公开(公告)号：EP4100507A1

公开(公告)日：2022-12-14

申请号：EP21703278.8

申请日：2021-02-04

Applicant: Sensirion AG

Inventor： HUBER, Deborah ,  STREIFF, Matthias ,  BALTENSPERGER, Oliver ,  DI GIACOMO, Raffaele

IPC: C12M1/12 ,  B01L3/00 ,  C12M1/00 ,  C12M1/26 ,  C12Q1/04 ,  C12Q1/06

公开(公告)号：EP2668131A2

公开(公告)日：2013-12-04

申请号：EP12702168.1

申请日：2012-01-26

Applicant: Sensirion AG

Inventor： GRAF, Markus ,  STREIFF, Matthias ,  HUNZIKER, Werner ,  SCHANZ, Christoph

IPC: B81B7/00

CPC classification number: G01R31/2831 ,  B81C1/00333 ,  G01N33/0027 ,  G09G1/00 ,  H01L21/00 ,  H01L24/94 ,  H01L2221/00 ,  H01L2224/13

Abstract: In a method for manufacturing a sensor chip a spacer (3) is arranged at the front side (11) of a substrate (1) at which front side (11) a sensing element (2) is arranged, too. Holes (14) are etched for building vias (15) extending through the substrate (1) between the front side (11) of the substrate (1) and its back side (12). After etching, the holes (14) are filled with conductive material to complete the vias (15). The spacer (3) provides protection to the sensing element (2) and the sensing chip throughout the manufacturing process.

公开(公告)号：EP3999836A1

公开(公告)日：2022-05-25

申请号：EP20746578.2

申请日：2020-07-19

Applicant: Sensirion AG

Inventor： DI GIACOMO, Raffaele ,  STREIFF, Matthias ,  MERZ, Michael ,  MOELLER, Nicolas

IPC: G01N21/35 ,  G01N33/18 ,  G01N21/33 ,  G01N21/03

公开(公告)号：EP3767276A1

公开(公告)日：2021-01-20

申请号：EP19187391.8

申请日：2019-07-19

Applicant: Sensirion AG

Inventor： DI GIACOMO, Raffaele ,  STREIFF, Matthias

IPC: G01N21/35 ,  G01N33/18

Abstract: The present invention relates to a sensor (1) for sensing organic carbon in a liquid (L), comprising: a container (2) having an interior space (20) for receiving the liquid (L), a photodetector (3), and a light source (4) configured to emit ultraviolet light (5) so that the ultraviolet light (5) travels along an optical path (P) through liquid (L) residing in the interior space (20) and is absorbable by carbon bonds of organic molecules in the liquid (L). According to the present invention, the photodetector (3) is configured to detect light in the visible or infrared spectrum, and the sensor (1) comprises a down conversion material portion (22; 22a) arranged in the optical path, wherein the down conversion material portion (22; 22a) is configured to receive incoming ultraviolet light (5) emitted by the light source (4) and to down convert received ultraviolet light (5) and to emit said down converted light (50) in the visible or infrared spectrum so that emitted down converted light (50) impinges on the photodetector (3).

公开(公告)号：EP2668130A1

公开(公告)日：2013-12-04

申请号：EP12702167.3

申请日：2012-01-26

Applicant: Sensirion AG

Inventor： GRAF, Markus ,  STREIFF, Matthias ,  HUNZIKER, Werner

IPC: B81B7/00

CPC classification number: G01R31/2831 ,  B81C1/00333 ,  G01N33/0027 ,  G09G1/00 ,  H01L21/00 ,  H01L24/94 ,  H01L2221/00 ,  H01L2224/13

Abstract: In a method for manufacturing a sensor chip a spacer (3) is arranged at the front side (11) of a substrate (1) at which front side (11) a sensing element (2) is arranged, too. Holes (14) are etched for building vias (15) extending through the substrate (1) between the front side (11) of the substrate (1) and its back side (12). After etching, the holes (14) are filled with conductive material to complete the vias (15). The spacer (3) provides protection to the sensing element (2) and the sensing chip throughout the manufacturing process.