公开(公告)号：JP2009253136A

公开(公告)日：2009-10-29

申请号：JP2008101202

申请日：2008-04-09

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： SUGAYA YASUHIRO ,  TAKEOKA HIROKI ,  ISHITOMI HIROYUKI ,  FUJII TATSUO

IPC: H01L23/12 ,  H05K3/46

CPC classification number: H01L2224/48091 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To provide a fine power supply division pattern with a degree of freedom in designing which can implement division of a power supply layer into a plurality of power supply layers by patterning. SOLUTION: A substrate 20 with a built-in capacitor which accommodates multiple power supply systems has a section for separating a positive electrode and a negative electrode, which consists of a first insulation layer 23, in part of a valve action metal 21 including a porous portion, at least on the surface of which an organic polymer dielectric layer 22 is formed. The substrate has a solid-state electrolytic layer 25 formed of a conductive polymer on the dielectric layer defined by the shape of the section for separating a positive electrode and a negative electrode, and also has a collector layer 26 on the solid-state electrolytic layer. In the substrate, a metal interconnection pattern to be connected to the collector layer is formed. The metal interconnection pattern is electrically divided into a plurality of power supply layers by patterning. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供具有设计自由度的精细电源分配模式，其可以通过图案化来实现电源层分成多个电源层。 解决方案：具有容纳多个电源系统的内置电容器的基板20具有用于分离正电极和负电极的部分，该部分由第一绝缘层23，部分阀动作金属21 至少在其表面上形成有机聚合物电介质层22的多孔部分。 该基板具有由导电聚合物形成的固体电解质层25，该介电层由用于分离正极和负极的部分的形状限定，并且在固态电解质层上还具有集电极层26 。 在基板中形成与集电体层连接的金属配线图形。 通过图案化将金属互连图案电分割为多个电源层。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009004417A

公开(公告)日：2009-01-08

申请号：JP2007161074

申请日：2007-06-19

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： ISHITOMI HIROYUKI ,  ASAHI TOSHIYUKI ,  SUGAYA YASUHIRO ,  HIMORI GOJI ,  HASHIMOTO AKIRA

IPC: H01G9/04 ,  H01G9/012 ,  H01G9/048

CPC classification number: H01G4/40

Abstract: PROBLEM TO BE SOLVED: To enhance the functions of equipment using a high-speed IC or LSI, and to downsize the equipment by increasing larger capacity of a solid electrolytic capacitor and the flexibility of the wirings.
SOLUTION: Disclosed is the solid electrolytic capacitor which has through wirings formed at at least one or more third insulating layer portions in floating-island shapes by providing at least one or more third insulating layers in floating-island shapes formed at portions of a dielectric film, a solid electrolytic layer formed on the dielectric film at outside parts of the third insulating layers, and a current collector layer as a cathode formed on the top surface of the solid electrolytic layer, forming a second through hole penetrating the third insulating layers, the dielectric film below them, and valve metal foil 1 as an anode in some third insulating layer portion where the first insulating layer is not formed, forming a third through hole penetrating the first insulating layer in a first through hole where the first insulating layer is formed, and providing a through hole electrode in the second and third through holes.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：为了增强使用高速IC或LSI的设备的功能，并且通过增加固体电解电容器的更大容量和布线的灵活性来减小设备的尺寸。 解决方案：公开了一种固体电解电容器，其通过布置在浮岛形状的至少一个或多个第三绝缘层部分处，通过提供至少一个或多个第三绝缘层，所述第三绝缘层形成在浮岛形状的部分 电介质膜，在第三绝缘层的外部的电介质膜上形成的固体电解质层，形成在固体电解质层的顶面上的作为阴极的集电体层，形成贯穿第三绝缘体的第二贯通孔 层，其下方的电介质膜以及在没有形成第一绝缘层的部分第三绝缘层部分中的阀金属箔1作为阳极，在第一通孔中形成贯穿第一绝缘层的第三通孔，第一绝缘层 形成第二通孔和第三通孔中的通孔电极。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2015053350A

