公开(公告)号：DE102004033728B4

公开(公告)日：2009-07-23

申请号：DE102004033728

申请日：2004-07-13

Applicant: PLASMATREAT GMBH ,  VOLKSWAGEN AG ,  SIKA TECHNOLOGY AG

Inventor： STEGE MICHAEL ,  PAHL DENNIS ,  BLANK NORMAN ,  HARTMANN UWE

IPC: C09J5/02 ,  B08B7/00

Abstract: A method for treating a bond area of a workpiece, and a method for adhesively bonding workpieces are disclosed. The method for treating a bond area of a workpiece includes cleaning the bond area, activating the bond area, coating at least a portion of the bond area with an adhesion promoter, and chemically transforming the adhesion promoter with an aftertreatment. The method for adhesively bonding workpieces includes cleaning a bond area of a first workpiece, activating the bond area, coating at least a portion of the bond area with an adhesion promoter, chemically transforming the adhesion promoter with an aftertreatment, applying an adhesive to the bond area, bringing the other workpiece into contact with the first workpiece, and curing the adhesive.

公开(公告)号：DE10223865B4

公开(公告)日：2007-08-16

申请号：DE10223865

申请日：2002-05-29

Applicant: PLASMATREAT GMBH ,  CONTITECH AG

Inventor： FOERNSEL PETER ,  HARTMANN UWE ,  BUSKE CHRISTIAN ,  HERRMANN WOLFRAM

IPC: C23C14/34 ,  C23C4/12 ,  C23C14/00 ,  C23C14/12 ,  C23C14/32