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公开(公告)号:US20220030709A1
公开(公告)日:2022-01-27
申请号:US17337682
申请日:2021-06-03
Applicant: NAN YA PLASTICS CORPORATION
Inventor: TE-CHAO LIAO , HAO-SHENG CHEN , HUNG-YI CHANG , CHIA-LIN LIU , CHIH-KAI CHANG
Abstract: A resin composition for a high frequency substrate and a metal clad laminate are provided. Based on a total weight of the resin composition for the high frequency substrate being 100 phr, the resin composition for the high frequency substrate includes: 20 phr to 70 phr of a polyphenylene ether resin, 5 phr to 40 phr of a polybutadiene resin, 5 phr to 30 phr of a bismaleimide resin, and 20 phr to 45 phr of a crosslinker. A glass transition temperature of the resin composition for the high frequency substrate is higher than or equal to 230° C. The metal clad laminate includes a substrate and a metal layer disposed on the substrate. The substrate is formed from the resin composition for the high frequency substrate.
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公开(公告)号:US20220024182A1
公开(公告)日:2022-01-27
申请号:US17316677
申请日:2021-05-10
Applicant: NAN YA PLASTICS CORPORATION
Inventor: TE-CHAO LIAO , HAO-SHENG CHEN , HUNG-YI CHANG , CHIH-KAI CHANG , CHIA-LIN LIU
Abstract: A prepreg and a metallic clad laminate are provided. The prepreg includes a reinforcing material and a thermosetting resin layer. The thermosetting resin layer is formed by immersing the reinforcing material in a thermosetting resin composition. The thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers. Based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr. The fillers include a granular dielectric filler and a flaky thermal conductive filler. The metallic clad laminate is formed by disposing at least one metal layer onto the prepreg.
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