公开(公告)号：EP2837026A4

公开(公告)日：2016-01-20

申请号：EP13775666

申请日：2013-04-15

Applicant: SILEX MICROSYSTEMS AB

Inventor： EBEFORS THORBJÖRN ,  PERTTU DANIEL

IPC: H01L23/32 ,  H01L23/498 ,  H01L23/52 ,  H01L23/538

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L23/147 ,  H01L23/3142 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/1461 ,  H01L2924/00

Abstract: The present interposer makes it possible to tailor the coefficient of thermal expansion of the interposer to match components to be attached thereto within very wide ranges. The semiconductor interposer, includes a substrate of a semiconductor material having a first side and an opposite second side. There is at least one conductive wafer-through via including metal. At least one recess is provided in the first side of the substrate and in the semiconductor material of the substrate, the recess being filled with metal and connected with the wafer-through via providing a routing structure. The exposed surfaces of the metal-filled via and metal-filled recess are essentially flush with the substrate surface on the first side of the substrate. The wafer-through via includes a narrow part and a wider part, and contact elements are provided on the routing structure having an aspect ratio, height:diameter,