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    REFRIGERATOR
    11.
    发明申请
    REFRIGERATOR 有权

    公开(公告)号：US20230125013A1

    公开(公告)日：2023-04-20

    申请号：US18084036

    申请日：2022-12-19

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jonghyun SON ,  Byoungmok KIM ,  Taecheol PARK ,  Jeonghyun LEE

    IPC: F25D23/02 ,  F25D23/06 ,  E05D11/00

    Abstract: A refrigerator includes: a main body including a storage area; an inner door including a door storage space, the inner door being rotatably coupled with the main body; an outer door; and a hinge rotatably coupling the outer door with the inner door, the hinge including a hinge bracket that includes a fixing plate coupled with the inner door, and a hinge shaft on which the outer door is rotatable, wherein the inner door further includes a front plate forming a front surface of the inner door, and an upper cap coupled with an upper end of the front plate, wherein the front plate includes a through hole, and wherein the hinge bracket penetrates the through hole such that the fixing plate is coupled with the upper cap.

    SEMICONDUCTOR PACKAGE
    12.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20230114274A1

    公开(公告)日：2023-04-13

    申请号：US17841155

    申请日：2022-06-15

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jeonghyun LEE ,  Hwanpil PARK ,  Jongbo SHIM ,  Eunsu LEE ,  Jangwoo LEE

    IPC: H01L23/31 ,  H01L23/498 ,  H01L49/02

    Abstract: A semiconductor package includes a redistribution structure having a first surface, an opposite second surface, and a redistribution layer between the first surface and the second surface. A semiconductor chip is on the first surface of the redistribution structure and is electrically connected to the redistribution layer. An encapsulant is on at least a portion of the semiconductor chip. A passive element is on the second surface of the redistribution structure. The passive element includes a connection surface facing the second surface, a connection terminal on the connection surface, a non-connection surface opposite to the connection surface, and a side surface extending from the connection surface to the non-connection surface. A connection bump is adjacent the passive element on the second surface and is electrically connected to the redistribution layer. A sealing material is on at least a portion of the connection surface, the non-connection surface, and the side surface of the passive element.

    SEMICONDUCTOR PACKAGE
    13.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20220384320A1

    公开(公告)日：2022-12-01

    申请号：US17542828

    申请日：2021-12-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jeonghyun LEE ,  Hwanpil PARK ,  Jongbo SHIM

    IPC: H01L23/498 ,  H01L23/31 ,  H01L23/64 ,  H01L25/18

    Abstract: A semiconductor package includes a package substrate, an interposer, a semiconductor chip between the package substrate and the interposer, a plurality of conductive connectors between the package substrate and the interposer, and a capacitor stack structure between the package substrate and the interposer, he capacitor stack structure including a first capacitor connected to the package substrate, and a second capacitor connected to the interposer.

    APPARATUS FOR SEARCHING FOR CONTENT USING IMAGE AND METHOD OF CONTROLLING SAME
    15.
    发明申请
    APPARATUS FOR SEARCHING FOR CONTENT USING IMAGE AND METHOD OF CONTROLLING SAME 审中-公开

    公开(公告)号：US20200272653A1

    公开(公告)日：2020-08-27

    申请号：US16792405

    申请日：2020-02-17

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Heuijin LEE ,  Yunhyun KIM ,  Byeongjun PARK ,  Myeongseok HYEON ,  Jeonghyun LEE

    IPC: G06F16/532 ,  G06F3/0482 ,  G06K9/62 ,  G06F3/0481 ,  G06F16/538 ,  G06N20/00

    Abstract: An electronic device includes: a display; a memory; and at least one processor, wherein the at least one processor is configured to display a first image and one or more objects on the display, acquire a second image in response to a first user input, acquire first information based on the second image and a representing type of at least one object among the one or more objects, transmit the acquired first information to a server, receive information on at least one third image related to the first information from the server, display the information on the at least one third image on the display, receive a second user input for selecting the at least one third image, and change the first image into the at least one third image and display the at least one third image based on the second user input. Other various embodiments are possible.

    REFRIGERATOR
    18.
    发明公开
    REFRIGERATOR 审中-公开

    公开(公告)号：US20230221062A1

    公开(公告)日：2023-07-13

    申请号：US18124737

    申请日：2023-03-22

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hosang PARK ,  Jeonghyun LEE

    IPC: F25D23/06

    CPC classification number: F25D23/063

    Abstract: A refrigerator including a cabinet having an outer case; a side panel including a main body; and an upper panel, wherein the side panel is configured to be detachably mounted on an outside of the outer case so that the main body forms an exterior of one side surface of the cabinet while the side panel is mounted to the outside of the outer case, and the upper panel is configured to be detachably coupled to the side panel while the side panel is mounted to the outside of the outer case so that the upper panel covers an upper portion of the cabinet.

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