公开(公告)号：EP2570011B1

公开(公告)日：2018-01-17

申请号：EP11721620.0

申请日：2011-05-12

Applicant: Panduit Corp.

Inventor： CAVENEY, Jack, E. ,  SHURHAY, Mark ,  REIGLE, Darren, J. ,  BERNARD, William, A. ,  HIBNER, Max, W.

IPC: H05K7/20

CPC classification number: H05K7/20745

Abstract: The aisle containment system is mounted to two rows of equal width cabinets or cabinets varying in width between 600 mm, 700 mm and 800 mm. The aisle containment system includes door assemblies on both ends of the cabinet rows, vertical panels that mount to the cabinets and door frames to support the ceiling, cross tees that span the aisle, and ceiling panels. Additional cabinets of equal or varying width may be added to an aisle containment installation.

公开(公告)号：EP2449866A2

公开(公告)日：2012-05-09

申请号：EP10729743.4

申请日：2010-06-22

Applicant: Panduit Corp.

Inventor： NICEWICZ, Andrzej ,  ADDUCCI, Samuel, J. ,  EATON, Alva, B. ,  MARRS, Samuel, M. ,  HIBNER, Max, W.

IPC: H05K7/20

CPC classification number: H05K7/20745

Abstract: Certain embodiments of the present invention provide a vertical exhaust duct for an electronic equipment enclosure. The vertical exhaust duct includes a first duct section, a second duct section slidably connected to the first duct section and extendable to a first height above the first duct section, and a third duct section slidably connected to the second duct section and extendable to a second height above the second duct section.

公开(公告)号：EP4214560A1

公开(公告)日：2023-07-26

申请号：EP21794053.5

申请日：2021-09-17

Applicant: Panduit Corp.

Inventor： SEDOR, Thomas, M. ,  HIBNER, Max, W. ,  WALTERS, Michael, R. ,  BROUWER, Alex, C. ,  MAYO, Michael ,  SLEDZINSKI, Bon, B ,  BERRIDGE, Benjamin, J.

IPC: G02B6/44

公开(公告)号：EP2850925A2

公开(公告)日：2015-03-25

申请号：EP13727425.4

申请日：2013-05-13

Applicant: Panduit Corp.

Inventor： FLEMING, James, N. ,  GOLDSBERRY, Timothy ,  SHURHAY, Mark ,  HIBNER, Max, W.

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  B23P19/00 ,  H05K7/20736 ,  Y10T29/49826

Abstract: A thermal ducting system for electronic equipment in an electronic equipment enclosure is provided. The thermal ducting system includes a top duct, a bottom duct spaced apart from the top duct, a side duct extending from the top duct to the bottom duct and along an intake side of the electronic equipment, and at least one baffle positioned in the side duct.