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公开(公告)号：US20190215921A1
公开(公告)日：2019-07-11
申请号：US16328794
申请日：2017-08-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Wojcik , Hubert Halbritter , Josip Maric
Abstract: A driver circuit for at least one light-emitting optoelectronic component includes a control circuit having a capacitor and a control switch, wherein the control switch electrically connects to the component such that the component is supplied with current by the capacitor as a function of a switching state of the control switch, and a charging circuit having at least a first charging switch, a bias resistor and a buffer capacitor, wherein the charging circuit electrically connects to the capacitor and is configured to charge the capacitor through the bias resistor, and the buffer capacitor is linked to a connecting line between the bias resistor and the capacitor.
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12.发明申请公开(公告)号：US20190036299A1
公开(公告)日：2019-01-31
申请号：US16074925
申请日：2017-02-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Wojcik , Tobias Gebuhr , Markus Pindl
Abstract: A method of producing an optoelectronic lighting device includes providing a laser chip carrier on which two edge emitting laser chips, arranging a carrier including two optical elements onto the laser chip carrier, forming a respective optical connection by an optical material between a respective laser facet and a respective optical element, singulating the two laser chips by dividing the laser chip carrier between the two laser chips to form two mutually divided laser chip carrier parts, wherein the dividing includes dividing the carrier between the two optical elements to form two mutually divided carrier parts each including one of the two optical elements, such that two singulated laser chips arranged on the respective divided laser chip carrier part are formed, the respective laser facets of which are optically connected to the respective optical element of the respective carrier part by the optical material.
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公开(公告)号：US20180261731A1
公开(公告)日：2018-09-13
申请号：US15760027
申请日：2016-09-15
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Wojcik , Martin Haushalter
Abstract: An optoelectronic component includes an optoelectronic semiconductor chip that emits electromagnetic radiation, arranged in a housing, wherein the housing has an outer wall face and an exit face transparent to the electromagnetic radiation, the exit face is set back relative to the outer wall face in a direction of an interior of the housing, the optoelectronic semiconductor chip is arranged such that radiation emitted by the optoelectronic semiconductor chip in an emission direction can emerge from the optoelectronic component through the exit face, and the outer wall face has separating marks and the exit face is free of separating marks.
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Patent Agency Ranking
公开(公告)号：US09379517B2
公开(公告)日：2016-06-28
申请号：US14352677
申请日：2012-09-27
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Wojcik , Josip Maric , Martin Haushalter , Frank Möllmer
CPC classification number: H01S5/02236 , H01L2924/0002 , H01S5/02228 , H01S5/02244 , H01S5/02296 , H01S5/0428 , H01L2924/00
Abstract: A radiation-emitting component is specified, having a metallic carrier body (1), which comprises at least two connection locations (1a, 1b) for making electrical contact with the component, a laser diode chip (2), which is fixed to the metallic carrier body (1) and is electrically conductively connected to the at least two connection locations (1a, 1b), a housing (3), which surrounds the metallic carrier body (1) in places, wherein the housing (3) is formed with a plastic, the connection locations (1a, 1b) extend in each case at least in places along a bottom face (3a) and a side face (3b) of the housing (3), said side face running transversely with respect to the bottom face, and the component is surface-mountable by means of the connection locations (1a, 1b) in such a way that the bottom face (3a) or the side face (3b) forms a mounting face of the component.
Abstract translation: 具有金属载体主体（1）的辐射发射部件包括至少两个用于与部件电接触的连接位置（1a，1b），激光二极管芯片（2），固定到 金属载体主体（1），并且与至少两个连接位置（1a，1b）导电连接，壳体（3）在其中围绕金属载体主体（1）的位置形成，其中壳体（3）形成 连接位置（1a，1b）至少在沿壳体（3）的底面（3a）和侧面（3b）的位置上延伸，所述侧面相对于所述壳体 并且该部件可以通过连接位置（1a，1b）以表面（3a）或侧面（3b）形成该部件的安装面的方式表面安装。
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公开(公告)号：US20200036156A1
公开(公告)日：2020-01-30
申请号：US16491184
申请日：2018-03-20
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Wojcik , Hubert Halbritter , Josip Maric
Abstract: A semiconductor radiation source includes at least one semiconductor chip that generates radiation; a controller with one or more switching elements configured for pulsed operation of the semiconductor chip; and at least one capacitor body, wherein the semiconductor chip directly electrically connects in a planar manner to the capacitor body, the controller electrically connects to a side of the semiconductor chip opposite the capacitor body, and the controller, the capacitor body and the semiconductor chip are stacked on top of each other so that the capacitor body is located between the control unit and the semiconductor chip.
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公开(公告)号：US20190252852A1
公开(公告)日：2019-08-15
申请号：US16338559
申请日：2017-10-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Hubert Halbritter , Andreas Wojcik
CPC classification number: H01S5/02292 , G02B6/4214 , H01S5/0071 , H01S5/02228 , H01S5/02244 , H01S5/02252 , H01S5/02288 , H01S5/02296
Abstract: A laser component including a molded body, and a laser chip embedded into the molded body and configured to emit a laser beam in an emission direction, wherein a surface of the molded body includes a deflection section arranged and inclined relative to the emission direction such that a laser beam emitted by the laser chip impinges on the deflection section and is subjected to total internal reflection at the deflection section.
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公开(公告)号：US20180254605A1
公开(公告)日：2018-09-06
申请号：US15754333
申请日：2016-08-23
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Wojcik , Martin Haushalter
Abstract: A laser component includes a housing that includes a base section including a top side and an underside, wherein a plurality of electrical soldering contact pads are configured at the underside of the base section, the electrical soldering contact pads enabling surface mounting of the laser component, a plurality of electrical chip contact pads are configured at the top side of the base section and electrically conductively connect to the soldering contact pads, the housing includes a cavity adjoining the top side of the base section, and a laser chip is arranged in the cavity and electrically conductively connects to at least some of the chip contact pads.
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公开(公告)号：US09318678B2
公开(公告)日：2016-04-19
申请号：US14653835
申请日：2013-12-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Wojcik , Martin Haushalter , Frank Möllmer , Wilhelm Karsten , Heinz Haas
CPC classification number: H01L33/62 , H01L23/49548 , H01L33/38 , H01L33/486 , H01L33/54 , H01L33/58 , H01L33/60 , H01L51/5203 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00 , H01L2924/00014
Abstract: An optoelectronic semiconductor component includes a lead frame with two lead frame parts and an optoelectronic semiconductor chip. The semiconductor chip is fitted to a first of the lead frame parts. A radiation-transmissive potting body of the semiconductor component mechanically connects the lead frame parts to one another. The potting body is set up for beam shaping. The first lead frame part has a reflector trough with a base surface on which the semiconductor chip is mounted. The reflector trough has a lateral surface with three sections. When seen in a plan view of the base surface, the sections revolve around the base surface and follow one another in a direction away from the base surface. In the first section, closest to the base surface, the lateral surface is oriented perpendicular to the base surface.
Abstract translation: 光电子半导体元件包括具有两个引线框架部件的引线框架和光电子半导体芯片。 半导体芯片安装在第一引线框架部件上。 半导体部件的透光性灌封体将引线框架部件彼此机械连接。 灌封体设置用于波束整形。 第一引线框架部分具有反射槽，底座表面安装有半导体芯片。 反射槽具有三个横截面。 当在基面的平面图中看到时，这些部分围绕基部表面旋转并且在远离基部表面的方向上彼此相依。 在最接近基面的第一部分中，侧面垂直于基面定向。
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