公开(公告)号：EP4002876A3

公开(公告)日：2022-08-24

申请号：EP21217072.4

申请日：2017-08-16

Applicant: QUALCOMM Incorporated

Inventor： SHENOY, Ravindra ,  SAUHTA, Rohit ,  MCLAREN, Elbert ,  SITACHITT, Sidney ,  KIDWELL, Donald William Jr.

IPC: H04R1/10 ,  H04R25/00

Abstract: A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.

公开(公告)号：EP3344402A1

公开(公告)日：2018-07-11

申请号：EP16775362.3

申请日：2016-09-02

Applicant: Qualcomm Incorporated

Inventor： KIDWELL, Donald, William ,  SHENOY, Ravindra ,  LASITER, Jon

IPC: B06B1/02 ,  B06B1/06

CPC classification number: B06B1/0292 ,  B06B1/0622 ,  B81B3/0021 ,  B81B3/0097 ,  B81B7/04 ,  B81C1/00134 ,  B81C1/00214 ,  H01L41/332

Abstract: Methods, systems, computer-readable media, and apparatuses for high density Micro-Electro-Mechanical Systems (MEMS) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device. The method can further comprise creating a cavity in the layer of the device using the release via as a conduit to access the desired location of the cavity, the cavity enabling movement of a transducer of the device. The method can then comprise depositing low impedance, electrically conductive material into the release via to form an electrically conductive path through the layer. Finally, the method can comprise electrically coupling the electrically conductive material to an electrode of the transducer.

公开(公告)号：EP4002876A2

公开(公告)日：2022-05-25

申请号：EP21217072.4

申请日：2017-08-16

Applicant: QUALCOMM Incorporated

Inventor： SHENOY, Ravindra ,  SAUHTA, Rohit ,  MCLAREN, Elbert ,  SITACHITT, Sidney ,  KIDWELL, Donald William Jr.

IPC: H04R1/10 ,  H04R25/00

Abstract: A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.

公开(公告)号：EP3344402B1

公开(公告)日：2019-07-24

申请号：EP16775362.3

申请日：2016-09-02

Applicant: Qualcomm Incorporated

Inventor： KIDWELL, Donald, William ,  SHENOY, Ravindra ,  LASITER, Jon

IPC: B06B1/02 ,  B06B1/06

公开(公告)号：EP3423199A1

公开(公告)日：2019-01-09

申请号：EP17702748.9

申请日：2017-01-23

Applicant: Qualcomm Incorporated

Inventor： KIDWELL JR., Donald William ,  SHENOY, Ravindra ,  LASITER, Jon

IPC: B06B1/06 ,  A61B1/04 ,  A61B8/12 ,  A61B8/00 ,  G10K11/00

公开(公告)号：EP3254309A1

公开(公告)日：2017-12-13

申请号：EP16704361.1

申请日：2016-02-03

Applicant: Qualcomm Incorporated

Inventor： KIDWELL, Donald William, Jr. ,  SHENOY, Ravindra ,  ERTURK, Mete ,  ROUHANA, Layal

IPC: H01L23/498 ,  H01F17/00 ,  H01L21/48

CPC classification number: H01L23/49838 ,  B23K26/0661 ,  H01F17/0033 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5226 ,  H01L23/5227 ,  H01L23/585 ,  H01L28/10 ,  H01L2224/16227 ,  H01L2924/15311

Abstract: An integrated device package includes a die and a package substrate. The package substrate includes at least one dielectric layer (e.g., core layer, prepeg layer), a magnetic core in the dielectric layer, a first plurality of interconnects configured to operate as a first protective ring, and a second plurality of interconnects configured to operate as a first inductor. The second plurality of interconnects is positioned in the package substrate to at least partially surround the magnetic core. At least one interconnect from the second plurality of interconnects is also part of the first plurality of interconnects. In some implementations, the first protective ring is a non-contiguous protective ring. In some implementations, the first inductor is a solenoid inductor. In some implementations, the magnetic core includes a carrier, a first magnetic layer, and a second magnetic layer.