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    STANNIC OXIDE PHOTOCONDUCTIVE DEVICE FOR DETECTING ULTRAVIOLET LIGHT AND METHOD FOR MAKING THE
    11.
    发明专利
    STANNIC OXIDE PHOTOCONDUCTIVE DEVICE FOR DETECTING ULTRAVIOLET LIGHT AND METHOD FOR MAKING THE 未知

    公开(公告)号：CA995801A

    公开(公告)日：1976-08-24

    申请号：CA166842

    申请日：1973-03-23

    Applicant: MATSUSHITA ELECTRIC IND CO LTD

    Inventor： NAGASAWA MASAHIRO ,  WATANABE HIROYUKI

    IPC: H01L31/08

    Abstract: This invention provides a stannic oxide photoconductive device for detecting ultraviolet light very efficiently and to a method for making the same. The device has a stannic oxide body with at least two regions, one of which is a conductive region consisting essentially of stannic oxide, and the other of which is a photoconductive laminal region consisting essentially of stannic oxide and an acceptor impurity. Two electrodes are applied to the stannic oxide body, at least one of which is attached to the photoconductive laminal region.

    12.
    发明专利
    未知

    公开(公告)号：DE2315457A1

    公开(公告)日：1973-10-11

    申请号：DE2315457

    申请日：1973-03-26

    Applicant: MATSUSHITA ELECTRIC IND CO LTD

    Inventor： NAGASAWA MASAHIRO ,  WATANABE HIROYUKI

    IPC: H01L31/08 ,  H01C7/08

    Abstract: This invention provides a stannic oxide photoconductive device for detecting ultraviolet light very efficiently and to a method for making the same. The device has a stannic oxide body with at least two regions, one of which is a conductive region consisting essentially of stannic oxide, and the other of which is a photoconductive laminal region consisting essentially of stannic oxide and an acceptor impurity. Two electrodes are applied to the stannic oxide body, at least one of which is attached to the photoconductive laminal region.

    14.
    发明专利
    未知

    公开(公告)号：DE69321660D1

    公开(公告)日：1998-11-26

    申请号：DE69321660

    申请日：1993-06-07

    Applicant: MATSUSHITA ELECTRIC IND CO LTD

    Inventor： HASEGAWA YO ,  NAGASAWA MASAHIRO ,  TSUKAMOTO MASAHIDE

    IPC: B23K20/16 ,  B23K35/00 ,  B23K35/02 ,  H05K1/09 ,  H05K3/40 ,  H05K3/46

    Abstract: The present invention relates to a diffusion joining method of Cu or Cu alloy surface and a conductive paste used therefor, especially applied to a method for preparing a multilayer printed wiring board. The present invention is characterized by providing the contacting surfaces with a layer selected from the group comprising a noble metal thin layer, a metal oxide remover layer and a conductive paste layer mainly consisting of a Cu or Cu alloy particles and the metal oxide remover; and pressing the contacting metal surfaces at a temperature higher than 170 DEG C more or less whereat the Cu atom at interface of the Cu or Cu alloy surfaces to be joined becomes to be able to diffuse, to give a joined metal body.

    16.
    发明专利
    未知

    公开(公告)号：DE2824371A1

    公开(公告)日：1979-01-18

    申请号：DE2824371

    申请日：1978-06-01

    Applicant: MATSUSHITA ELECTRIC IND CO LTD

    Inventor： TSUKAMOTO MASAHIDE ,  NAGASAWA MASAHIRO ,  YAMAZOE HIROSHI

    IPC: H03H3/08 ,  H03H9/00 ,  H03H9/145 ,  H03H9/64

    Abstract: To obtain low insertion loss and low TTE level, a first central transducer, a second transducer and a third transducer are disposed on one surface of a piezoelectric substrate in such a manner that the second and the third transducers are in the direction of propagation (X-direction) of surface acoustic waves launched by the first transducer and the distance between center lines of the first and the second transducers and also the distance between the center lines of the first and the third transducers vary along the Y-direction perpendicular to the X-direction.

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