公开(公告)日：2015-03-19

申请号：JP2013184633

申请日：2013-09-06

Applicant: パナソニック株式会社 ,  Panasonic Corp

Inventor： SUGAYA YASUHIRO ,  ISHITOMI HIROYUKI ,  SANO KENJI

IPC: H01L23/12 ,  H05K1/16 ,  H05K3/46

CPC classification number: H01L2224/16225 ,  H01L2924/15311

Abstract: 【課題】従来のシートキャパシタ内蔵基板においては、シートキャパシタそのもの、あるいはシートキャパシタを構成する電極や誘電体の一部を貫通するスキップビアを形成した場合、絶縁信頼性等において課題が発生する場合があった。【解決手段】少なくとも上面銅電極250と、誘電体層150と、下面銅電極240と、を有するシートキャパシタ部330を内蔵してなるキャパシタ内蔵基板110において、前記シートキャパシタ部330の一部に、スキップビア140、160、170を形成すると共に、前記スキップビア140、160、170と、前記上面銅電極250や前記誘電体層150との間に、リング状絶縁部350を設けることで、キャパシタ内蔵基板110の絶縁信頼性を高める。【選択図】図1

Abstract translation: 要解决的问题：为了解决当片状电容器本身或构成片状电容器的电极或穿过电介质材料的一部分的跳过通孔时，在具有内置片状电容器的传统板中发生的绝缘可靠性等问题 形成。在具有至少包括上铜电极250，电介质层150和下铜电极240的内置片状电容器单元330的电路板中，在通孔140,160,170的一部分 的片状电容器单元330，并且在跳过通孔140,160,170与上部铜电极250或电介质层150之间设置环状绝缘部350，从而提高具有内置电路板的电路板110的绝缘可靠性 - 电容器。

公开(公告)号：JP2011233915A

公开(公告)日：2011-11-17

申请号：JP2011149808

申请日：2011-07-06

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： SASAKI TOMOE ,  SUGAYA YASUHIRO ,  ASAHI TOSHIYUKI

IPC: H05K3/46 ,  H01L23/12 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a composite wiring board which is capable of easily forming a multilayer on an arbitrary position of a substrate, flexibly corresponding to a design change or the like, and having a cavity structure capable of three-dimensionally arranging a circuit component.SOLUTION: The composite wiring board includes: a first wiring board having a first electrical insulation base material and a wiring pattern formed on the first electrical insulation base material; a second wiring board having a second electrical insulation base material and a wiring pattern formed on the second electrical insulation wiring board and forming a cavity on at least a part of the wiring pattern; and a third electrical insulation base material including a conductive part composed of a conductive composition, obtained by mixing metal particles for adhering the first wiring board to the second wiring board in a thickness direction and electrically connecting between the wiring pattern of the first wiring board and the wiring pattern of the second wiring board, and thermosetting resin, and forming a cavity on at least a part of the conductive part.

Abstract translation: 要解决的问题：提供一种能够容易地在基板的任意位置形成多层的复合布线板，其灵活地对应于设计变化等，并且具有能够三维地形成的空腔结构 布置电路组件。 复合布线板包括：具有第一电绝缘基材和形成在第一电绝缘基材上的布线图案的第一布线板; 第二布线板，具有形成在所述第二电绝缘布线板上的第二电绝缘基材和布线图案，并且在所述布线图案的至少一部分上形成空腔; 以及第三电绝缘基体材料，其包括由导电组合物构成的导电部分，所述导电组合物通过将用于将所述第一布线板粘合到所述第二布线板的金属颗粒在厚度方向上并且将所述第一布线板的布线图案和 第二布线板和热固性树脂的布线图案，并且在导电部分的至少一部分上形成空腔。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2011060875A

公开(公告)日：2011-03-24

申请号：JP2009206631

申请日：2009-09-08

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： SUGAYA YASUHIRO ,  HASHIMOTO AKIRA ,  SASAKI TOMOE

IPC: H05K3/46 ,  H01L23/12 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide an electronic component built-in substrate which is kept symmetrical even in a state wherein a passive component is built in, and is free of warpage, and can achieve stable connection reliability by connecting a passive component with a material accompanied by alloy formation. SOLUTION: The electronic component built-in substrate has the passive component built in a resin substrate having a plurality of layers of wiring, wherein the passive component is arranged in an insulating layer at a center part of the plurality of layers of the electronic component built-in substrate, and connected to the wiring layer using the material making electric and mechanical connections by forming an alloy of two or more kinds of metal materials. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种电子部件内置基板，其即使在内置无源部件并且没有翘曲的状态下也保持对称，并且可以通过连接被动部件来实现稳定的连接可靠性 伴随着合金形成的材料。 解决方案：电子部件内置基板具有内置在具有多层布线的树脂基板中的无源部件，其中无源部件布置在多层布线的中心部分的绝缘层中 电子部件内置基板，并且通过形成两种或更多种金属材料的合金，通过使用电气和机械连接的材料连接到布线层。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2009065077A

