公开(公告)号：US20180114052A1

公开(公告)日：2018-04-26

申请号：US15367838

申请日：2016-12-02

Applicant: Primax Electronics Ltd.

Inventor： MAO-HSIU HSU ,  KUAN-PAO TING

IPC: G06K9/00

CPC classification number: G06K9/00087 ,  G06K9/00053

Abstract: A fingerprint identification module includes a fingerprint sensor, a coating structure and a circuit board. The fingerprint sensor is disposed on the circuit board. The coating structure is disposed on the fingerprint sensor. An insulation layer of the coating structure is disposed on the top surface of the fingerprint sensor to isolate electrostatic charges from entering the fingerprint sensor. The coating structure of the fingerprint identification module of the present invention is used for isolating electrostatic charges in replace of the metallic ring of the conventional technology. Consequently, the material cost of the metallic ring is reduced, and the thickness of the fingerprint identification module is reduced.