公开(公告)号：US20160275995A1

公开(公告)日：2016-09-22

申请号：US15168961

申请日：2016-05-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Hyung SONG ,  Kyoungsun KIM ,  Yong-Jin KIM ,  Jaejun LEE ,  Sangseok KANG ,  Jungjoon LEE

IPC: G11C5/04 ,  G06F13/40 ,  G06F13/42 ,  G06F13/10

CPC classification number: G11C5/04 ,  G06F13/102 ,  G06F13/4068 ,  G06F13/42 ,  G11C5/02 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/074 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A memory module is provided which includes a printed circuit board; first semiconductor packages provided on one surface of the printed circuit board; and second semiconductor packages provided on the other surface of the printed circuit board, the first semiconductor packages and the second semiconductor packages having semiconductor dies that form ranks. A number of the ranks formed by the first semiconductor packages being different from a number of the ranks formed by the second semiconductor packages. Semiconductor packages forming a same one of the ranks receive a chip selection signal in common and semiconductor packages forming other ranks receive a different chip selection signal.