公开(公告)日：2009-03-26

申请号：JP2007233755

申请日：2007-09-10

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： HIROSE TAKAYUKI ,  SUGAYA YASUHIRO ,  KASHIWAGI TAKAFUMI ,  TAKANO ATSUSHI ,  FURUKAWA MITSUHIRO

IPC: H01L23/02 ,  H01L23/04 ,  H03H9/25 ,  H03H9/64

Abstract: PROBLEM TO BE SOLVED: To provide a miniaturized and thin electronic component package structure in which a function element is sealed in a hollow state and which can be produced also by a transfer molding method of resin sealing.
SOLUTION: An electronic component package is composed of a substrate where an element having a function area and electrodes is formed on its surface, resin layers arranged over the function areas of the substrate via space, a metallic layer covering the space, and insulating resin layers formed on positions of the metallic layer which respectively correspond to the resin layers, and its structure has a feature that the elastic modulus of the resin layer is larger than that of the insulating resin layer.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种小型化和薄型的电子部件封装结构，其中功能元件被密封在中空状态，并且也可以通过树脂密封的传递模塑方法来制造。 解决方案：电子部件封装由其表面上形成有功能区域和电极的元件的基板，布置在基板空间的功能区域上的树脂层，覆盖该空间的金属层，以及 形成在分别对应于树脂层的金属层的位置上的绝缘树脂层，其结构具有树脂层的弹性模量大于绝缘树脂层的弹性模量的特征。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2011018787A

公开(公告)日：2011-01-27

申请号：JP2009162632

申请日：2009-07-09

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： HASHIMOTO AKIRA ,  SUGAYA YASUHIRO ,  SASAKI TOMOE

IPC: H05K3/34

CPC classification number: Y02P70/613

Abstract: PROBLEM TO BE SOLVED: To provide an Sn-based Pb-free solder material which is usable for primary mounting of a printed circuit board (especially, a component incorporated substrate) to be mounted in a multi-stage manner, and attains compatibility between self-alignment and solder remelting suppression effect during reheating in the secondary mounting.SOLUTION: When a primary mounting chip component 108 and a primary mounting semiconductor component 111 are primarily mounted on the printed circuit board 101 through a primary mounting joint part 110, the primary mounting joint part 110 is composed of a solder part 126 made of Sn-based solder, Cu powder 120 and a Cu-Sn alloy layer 125, and further the primary mounting joint part 110 is provided with a Cu low-concentration layer 128 of less than 5 wt.% in Cu content concentration to provide the component mounting substrate 115 which attains compatibility between the self-alignment and the solder remelting suppression effect during the secondary mounting of the component mounting substrate 115 on a motherboard substrate 116 etc.

Abstract translation: 要解决的问题：提供一种可用于主要安装印刷电路板（特别是组件基板）的Sn基无铅焊料，以多级方式安装，并达到自身的兼容性 在二次安装中再加热期间的对准和焊料重熔抑制效果。解决方案：当主安装芯片部件108和主安装半导体部件111通过主安装接合部110主要安装在印刷电路板101上时，主安装 接合部110由由锡基焊料，Cu粉末120和Cu-Sn合金层125构成的焊料部126构成，另外，主安装接合部110设置有小于等于的Cu低浓度层128 5重量％的Cu含量浓度，以提供组件安装基板115，其在断开期间达到自对准和焊料重熔抑制效果之间的相容性 元件安装基板115在主板基板116等上的安装

公开(公告)号：JP2009252764A

公开(公告)日：2009-10-29

申请号：JP2008094666

申请日：2008-04-01

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： FUJII TATSUO ,  ISHITOMI HIROYUKI ,  SUGAYA YASUHIRO ,  HASHIGUCHI KATSUNORI

