836 ,  C08K2201/002 ,  C09J7/00 ,  C09J7/10 ,  C09J7/20 ,  C09J7/255 ,  C09J7/35 ,  C09J11/06 ,  C09J133/10 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/114 ,  C09J2400/22 ,  C09J2467/006 ,  H01L21/268 ,  H01L21/561 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/68336

Abstract: Provided is protective film-forming sheet (2) including: a protective film-forming film (1) having a light transmittance at a wavelength of 1064 nm of 55% or greater and a light transmittance at a wavelength of 550 nm of 20% or less; and a release sheet (21) which is laminated on one or both faces of the protective film-forming film (1). According to this protective film-forming sheet (2), it is possible to form a protective film which allows a workpiece such as a semiconductor wafer to have a modified layer disposed in advance therein by a laser so that the workpiece can be split through the application of force thereon, while preventing grinding marks on the workpiece or a product formed therefrom from being visible to the naked eye.

Abstract translation: 提供了保护膜形成片（2），其包括：具有波长为1064nm的透光率为55％以上且波长550nm的透光率为20％的保护膜形成膜（1），或 减; 和层叠在保护膜形成膜（1）的一面或两面上的剥离片（21）。 根据该保护膜形成片（2），可以形成保护膜，其允许诸如半导体晶片的工件在其中预先设置有通过激光设置的改性层，使得工件可以通过 同时施加力，同时防止工件上的磨痕或由其形成的产品对肉眼可见。