公开(公告)号：EP4220673A2

公开(公告)日：2023-08-02

申请号：EP23162959.3

申请日：2019-06-18

Applicant: Raytheon Company

Inventor： WELLS, Derek B. ,  WALSH JR, Kenneth P. ,  RENAUD, Gregory S. ,  ZARKH, Dimitry

IPC: H01G2/04 ,  H01G2/06 ,  H01G4/38 ,  H01G11/10 ,  H01G11/82 ,  H05K7/12 ,  H01G2/10 ,  H01G4/40 ,  H01G11/80

Abstract: A mounting collar comprises a collar body comprising an opening for receiving at least a portion of an electronics component of an electronics assembly, and a radial retention component supported about an inner surface of the opening of the collar body. The radial retention component is operable to apply a radial force on the electronics component to at least partially support the electronics component. A mounting system comprises a first mounting collar for mounting a first electronics component to a support structure, and a second mounting collar for mounting a second electronics component to the support structure. The first and second mounting collars can be nested together to minimize a distance between the first and second electronics components. The first and second mounting collars can each comprise an elastomeric O-ring to reduce strain between the electronics components and the circuit board. Associated systems and methods are provided.

公开(公告)号：EP2412065B1

公开(公告)日：2016-03-02

申请号：EP10708054.1

申请日：2010-03-03

Applicant: Raytheon Company

Inventor： CHEYNE, Scott R. ,  PAQUETTE, Jeffrey ,  WALKER, John D. ,  ZARKH, Dimitry

IPC: H01R4/38 ,  H01R25/16 ,  H02G5/00 ,  H02G5/08

CPC classification number: H01R25/162 ,  H01R4/38