IPC: H01G9/004 ,  H01G2/06 ,  H01G4/38 ,  H01G4/40 ,  H01G9/04 ,  H01G9/26 ,  H05K1/16 ,  H05K1/18 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board having a built-in electronic component, capable of improving an effect of removing a high-frequency noise flowing between anode connection terminal portions while corresponding to high capacity of a capacitor, and thinning the board. SOLUTION: In the wiring board having a built-in electronic component, connection terminal portions each include: an anode connection terminal portion electrically connected to a valve metal sheet body of a solid-state electrolytic capacitor at not less than two points via a wiring pattern and an inductor and/or a via electrode and/or a through electrode; and a cathode connection terminal portion electrically connected to a current collecting layer of the solid-state electrolytic capacitor via the wiring pattern and/or the inductor and/or the via electrode and/or the through electrode, wherein the inductor is formed in a conductor pattern shape. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种具有内置电子部件的布线板，能够提高除去在阳极连接端子部分之间流动的高频噪声的效果，同时对应于电容器的高容量，并且减薄 董事会。 解决方案：在具有内置电子部件的布线基板中，连接端子部分包括：阳极连接端子部分，其电连接到不小于两点的固态电解电容器的阀金属片体通孔 布线图案和电感器和/或通孔电极和/或通孔电极; 以及通过布线图案和/或电感器和/或通孔电极和/或贯通电极与固态电解电容器的集电层电连接的阴极连接端子部分，其中电感器形成在导体 图案形状。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009252763A

公开(公告)日：2009-10-29

申请号：JP2008094665

申请日：2008-04-01

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： FUJII TATSUO ,  ISHITOMI HIROYUKI ,  SUGAYA YASUHIRO ,  HASHIGUCHI KATSUNORI

IPC: H05K3/46 ,  H01G2/06 ,  H01G4/40 ,  H01G9/012

Abstract: PROBLEM TO BE SOLVED: To improve the effect of removing high-frequency noise flowing between anode connection terminals while meeting the need of larger capacity of a capacitor, and to make a board thin. SOLUTION: A connection terminal portion comprises: anode connection terminal portions electrically connected to a valve metal sheet body of a solid-state electrolytic capacitor at least at two or more places through a wiring pattern and inductors and/or a via electrode and/or a through electrode; a cathode connection terminal portion electrically connected to a current collector layer of the solid-state electrolytic capacitor through the wiring pattern and/or inductors and/or via electrode and/or through electrode, the inductor being formed in a conductor pattern shape. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了提高除去在阳极连接端子之间流动的高频噪声的效果，同时满足电容器容量的较大需要，并且使电路板变薄。 解决方案：连接端子部分包括：至少在两个或更多个位置通过布线图案和电感器和/或通孔电极电连接到固态电解电容器的阀金属片体的阳极连接端子部分，以及 /或通孔电极; 通过布线图案和/或电感器和/或通孔电极和/或通过电极电连接到固态电解电容器的集电器层的阴极连接端子部分，电感器形成为导体图案形状。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2015018988A

公开(公告)日：2015-01-29

申请号：JP2013146126

申请日：2013-07-12

Applicant: パナソニック株式会社 ,  Panasonic Corp

Inventor： SUGAYA YASUHIRO ,  ISHITOMI HIROYUKI ,  SANO KENJI

IPC: H05K3/46

Abstract: 【課題】従来のシートキャパシタ内蔵基板においては、シートキャパシタそのもの、あるいはシートキャパシタを構成する電極や誘電体の一部を貫通するスキップビアを形成した場合、絶縁信頼性等において課題が発生する場合があった。【解決手段】シートキャパシタ部310の下面銅電極220の下に絶縁層を介して形成された第1銅電極390と、上面銅電極230の上に絶縁層を介して形成された第2銅電極400との間を電気的に接続する、少なくとも誘電体層140と上面銅電極と下面銅電極に形成された貫通孔の中に形成されたスキップビア150と、を有するキャパシタ内蔵基板110であって、貫通孔において、スキップビアと誘電体層との間と、スキップビアと下面銅電極と、スキップビアと下面銅電極の間は、共に絶縁樹脂が充填されてなる、上面観察でリング状を有するリング状樹脂充填部380によって電気的に絶縁されているキャパシタ内蔵基板とする。【選択図】図1

Abstract translation: 要解决的问题为了解决传统的片式电容器内置衬底具有绝缘可靠性等问题的问题，当片状电容器本身或穿过构成片状电容器的电极或电介质体的一部分的跳过通孔 电容器内置基板110包括：薄片电容器部分310; 电连接在片状电容器部310的下表面铜电极220之间的绝缘层形成的第一铜电极390和在上表面铜电极230上形成的通过绝缘层形成的第二铜电极400之间的跳过通孔150， 跳过通孔150形成在形成在至少介电层140，上表面铜电极和下表面铜电极中的通孔中。 在通孔中，填充在跳过通孔和电介质层之间，跳过通孔和上表面铜电极之间以及跳过通孔和下表面铜电极之间的绝缘树脂每个形成环状树脂填充部分380 当从上方观察时具有环形形状，以在它们之间电绝缘。